Perfectly vertical surface grating couplers using subwavelength engineering for increased feature sizes

2020 ◽  
Vol 45 (13) ◽  
pp. 3701 ◽  
Author(s):  
Mohsen Kamandar Dezfouli ◽  
Yuri Grinberg ◽  
Daniele Melati ◽  
Pavel Cheben ◽  
Jens H. Schmid ◽  
...  
Author(s):  
Mohsen Kamandar Dezfouli ◽  
Yuri Grinberg ◽  
Daniele Melati ◽  
Jens H. Schmid ◽  
Pavel Cheben ◽  
...  

2021 ◽  
pp. 2000542
Author(s):  
Alejandro Sánchez‐Postigo ◽  
Robert Halir ◽  
J. Gonzalo Wangüemert‐Pérez ◽  
Alejandro Ortega‐Moñux ◽  
Shurui Wang ◽  
...  

Author(s):  
Daniel Benedikovic ◽  
Pavel Cheben ◽  
Jens H. Schmid ◽  
Dan-Xia Xu ◽  
Shurui Wang ◽  
...  

2018 ◽  
Vol 8 (7) ◽  
pp. 1142 ◽  
Author(s):  
Siddharth Nambiar ◽  
Purnima Sethi ◽  
Shankar Selvaraja

Fiber to chip coupling is a critical aspect of any integrated photonic circuit. In terms of ease of fabrication as well as wafer-scale testability, surface grating couplers are by far the most preferred scheme of the coupling to integrated circuits. In the past decade, considerable effort has been made for designing efficient grating couplers on Silicon-on-Insulator (SOI) and other allied photonic platforms. Highly efficient grating couplers with sub-dB coupling performance have now been demonstrated. In this article, we review the recent advances made to develop grating coupler designs for a variety of applications on SOI platform. We begin with a basic overview of design methodology involving both shallow etched gratings and the emerging field of subwavelength gratings. The feasibility of reducing footprint by way of incorporating compact tapers is also explored. We also discuss novel grating designs like polarization diversity as well as dual band couplers. Lastly, a brief description of various packaging and wafer-scale testing schemes available for fiber-chip couplers is elaborated.


2008 ◽  
Vol 16 (1) ◽  
pp. 328 ◽  
Author(s):  
Guillaume Maire ◽  
Laurent Vivien ◽  
Guillaume Sattler ◽  
Andrzej Kazmierczak ◽  
Benito Sanchez ◽  
...  

Author(s):  
George C. Ruben

Single molecule resolution in electron beam sensitive, uncoated, noncrystalline materials has been impossible except in thin Pt-C replicas ≤ 150Å) which are resistant to the electron beam destruction. Previously the granularity of metal film replicas limited their resolution to ≥ 20Å. This paper demonstrates that Pt-C film granularity and resolution are a function of the method of replication and other controllable factors. Low angle 20° rotary , 45° unidirectional and vertical 9.7±1 Å Pt-C films deposited on mica under the same conditions were compared in Fig. 1. Vertical replication had a 5A granularity (Fig. 1c), the highest resolution (table), and coated the whole surface. 45° replication had a 9Å granulartiy (Fig. 1b), a slightly poorer resolution (table) and did not coat the whole surface. 20° rotary replication was unsuitable for high resolution imaging with 20-25Å granularity (Fig. 1a) and resolution 2-3 times poorer (table). Resolution is defined here as the greatest distance for which the metal coat on two opposing faces just grow together, that is, two times the apparent film thickness on a single vertical surface.


2017 ◽  
Vol 20 (10) ◽  
pp. 865-879
Author(s):  
S.V.S.S.N.V.G. Krishna Murthy ◽  
Frédéric Magoulès ◽  
B. V. Rathish Kumar ◽  
Vinay Kumar

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