ABSTRACTWe measure the stress transients resulting from pulsed excimer laser irradiation of polyimide at 351, 308, 248 and 193 nm, using thin (9 μm) piezoelectric PVDF (polyvinylidene fluoride) films. We find that fluences between 3·10−3 and 102 J/cm2 generate peak stresses between 104 and 109 Pa. Further, the results show three ranges of fluence where different physical mechanisms mediate the stress generation. In the lowest range of fluence, subsurface thermal decomposition (for λ = 351 and 308 nm) and photodecomposition (for λ = 248 and 193 nm) govern the generation of the observed stresses. At higher fluences we identify two regimes, independent of laser wavelength, where the gas dynamic expansion of the ablation products and plasma formation and expansion, are responsible for the generated stresses.
Matrix Isolation Study of the 193 nm Excimer Laser Photochemistry of Hexafluorobenzene