scholarly journals Time-dependent deformation behavior of freestanding and SiNx-supported gold thin films investigated by bulge tests

2015 ◽  
Vol 30 (14) ◽  
pp. 2161-2169 ◽  
Author(s):  
Benoit Merle ◽  
Detlev Cassel ◽  
Mathias Göken
Keyword(s):  
Thin Films ◽  
Deformation Behavior ◽  
Time Dependent ◽  
Gold Thin Films ◽  
Supported Gold ◽  
Image Position

Abstract

Nano-Creep Test for Anatase Polycrystalline Films

2001 ◽  
Vol 695 ◽  
Author(s):  
Hironori Sugata ◽  
Shigeo Ohshio ◽  
Hidetoshi Saitoh
Keyword(s):  
Thin Films ◽  
Deformation Behavior ◽  
Good Accuracy ◽  
Time Dependent ◽  
Structural Deformation ◽  
Boundary Structure ◽  
Nanometer Scale ◽  
Polycrystalline Films ◽  
Analytical Technique ◽  
Grain Boundary Structure

ABSTRACTWe introduce an analytical technique for time-dependent deformation behavior of the polycrystalline films using a nano-indenter. This technique permits evaluation of structural deformation of the nanometer scale of the thin films. In this paper, good accuracy conditions were determined to measure deformation behavior of the polycrystalline films. The polycrystalline films of anatase were used to investigate the grain boundary structure. We prove that the analysis of time-dependent deformation behavior is effective to investigate the structure of the polycrystalline films.

Transformation and Deformation Behavior in Sputter-Deposited Ti-Ni-Cu Thin Films

1995 ◽  
Vol 05 (C8) ◽  
pp. C8-689-C8-694 ◽  
Author(s):  
T. Hashinaga ◽  
S. Miyazaki ◽  
T. Ueki ◽  
H. Horikawa
Keyword(s):  
Thin Films ◽  
Deformation Behavior ◽  
Sputter Deposited

Progressive Debonding of Multilayer Interconnect Structures

1997 ◽  
Vol 473 ◽  
Author(s):  
Michael Lane ◽  
Robert Ware ◽  
Steven Voss ◽  
Qing Ma ◽  
Harry Fujimoto ◽  
...  
Keyword(s):  
Thin Films ◽  
Crack Growth ◽  
Driving Force ◽  
Adhesion Energy ◽  
Time Dependent ◽  
Multilayer Thin Films ◽  
Processing Conditions ◽  
Interface Morphology ◽  
Entire Sample ◽  
Crack Growth Velocity

ABSTRACTProgressive (or time dependent) debonding of interfaces poses serious problems in interconnect structures involving multilayer thin films stacks. The existence of such subcriticai debonding associated with environmentally assisted crack-growth processes is examined for a TiN/SiO2 interface commonly encountered in interconnect structures. The rate of debond extension is found to be sensitive to the mechanical driving force as well as the interface morphology, chemistry, and yielding of adjacent ductile layers. In order to investigate the effect of interconnect structure, particularly the effect of an adjacent ductile Al-Cu layer, on subcriticai debonding along the TiN/SiO2 interface, a set of samples was prepared with Al-Cu layer thicknesses varying from 0.2–4.0 μm. All other processing conditions remained the same over the entire sample run. Results showed that for a given crack growth velocity, the debond driving force scaled with Al-Cu layer thickness. Normalizing the data by the critical adhesion energy allowed a universal subcriticai debond rate curve to be derived.

On the effect of precipitates on the cyclic deformation behavior of an Al–Mg–Si alloy

2017 ◽  
Vol 32 (23) ◽  
pp. 4398-4410 ◽  
Author(s):  
Haichun Jiang ◽  
Stefanie Sandlöbes ◽  
Günter Gottstein ◽  
Sandra Korte-Kerzel
Keyword(s):  
Cyclic Deformation ◽  
Deformation Behavior ◽  
Image Position

Abstract

Extended cyclic uniaxial loading of stretchable gold thin-films on elastomeric substrates

2009 ◽  
Vol 94 (7) ◽  
pp. 071902 ◽  
Author(s):  
Ingrid M. Graz ◽  
Darryl P. J. Cotton ◽  
Stéphanie P. Lacour
Keyword(s):  
Thin Films ◽  
Uniaxial Loading ◽  
Gold Thin Films

Time-Dependent Deformation Behavior of Amorphous Nitrogen-containing Carbon Films

1998 ◽  
Vol 37 (Part 1, No. 11) ◽  
pp. 6102-6106 ◽  
Author(s):  
Daisuke Tanaka ◽  
Shigeo Ohshio ◽  
Hidetoshi Saitoh
Keyword(s):  
Deformation Behavior ◽  
Carbon Films ◽  
Time Dependent
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