A test method of current leakage for dielectric paste was proposed by simulating the application processes of dielectric paste for manufacturing the dielectric layer in the multilayer thick film hybrid microcircuit. That is, by screen printing and sintering processes, the sliver conducting layer was fabricated on the surface of glass substrate, and then dielectric layer, finally the glass substrate sample with conducting layer and dielectric layer was dipped in 5 Wt% NaCl aqueous solution. The conductive line was soldered on the silver conducting layer to form the test circuit, and powered with 5 volts direct power, the current in the test circuit was taken as the current leakage of the dielectric paste. The method may be used to evaluate the current leakage of dielectric paste.
