scholarly journals Graphene-Based Wearable Electrochemical Glucose Biosensor: A Review

2018 ◽  
Vol 7 (3.14) ◽  
pp. 250 ◽  
Author(s):  
Siti Musliha Ajmal Mokhtar ◽  
Mastura Omar ◽  
Zahari Abu Bakar ◽  
Yusmeeraz Yusof ◽  
Zairi Ismael Rizman ◽  
...  
Keyword(s):  
Electronic Device ◽  
Fast Response ◽  
Glucose Biosensor ◽  
Key Factors ◽  
Non Invasive ◽  
Wearable Electronic Device ◽  
Recent Advancement ◽  
Wearable Electronic ◽  
Insight Into

An overview of recent advancement in wearable glucose biosensor has been reviewed. The large sensing area, superior conductivity and high tensile strength has become key factors of graphene as material for flexible and wearable electronic device. This review discusses development and challenges based on graphene and its related materials of recent electrochemical glucose biosensor towards fast response, good selectivity, superb reproducibility and outstanding flexibility. A details comparison in terms of sensitivities, low detection limits and long-term stabilities are included. This review will also provide new insight into invasive and non-invasive methods as future prospect of wearable glucose biosensor.

The pathway to the top: Key factors and influences in the development of Australian Olympic and World Championship Track and Field athletes

2017 ◽  
Vol 12 (2) ◽  
pp. 264-275 ◽  
Author(s):  
Dianne J Huxley ◽  
Donna O’Connor ◽  
Paul Larkin
Keyword(s):  
Track And Field ◽  
Growing Up ◽  
Key Factors ◽  
World Championship ◽  
Elite Level ◽  
The Many ◽  
University Degree ◽  
Track And Field Athlete ◽  
Insight Into

Given the many benefits of international sporting success, understanding the development and long-term sustainability of an elite sporting career has become an important pursuit worldwide. Despite decades of research little is known about the development of elite senior Australian Track and Field athletes, therefore this study aimed to understand the major influences contributing to their development and success. A Track and Field Athlete Development questionnaire was used to collect data from 73 Olympic and World Championship level athletes. Analysis indicated athletes progressed to the elite level via six different pathways; however, the majority follows a linear pathway from junior to elite senior athlete. Further, results demonstrated the key influencing factors during development included later specialization, involvement in other sports during adolescence and strong social support. In addition, growing up in a major city and completing a University degree were also common features. Overall the study provides an insight into the development and success of Australian Track and Field athletes who competed at the Olympic Games or World Championships between 1956 and 2013.

scholarly journals Design and Implementation of Foot-Mounted Inertial Sensor Based Wearable Electronic Device for Game Play Application

Sensors ◽  
2016 ◽  
Vol 16 (10) ◽  
pp. 1752 ◽  
Author(s):  
Qifan Zhou ◽  
Hai Zhang ◽  
Zahra Lari ◽  
Zhenbo Liu ◽  
Naser El-Sheimy
Keyword(s):  
Electronic Device ◽  
Inertial Sensor ◽  
Game Play ◽  
Design And Implementation ◽  
Wearable Electronic Device ◽  
Wearable Electronic

scholarly journals Highly flexible strain sensor based on ZnO nanowires and P(VDF-TrFE) fibers for wearable electronic device

2016 ◽  
Vol 59 (3) ◽  
pp. 173-181 ◽  
Author(s):  
Shuai Chen ◽  
Zheng Lou ◽  
Di Chen ◽  
Zhaojun Chen ◽  
Kai Jiang ◽  
...  
Keyword(s):  
Electronic Device ◽  
Strain Sensor ◽  
Zno Nanowires ◽  
Wearable Electronic Device ◽  
Wearable Electronic ◽  
Flexible Strain Sensor

scholarly journals Analytical Parameters of a Novel Glucose Biosensor Based on Grafted PFM as a Covalent Immobilization Technique

Sensors ◽  
2021 ◽  
Vol 21 (12) ◽  
pp. 4185
Author(s):  
Margalida Artigues ◽  
Joan Gilabert-Porres ◽  
Robert Texidó ◽  
Salvador Borrós ◽  
Jordi Abellà ◽  
...  
Keyword(s):  
Low Cost ◽  
Fast Response ◽  
Food Samples ◽  
Glucose Biosensor ◽  
Covalent Immobilization ◽  
Long Term Stability ◽  
Industrial Sectors ◽  
Initial Sensitivity ◽  
Enzyme Molecules

Bioanalytical methods, in particular electrochemical biosensors, are increasingly used in different industrial sectors due to their simplicity, low cost, and fast response. However, to be able to reliably use this type of device, it is necessary to undertake in-depth evaluation of their fundamental analytical parameters. In this work, analytical parameters of an amperometric biosensor based on covalent immobilization of glucose oxidase (GOx) were evaluated. GOx was immobilized using plasma-grafted pentafluorophenyl methacrylate (pgPFM) as an anchor onto a tailored HEMA-co-EGDA hydrogel that coats a titanium dioxide nanotubes array (TiO2NTAs). Finally, chitosan was used to protect the enzyme molecules. The biosensor offered outstanding analytical parameters: repeatability (RSD = 1.7%), reproducibility (RSD = 1.3%), accuracy (deviation = 4.8%), and robustness (RSD = 2.4%). In addition, the Ti/TiO2NTAs/ppHEMA-co-EGDA/pgPFM/GOx/Chitosan biosensor showed good long-term stability; after 20 days, it retained 89% of its initial sensitivity. Finally, glucose concentrations of different food samples were measured and compared using an official standard method (HPLC). Deviation was lower than 10% in all measured samples. Therefore, the developed biosensor can be considered to be a reliable analytical tool for quantification measurements.

PMV (Plating Mold Via) interconnection development in molded SiP modules

2014 ◽  
Vol 2014 (1) ◽  
pp. 000777-000782
Author(s):  
Do-Jae Yoo ◽  
Jong-In Ryu ◽  
Gyu-Hwan Oh ◽  
Yong-Choon Park ◽  
Ki-Ju Lee ◽  
...  
Keyword(s):  
Electronic Device ◽  
Smart Phone ◽  
Interfacial Strength ◽  
Test Vehicle ◽  
Soldering Process ◽  
Flip Chips ◽  
Fine Pitch ◽  
Wearable Electronic Device ◽  
Wearable Electronic ◽  
Packaging Module

Recently, there are increasing demands of a size reduction and a fine interconnection technology, especially for System-in-Package (SiP) module and Package on Package (POP) module in a smart phone and a wearable electronic device. In this study, we presented the Plating Mold Via (PMV) interconnection technology as an innovative fine pitch interconnection solution between substrate I/O pads and package I/O pads in molded System-in-Package (SiP) modules. Similar to the Through Mold Via (TMV), the laser mold via process is first performed to produce a through-via in the Epoxy Mold Compound (EMC) mold, but plating and Soldering process are used simultaneously to produce the metallurgical interconnection to embody the I/O pins of the over-molded surface. After the PMV technology is described, a study of PMV in the molded packaging module is followed. The study is conducted using a test vehicle of SiP module that contains flip chips, Quad Flat Non-leaded (QFN) packages and passives. It is focused on several interface reliability issues, including the interfacial strength of PMV to substrate metal pad as well as to the laser projected area of EMC, and the study of IMC at the plating metal and solder interfaces. The study clearly shows that the PMV technology is a promising fine pitch interconnect solution for various SiP modules.

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