Influence of aluminosilsesquioxane on epoxy resin curing process (Rapid Communication)

Polimery ◽  
2014 ◽  
Vol 59 (11/12) ◽  
pp. 855-858 ◽  
Author(s):  
Danuta Matykiewicz ◽  
Beata Dudziec ◽  
Tomasz Sterzynski
Keyword(s):  
Epoxy Resin ◽  
Curing Process ◽  
Rapid Communication ◽  
Resin Curing

Study of epoxy resin curing process by applying internal friction technique

2009 ◽  
Vol 521-522 ◽  
pp. 283-286 ◽  
Author(s):  
M. Kubisztal ◽  
G. Haneczok ◽  
A. Chrobak ◽  
A. Kubik ◽  
J. Rasek
Keyword(s):  
Internal Friction ◽  
Epoxy Resin ◽  
Curing Process ◽  
Resin Curing

Study on Epoxy Resin Curing Process Based on Frequency Dielectric Spectroscopy

2021 ◽  
Author(s):  
Yinjun Shi ◽  
Yushun Zhao ◽  
Wei Yang ◽  
Xin Chen ◽  
Yun Chen
Keyword(s):  
Epoxy Resin ◽  
Dielectric Spectroscopy ◽  
Curing Process ◽  
Resin Curing

scholarly journals Control of the epoxy resin curing process according to the free bisphenol A content by TLC

2017 ◽  
Vol 21 (2) ◽  
pp. 135-143 ◽  
Author(s):  
O. B. Rudakov ◽  
E. A. Khorokhordina ◽  
S. S. Glazkov ◽  
A. M. Khorokhordin ◽  
A. S. Gubin
Keyword(s):  
Bisphenol A ◽  
Epoxy Resin ◽  
Curing Process ◽  
Resin Curing

A dynamic DSC study of the curing process of epoxy resin

1997 ◽  
Vol 49 (1) ◽  
pp. 123-129 ◽  
Author(s):  
Susumu Tatsumiya ◽  
Katsumasa Yokokawa ◽  
Kyosuke Miki
Keyword(s):  
Epoxy Resin ◽  
Curing Process

scholarly journals A novel microwave combined ultraviolet radiator based on slotted coaxial line for epoxy resin curing

AIP Advances ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 115021
Author(s):  
Ying Wu ◽  
Tian Xie ◽  
Wei Xiao ◽  
Wen Cong Zhang ◽  
Wei Quan Ma ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Coaxial Line ◽  
Resin Curing

Epoxy resin curing reaction studied by proton multiple-quantum NMR

2015 ◽  
Vol 53 (18) ◽  
pp. 1324-1332 ◽  
Author(s):  
Mario Martin-Gallego ◽  
Antonio González-Jiménez ◽  
Raquel Verdejo ◽  
Miguel Angel Lopez-Manchado ◽  
Juan Lopez Valentin
Keyword(s):  
Epoxy Resin ◽  
Multiple Quantum ◽  
Curing Reaction ◽  
Resin Curing ◽  
Multiple Quantum Nmr

Cure Monitoring of Thermosets Using Disc Bimorph Transducers

2015 ◽  
Vol 220-221 ◽  
pp. 380-384
Author(s):  
Egidijus Dragašius ◽  
Inga Skiedraite
Keyword(s):  
Thin Layer ◽  
Epoxy Resin ◽  
Piezoelectric Transducers ◽  
Small Samples ◽  
Gel Point ◽  
Cure Monitoring ◽  
Flow Processes ◽  
Before And After ◽  
Resin Curing ◽  
Further Development

The article discusses the results of experiments on the further development of the method for monitoring the state of the small samples of resin and polymers during curing. The applied method is based on a change in the structure of oscillating transducers leading to variations in the form and/or mode of oscillation. The thin layer of epoxy resin was placed between two piezoelectric transducers in the form of piezoceramic plates. Curing epoxy resin forms a bimorph and its characteristics change along with variations in viscosity or, after the gel point, stiffness. It is possible to establish the level of epoxy resin curing by monitoring changes in the resonance parameters of bimorph elements. The main purpose of cure monitoring of small samples is to develop a new method for evaluating the parameters of resin both before and after the gel point thus taking into consideration that the use of rheological data measured with reference to small samples will be applied for designing or interpreting bulk-flow processes where epoxy may be considered a continuum.

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