Alpha track registration and revelation in CR-39 using new etching method for ultratrace alpha radioactivity quantification in solution media

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Sushma S. Chavan ◽  
Amol M. Mhatre ◽  
Ashok K. Pandey ◽  
Hemlata K. Bagla

Abstract A CR-39 based method was developed for measuring the ultra-trace alpha radio activities in aqueous samples having curie levels of γ/β-radio activities. The chemical etching method was optimized to reveal the alpha tracks in CR-39. This new chemical etching method involved the use of a phase transfer catalyst tetraethylammonium bromide which reduced the track revelation induction time without deteriorating the track-etch parameters. The alpha track-etch parameters such as bulk-etch rate, track-etch rate, induction time, and the critical angle of alpha track registration were measured at 60 and 70 °C, with and without using a phase transfer catalyst in the chemical etching for the comparison and optimization. The track registration efficiency of CR-39 in the solution medium was measured using the samples having known alpha activity of mixPu, and value obtained was found to be (4.42 ± 0.12) × 10−4 cm. The registration efficiency value thus obtained was corroborated with the expected efficiency expected from the calculated range of alpha particles in the solution. This CR-39 based method was employed to quantify the alpha activity, as low as 0.2 Bq mL−1, in the aqueous radiopharmaceutical samples having the curie levels of γ/β radio activities.

Author(s):  
Jianwei Zhou ◽  
Wei Zheng ◽  
Taekoo Lee

Abstract Multi-Chip Package (MCP) decapsulation is now becoming a rising problem. Because for traditional decapsulation method, acid can’t dissolve the top silicon die to expose the bottom die surface in MCP. It makes inspecting the bottom die in MCP is difficult. In this paper, a new MCP decapsulation technology combining mechanical polishing with chemical etching is introduced. This new technology can remove the top die quickly without damaging the bottom die using KOH and Tetra-Methyl Ammonium Hydroxide (TMAH). The technology process and relative application are presented. The factors that affect the KOH and TMAH etch rate are studied. The usage difference between the two etchant is discussed.


Tetrahedron ◽  
2016 ◽  
Vol 72 (14) ◽  
pp. 1773-1781 ◽  
Author(s):  
Zujin Yang ◽  
Xia Zhang ◽  
Xingdong Yao ◽  
Yanxiong Fang ◽  
Hongyan Chen ◽  
...  

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