Crystallization Kinetics of Hydrogenated Amorphous Silicon During Pulsed Excimer Laser Annealing

1992 ◽  
Vol 258 ◽  
Author(s):  
S. E. Ready ◽  
J. H. Roh ◽  
J. B. Boyce ◽  
G. B. Anderson

ABSTRACTExplosive crystallization of amorphous silicon (a-Si) during pulsed laser annealing occurs at an intermediate laser energy fluence above the threshold for surface melting. Mediated by a molten silicon layer which is undercooled with respect to crystalline silicon and above the melting point of a-Si, the crystallization interface drives down into the sample, sustaining itself due to the difference in the latent heats of the crystalline and amorphous silicon. Explosive crystallization has been the subject of numerous studies which have for the most part been restricted to ion implanted amorphized layers in silicon bulk samples. In this study we examine the crystallization kinetics of vapor deposited thin films of hydrogenated a-Si for films of differing hydrogen content and substrate temperature. We reevaluate current models of interface and nucleation kinetics qualitatively in light of these results. The fundamental physical mechanisms in these non-equilibrium phase transitions during pulsed laser annealing are discussed.

1987 ◽  
Vol 50 (9) ◽  
pp. 507-509 ◽  
Author(s):  
J. J. P. Bruines ◽  
R. P. M. van Hal ◽  
B. H. Koek ◽  
M. P. A. Viegers ◽  
H. M. J. Boots

1981 ◽  
Vol 4 ◽  
Author(s):  
John T. Schott

ABSTRACTLaser-annealing phenomena have typically been divided into two distinct realms. Pulsed lasers involved very short anneal times and small deposited energy densities. Slowly scanned cw lasers involved intermediate times (ms range) and larger energy densities. Repetitively scanned electron beams have extended the range of anneal time and energy density toward conventional thermal processing. This paper examines the regime between pulsed laser annealing and conventional cw laser annealing. By greatly increasing the scan speed of the laser, annealing times and deposited energy densities are reduced and approach those of pulsed laser annealing. Applications are discussed in the areas of silicon-on-insulator recrystallization, low resistivity poly, vertical integration, local lateral seeding, explosive crystallization, and line-source simulation.


Nature ◽  
1985 ◽  
Vol 313 (5998) ◽  
pp. 100-100 ◽  
Author(s):  
Ian W. Boyd ◽  
Steven C. Moss

1983 ◽  
Vol 23 ◽  
Author(s):  
Y. H. Chen ◽  
S. A. Lyon

ABSTRACTUsing a visible probe laser (632.8 nm) we have directly observed motion of the melt front in silicon-on-sapphire during pulsed laser annealing. The average penetration and regrowth velocities have been determined to be 13 and 6.5 m/sec. respectively. These values are in agreement with recent conductivity measurements and heat flow calculations. In addition, the data demonstrate that the high-reflectivity phase can penetrate at least .5 um (Si thickness) and requires a significant amount of the time to do so. These results are further evidence that the high–reflectivity phase is molten silicon.


2003 ◽  
Vol 799 ◽  
Author(s):  
Keiichi Tsuchiya ◽  
Noboru Miura ◽  
Hironaga Matsumoto ◽  
Ryotaro Nakano ◽  
Shin-ichiro Uekusa

ABSTRACTβ-phase iron disilicide (β-FeSi2) was obtained on n-type silicon (111) substrate by using excimer laser annealing (ELA). β-phase crystal which have good electrical properties was grown within a narrow annealing condition such as energy density. All samples were annealed by excimer laser show n-type characteristic. Graded junction was formed in FeSi2/Si hetero diode.


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