electron emission
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Nano Letters ◽  
2022 ◽  
Author(s):  
Fabio Medeghini ◽  
Jacob Pettine ◽  
Sean M. Meyer ◽  
Catherine J. Murphy ◽  
David J. Nesbitt

2022 ◽  
Vol 5 (1) ◽  
Author(s):  
Arturo Sopena ◽  
Alicia Palacios ◽  
Fabrice Catoire ◽  
Henri Bachau ◽  
Fernando Martín

Author(s):  
Rupali Paul ◽  
Gunjan Sharma ◽  
Kishor Deka ◽  
Sayan Adhikari ◽  
Rakesh Moulick ◽  
...  

Abstract The role of hot electrons in the charging of dust grains is investigated in a two-temperature hydrogen plasma. A variety of dust particles are introduced into the system and secondary electron emission (SEE) from each of the dust grains has been reported. A cylindrical Langmuir probe is used for determining the plasma parameters and a Faraday cup is connected to an electrometer in order to measure the dust current. The electrometer readings confirm the electron emission from the dust and SEE is observed from the tungsten dust in a low-pressure experimental plasma device for the first time.


Author(s):  
Haibao Mu ◽  
Yitong Yao ◽  
Shu Zhang ◽  
Guangyu Sun ◽  
Bao-Hong Guo ◽  
...  

Abstract Micro and nanoscale 3D printing technic is applied to fabricate functional insulating material which mitigates surface discharge in vacuum based on the microscopic electron multipactor suppression. The proposed alumina ceramic insulator design consists surface-embedded thin metal wires which introduce a local gradient of secondary electron emission yield, such that the trajectories of multipactor electrons are distorted by accumulated negative surface charges and the secondary electron emission avalanche across the insulator surface is intermitted. Considerable increases of surface flashover threshold and surface charging reduction are verified by experiment. Also, additional efforts are made to determine the optimal size and spatial distribution of the metal wire. A convex-shape flashover voltage trace is observed when increasing the wire width, suggesting a trade-off between the multipactor mitigation and the insulator strength. Wire position between the adjacency of cathode triple junction and middle of the insulator is proved to be favorable for flashover mitigation. The physical details of surface flashover mitigation by the proposed insulator design are revealed by an ab initio particle-in-cell (PIC) simulation code, corroborating the experiment from microscopic aspect.


2021 ◽  
Author(s):  
Jianliang Qiao ◽  
Yuan Cao ◽  
Shengzhao Wang ◽  
Yunfeng Wang

Nanomaterials ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 3350
Author(s):  
Ivan Bizyaev ◽  
Pavel Gabdullin ◽  
Maxim Chumak ◽  
Vladislav Babyuk ◽  
Sergey Davydov ◽  
...  

Herein, we describe a study of the phenomenon of field-induced electron emission from thin films deposited on flat Si substrates. Films of Mo with an effective thickness of 6–10 nm showed room-temperature low-field emissivity; a 100 nA current was extracted at macroscopic field magnitudes as low as 1.4–3.7 V/μm. This result was achieved after formation treatment of the samples by combined action of elevated temperatures (100–600 °C) and the electric field. Morphology of the films was assessed by AFM, SEM, and STM/STS methods before and after the emission tests. The images showed that forming treatment and emission experiments resulted in the appearance of numerous defects at the initially continuous and smooth films; in some regions, the Mo layer was found to consist of separate nanosized islets. Film structure reconstruction (dewetting) was apparently induced by emission-related factors, such as local heating and/or ion irradiation. These results were compared with our previous data obtained in experiments with carbon islet films of similar average thickness deposited onto identical substrates. On this basis, we suggest a novel model of emission mechanism that might be common for thin films of carbon and refractory metals. The model combines elements of the well-known patch field, multiple barriers, and thermoelectric models of low-macroscopic-field electron emission from electrically nanostructured heterogeneous materials.


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