Past and Next Generation Semiconductor DFB lasers and The Beginnings of Optoelectronic Integrated CIrcuits (OEICs)

2012 ◽  
Author(s):  
Amnon Yariv
Keyword(s):  
Integrated Circuits ◽  
Next Generation ◽  
Optoelectronic Integrated Circuits

Scanned tip measurement of deep vertical facets on a flat surface: Measuring roughness on gaas laser waveguide mirrors

1993 ◽  
Vol 51 ◽  
pp. 532-533
Author(s):  
Chang Shen ◽  
Phil Fraundorf ◽  
Robert W. Harrick
Keyword(s):  
Integrated Circuits ◽  
Flat Surface ◽  
Scanning Force Microscopy ◽  
Scanning Tunneling ◽  
Tunneling Microscopy ◽  
Force Microscopy ◽  
Optoelectronic Integrated Circuits ◽  
Laser Waveguide ◽  
Scanning Force ◽  
Gaas Laser

Monolithic integration of optoelectronic integrated circuits (OEIC) requires high quantity etched laser facets which prevent the developing of more-highly-integrated OEIC's. The causes of facet roughness are not well understood, and improvement of facet quality is hampered by the difficulty in measuring the surface roughness. There are several approaches to examining facet roughness qualitatively, such as scanning force microscopy (SFM), scanning tunneling microscopy (STM) and scanning electron microscopy (SEM). The challenge here is to allow more straightforward monitoring of deep vertical etched facets, without the need to cleave out test samples. In this presentation, we show air based STM and SFM images of vertical dry-etched laser facets, and discuss the image acquisition and roughness measurement processes. Our technique does not require precision cleaving. We use a traditional tip instead of the T shape tip used elsewhere to preventing “shower curtain” profiling of the sidewall. We tilt the sample about 30 to 50 degrees to avoid the curtain effect.

Complementary transistor technology for use in optoelectronic integrated circuits

1993 ◽  
Vol 140 (4) ◽  
pp. 279
Author(s):  
P.A. Kiely ◽  
G.W. Taylor ◽  
D.P. Docter ◽  
P.A. Evaldsson ◽  
T.A. Vang ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Optoelectronic Integrated Circuits

scholarly journals In-Plane Detection of Guided Surface Plasmons for High-Speed Optoelectronic Integrated Circuits

2017 ◽  
Vol 3 (1) ◽  
pp. 1700196 ◽  
Author(s):  
Evgeniy Panchenko ◽  
Jasper J. Cadusch ◽  
Ori Avayu ◽  
Tal Ellenbogen ◽  
Timothy D. James ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Surface Plasmons ◽  
High Speed ◽  
Optoelectronic Integrated Circuits

scholarly journals Transition technologies towards 6G networks

2021 ◽  
Vol 2021 (1) ◽  
Author(s):  
Thiago R. Raddo ◽  
Simon Rommel ◽  
Bruno Cimoli ◽  
Chris Vagionas ◽  
Diego Perez-Galacho ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Mobile Networks ◽  
Multiple Input Multiple Output ◽  
Mobile Systems ◽  
60 Ghz ◽  
Next Generation ◽  
Space Optics ◽  
V Band ◽  
Radio Access ◽  
Next Generation Mobile Networks

AbstractThe sixth generation (6G) mobile systems will create new markets, services, and industries making possible a plethora of new opportunities and solutions. Commercially successful rollouts will involve scaling enabling technologies, such as cloud radio access networks, virtualization, and artificial intelligence. This paper addresses the principal technologies in the transition towards next generation mobile networks. The convergence of 6G key-performance indicators along with evaluation methodologies and use cases are also addressed. Free-space optics, Terahertz systems, photonic integrated circuits, softwarization, massive multiple-input multiple-output signaling, and multi-core fibers, are among the technologies identified and discussed. Finally, some of these technologies are showcased in an experimental demonstration of a mobile fronthaul system based on millimeter 5G NR OFDM signaling compliant with 3GPP Rel. 15. The signals are generated by a bespoke 5G baseband unit and transmitted through both a 10 km prototype multi-core fiber and 4 m wireless V-band link using a pair of directional 60 GHz antennas with 10° beamwidth. Results shown that the 5G and beyond fronthaul system can successfully transmit signals with both wide bandwidth (up to 800 MHz) and fully centralized signal processing. As a result, this system can support large capacity and accommodate several simultaneous users as a key candidate for next generation mobile networks. Thus, these technologies will be needed for fully integrated, heterogeneous solutions to benefit from hardware commoditization and softwarization. They will ensure the ultimate user experience, while also anticipating the quality-of-service demands that future applications and services will put on 6G networks.

Photonic and Optoelectronic Integrated Circuits

1993 ◽  
pp. 530-546
Author(s):  
Govind P. Agrawal ◽  
Niloy K. Dutta
Keyword(s):  
Integrated Circuits ◽  
Optoelectronic Integrated Circuits
Sign in / Sign up

Export Citation Format

Share Document