ABSTRACT3D microstructuring of photosensitive glass is demonstrated by femtosecond (fs) laser for lab-on-a-chip manufacture. True 3D hollow microstructures embedded in the glass are fabricated by the fs laser direct write followed by heat treatment and successive wet etching. A variety of microcomponents for a lab-on-a-chip device like a microfluidics, a microvalve, a microoptics, a microlaser, etc. are fabricated by using this technique. The fs laser direct write process is also applied for selective metallization of internal walls of the hollow microstructures embedded in the glass for electric control of movement of the micromechanical components in the lab-on-a-chip device.
ABSTRACTWe present a concept for multi-material solid freeform fabrication of 2D and layered 3D heterogeneous components. This technique involves direct-write deposition of multiple, patterned powder materials followed by laser processing. The direct-write deposition system features miniature hopper-nozzles for depositing dry powdered materials by gravity or by high frequency vibration-assisted flow onto a movable substrate. A dual wavelength laser processing workstation was used to consolidate the deposited pattern to desired densities. The feasibility of this concept was proved by direct-writing and laser processing various powder material patterns.
AbstractThe interest in laser processing technology has increased significantly in recent years because of increasing demands for application-specific IC design and fabrication, yield enhancement, circuit restructuring, and prototyping; all of these benefit from an adaptive processing technique using direct energy for improvement of precision, resolution, process automation, and turnaround time. This paper reviews several laser-patterned metallization techniques developed for high-density multichip interconnection applications. Key material and process requirements for developing a viable laser-direct-write interconnect technique on polyimide are addressed.
Microfabrication with femtosecond laser processing : (A) laser ablation of ferrous alloys, (B) direct-write embedded optical waveguides and integrated optics in bulk glasses.
