Size Effect in the Shear-Coupled Migration of Grain Boundaries Pinned by Triple Junctions
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AbstractThis paper presents molecular dynamics simulations of shear-coupled migration of tilt boundaries pinned by triple junctions in a simple model structure of columnar grains of different sizes. Simulations are for copper at 300 K. The phenomenon is of interest as a possible explanation of the Hall-Petch relationship breakdown in nano-grained polycrystals deformed at high or moderate strain rate and low-temperature.
2019 ◽
Vol 58
(51)
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pp. 23014-23024
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2018 ◽
Vol 25
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pp. 1992-1998
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1999 ◽
Vol 103
(47)
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pp. 9512-9520
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