Comparison of ion beam and electron beam induced transport of hot charge carriers in metal-insulator-metal junctions

2011 ◽  
Vol 1354 ◽  
Author(s):  
Johannes Hopster ◽  
Detlef Diesing ◽  
Andreas Wucher ◽  
Marika Schleberger

ABSTRACTThe generation of hot charge carriers within a solid bombarded by charged particles is investigated using biased thin film metal-insulator-metal (MIM) devices. For slow, highly charged ions approaching a metal surface the main dissipation process is electronic excitation of the substrate, leading to electron emission into the vacuum and internal electron emission across the MIM junction. In order to gain a deeper understanding of the distribution and transport of the excited charge carriers leading to the measured device current, we compare ion induced and electron induced excitation processes in terms of absolute internal emission yields as well as their dependence on the applied bias voltage.

1999 ◽  
Vol 38 (Part 1, No. 12B) ◽  
pp. 7151-7154 ◽  
Author(s):  
Masayoshi Nakayama ◽  
Junichi Yanagisawa ◽  
Fujio Wakaya ◽  
Kenji Gamo

1993 ◽  
Vol 32 (Part 2, No. 11B) ◽  
pp. L1695-L1697 ◽  
Author(s):  
Toshiaki Kusunoki ◽  
Mutsumi Suzuki ◽  
Susumu Sasaki ◽  
Tomio Yaguchi ◽  
Toshiyuki Aida

2010 ◽  
Vol 81 (7) ◽  
Author(s):  
Domocos Kovacs ◽  
Artur Golczewski ◽  
Gregor Kowarik ◽  
Friedrich Aumayr ◽  
Detlef Diesing

2008 ◽  
Vol 516 (21) ◽  
pp. 7816-7821 ◽  
Author(s):  
Sheng-Yi Lee ◽  
Sheng-Chang Wang ◽  
Jen-Sue Chen ◽  
Jow-Lay Huang

2021 ◽  
Author(s):  
Kuang Shien Lee ◽  
Lai Khei Kuan

Abstract MIM (Metal-Insulator-Metal) capacitor is a capacitor fabricated between metal layers and usually in an array form. Since it is usually buried within stack of back-end metal layers, neither front side nor backside FA fault isolation techniques can easily pinpoint the defect location of a failing MIM capacitor. A preliminary fault isolation (FI) often needs to be performed by biasing the desired failing state setup to highlight the difference(s) of FI site(s) between failing unit & reference. Then, a detailed study of the CAD (Computer Aided Design) schematic and die layout focusing on the difference(s) of FI site(s) will lead to a more in-depth analyses such as Focused Ion-Beam (FIB) circuit edit, micro-probing/nano-probing, Voltage Contrast (VC) and other available FA techniques to further identify the defective MIM capacitor. Once the defective MIM capacitor was identified, FIB cross-section or delayering can be performed to inspect the physical defect on the MIM capacitor. This paper presents the FA approach and challenges in successfully finding MIM capacitor failures.


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