Optical in-plane strain field sensor

2002 ◽  
Vol 41 (7) ◽  
pp. 1323 ◽  
Author(s):  
Per Synnergren ◽  
Mikael Sjödahl
1989 ◽  
Vol 160 ◽  
Author(s):  
A.P. Jardine ◽  
M. Dudley ◽  
G. Tolis ◽  
G-D. Yao ◽  
S.M. Durbin

AbstractSi(100) single crystals containing circular gratings etched into the surface using reactive ion etching were analysed using both monochromatic and white beam reflection X-ray topography. Some features of observed X-ray topographic contrast associated with the gratings were modelled using a diffracting zone model, based on a simple radial in-plane strain field. Reasonable agreement was obtained between this model and observations.


2007 ◽  
Vol 344 ◽  
pp. 135-142 ◽  
Author(s):  
Paulo Flores ◽  
Félix Bonnet ◽  
Anne Marie Habraken

This article shows the influence of a plane strain test specimen geometry on the measurable strain field and the influence of free edge effects over the stress computation. The experimental strain field distribution is measured over the whole deformable zone of a plane strain test specimen by an optical strain gauge. The chosen material is the DC06 IF steel of 0.8 mm thickness. The stress field is computed for several geometries at different strain levels by a Finite Element (FE) commercial code (Samcef ®). The results show that the stress field is sensitive to the specimen’s geometry and also to the tested material (strain field behavior is independent of material) and, based on results, an optimal specimen geometry is proposed in order to minimized the stress computation error.


1995 ◽  
Vol 378 ◽  
Author(s):  
B. B. Sharma ◽  
S. R. Gupta ◽  
R. K. Sharma ◽  
V. Kumar ◽  
U. Tiwari ◽  
...  

AbstractThe lattice deformation caused by 100 MeV Ti7+ ion irradiation in Si (100) has been studied using X-ray topographic techniques. An important finding is the appearance of a strain field perpendicular to the ion beam direction in the irradiated region well separated from the projected range of implanted ions. This in-plane strain extends in the bulk of the sample and is not merely confined to the surface. The implanted region has been found to experience an out of plane strain which is expected to be tensile in nature.


1992 ◽  
Vol 280 ◽  
Author(s):  
L. J. Martinez-Miranda ◽  
J. J. Santiago-Aviles ◽  
Raul Perez-Sandoz ◽  
Randolph Carolissen ◽  
H. H. Weitering ◽  
...  

ABSTRACTWe have performed high resolution x-ray diffraction measurements of the strain field in UHV deposited Ag(111) films on a 7×7 reconstructed Si(111) surfaces shows a faulted epitaxial layer with a 0.4% out-of-plane strain, and a -1% in-plane strain. The strain field anisotropy is similar to that observed on epitaxial YSi2-x on Si(111), and is an unexpected result for the present system, due to the lack of a lattice match between the silver and silicon unit cells. The out-of-plane diffraction peaks have an angular distribution of 1.23°, full width at half maximum (FWHM), as determined from rocking curve measurements.


Author(s):  
S. Johansson ◽  
J. Engqvist ◽  
J. Tryding ◽  
S. A. Hall

Abstract Background Experimental analyses of the 3D strain field evolution during loading allows for better understanding of deformation and failure mechanisms at the meso- and microscale in different materials. In order to understand the auxetic behaviour and delamination process in paperboard materials during tensile deformation, it is essential to study the out-of-plane component of the strain tensor that is, in contrast to previous 2D studies, only achievable in 3D. Objective The main objective of this study is to obtain a better understanding of the influence of different out-of-plane structures and in-plane material directions on the deformation and failure mechanisms at the meso- and microscale in paperboard samples. Methods X-ray tomography imaging during in-situ uniaxial tensile testing and Digital Volume Correlation analysis was performed to investigate the 3D strain field evolution and microscale mechanical behaviour in two different types of commercial paperboards and in two material directions. The evolution of sample properties such as the spatial variation in sample thickness, solid fraction and fibre orientation distribution were also obtained from the images. A comprehensive analysis of the full strain tensor in paperboards is lacking in previous research, and the influence of material directions and out-of-plane structures on 3D strain field patterns as well as the spatial and temporal quantification of the auxetic behaviour in paperboard are novel contributions. Results The results show that volumetric and deviatoric strain, dominated by the out-of-plane normal strain component of the strain tensor, localize in the out-of-plane centre already in the initial linear stress-strain regime. In-plane strain field patterns differ between samples loaded in the Machine Direction (MD) and Cross Direction (CD); in MD, strain localizes in a more well-defined zone close to the notches and the failure occurs abruptly at peak load, resulting in angular fracture paths extending through the stiffer surface planes of the samples. In CD, strain localizes in more horizontal and continuous bands between the notches and at peak load, fractures are not clearly visible at the surfaces of CD-tested samples that appear to fail internally through more well-distributed delamination. Conclusions In-plane strain localization preceded a local increase of sample thickness, i.e. the initiation of the delamination process, and at peak load, a dramatic increase in average sample thickening occurred. Different in-plane material directions affected the angles and continuity of the in-plane strain patterns as well as the sample and fracture properties at failure, while the out-of-plane structure affected how the strain fields distributed within the samples.


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