PMV (Plating Mold Via) interconnection development in molded SiP modules

2014 ◽  
Vol 2014 (1) ◽  
pp. 000777-000782
Author(s):  
Do-Jae Yoo ◽  
Jong-In Ryu ◽  
Gyu-Hwan Oh ◽  
Yong-Choon Park ◽  
Ki-Ju Lee ◽  
...  
Keyword(s):  
Electronic Device ◽  
Smart Phone ◽  
Interfacial Strength ◽  
Test Vehicle ◽  
Soldering Process ◽  
Flip Chips ◽  
Fine Pitch ◽  
Wearable Electronic Device ◽  
Wearable Electronic ◽  
Packaging Module

Recently, there are increasing demands of a size reduction and a fine interconnection technology, especially for System-in-Package (SiP) module and Package on Package (POP) module in a smart phone and a wearable electronic device. In this study, we presented the Plating Mold Via (PMV) interconnection technology as an innovative fine pitch interconnection solution between substrate I/O pads and package I/O pads in molded System-in-Package (SiP) modules. Similar to the Through Mold Via (TMV), the laser mold via process is first performed to produce a through-via in the Epoxy Mold Compound (EMC) mold, but plating and Soldering process are used simultaneously to produce the metallurgical interconnection to embody the I/O pins of the over-molded surface. After the PMV technology is described, a study of PMV in the molded packaging module is followed. The study is conducted using a test vehicle of SiP module that contains flip chips, Quad Flat Non-leaded (QFN) packages and passives. It is focused on several interface reliability issues, including the interfacial strength of PMV to substrate metal pad as well as to the laser projected area of EMC, and the study of IMC at the plating metal and solder interfaces. The study clearly shows that the PMV technology is a promising fine pitch interconnect solution for various SiP modules.

scholarly journals Graphene-Based Wearable Electrochemical Glucose Biosensor: A Review

2018 ◽  
Vol 7 (3.14) ◽  
pp. 250 ◽  
Author(s):  
Siti Musliha Ajmal Mokhtar ◽  
Mastura Omar ◽  
Zahari Abu Bakar ◽  
Yusmeeraz Yusof ◽  
Zairi Ismael Rizman ◽  
...  
Keyword(s):  
Electronic Device ◽  
Fast Response ◽  
Glucose Biosensor ◽  
Key Factors ◽  
Non Invasive ◽  
Wearable Electronic Device ◽  
Recent Advancement ◽  
Wearable Electronic ◽  
Insight Into

An overview of recent advancement in wearable glucose biosensor has been reviewed. The large sensing area, superior conductivity and high tensile strength has become key factors of graphene as material for flexible and wearable electronic device. This review discusses development and challenges based on graphene and its related materials of recent electrochemical glucose biosensor towards fast response, good selectivity, superb reproducibility and outstanding flexibility. A details comparison in terms of sensitivities, low detection limits and long-term stabilities are included. This review will also provide new insight into invasive and non-invasive methods as future prospect of wearable glucose biosensor.

scholarly journals Design and Implementation of Foot-Mounted Inertial Sensor Based Wearable Electronic Device for Game Play Application

Sensors ◽  
2016 ◽  
Vol 16 (10) ◽  
pp. 1752 ◽  
Author(s):  
Qifan Zhou ◽  
Hai Zhang ◽  
Zahra Lari ◽  
Zhenbo Liu ◽  
Naser El-Sheimy
Keyword(s):  
Electronic Device ◽  
Inertial Sensor ◽  
Game Play ◽  
Design And Implementation ◽  
Wearable Electronic Device ◽  
Wearable Electronic

scholarly journals Highly flexible strain sensor based on ZnO nanowires and P(VDF-TrFE) fibers for wearable electronic device

2016 ◽  
Vol 59 (3) ◽  
pp. 173-181 ◽  
Author(s):  
Shuai Chen ◽  
Zheng Lou ◽  
Di Chen ◽  
Zhaojun Chen ◽  
Kai Jiang ◽  
...  
Keyword(s):  
Electronic Device ◽  
Strain Sensor ◽  
Zno Nanowires ◽  
Wearable Electronic Device ◽  
Wearable Electronic ◽  
Flexible Strain Sensor

Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-Package

2014 ◽  
Vol 2014 (1) ◽  
pp. 000024-000030 ◽  
Author(s):  
Rajesh Katkar ◽  
Rey Co ◽  
Wael Zohni
Keyword(s):  
Aspect Ratio ◽  
Smart Phone ◽  
Cost Effective ◽  
High Volume ◽  
Test Vehicle ◽  
Industry Standard ◽  
Fine Pitch ◽  
Vertical Interconnects ◽  
Reliability Performance ◽  
Manufacturing Readiness

Ever increasing performance demands in a rapidly evolving smart phone market have led to a need for higher density interconnections linking memory components with logic devices in a standard package on package (PoP) configuration. While existing solutions present a technological roadblock at 350–400μm PoP pitch, new Bond Via Array (BVA™) technology provides a cost effective and scalable alternative that can achieve 240μm and below pitch values while utilizing conventional wirebond package assembly processes and tools. BVA is a high density, ultra-fine pitch package-on-package (PoP) interconnect solution that enables more than 1000 high aspect ratio connections between memory and processor components in a standard outline PoP. This increase significantly improves PoP capability and correspondingly provides increased bandwidth for the next generation of mobile devices. Here we discuss the 1020 IO BVA demonstration test vehicle, associated manufacturing process details, reliability performance and bi-level socket hardware developed to test these wire bond based novel interconnects. Furthermore the overall high volume manufacturing (HVM) readiness state of this technology for PoP applications will be described. The 1020 IO BVA prototype features 5 rows of vertical interconnects at 0.24mm pitch within an industry standard 14 x14mm package footprint. Although BVA interconnects were primarily developed for PoP packages, they offer many benefits over traditional vertical interconnects and can be implemented in a variety of other applications.

Sign in / Sign up

Export Citation Format

Share Document