scholarly journals Carbon, Nitrogen, and Oxygen Ion Implantation of Stainless Steel

1995 ◽  
Vol 396 ◽  
Author(s):  
D.J. Rej ◽  
N.V. Gavrilov ◽  
D. Emlin ◽  
I. Henins ◽  
K. Kern ◽  
...  

AbstractIon implantation experiments of C, N and O into stainless steel have been performed with beam-line and plasma source ion implantation methods. Acceleration voltages are varied between 27 and 50 kV, with pulsed ion current densities between 1 and 10 mA/cm2. Implanted doses range from 0.5 to 3×1018cm-2, while workpiece temperatures are maintained between 25 and 800°C. The implant concentration profiles, microstructure and surface mechanical properties of the implanted materials are reported.

Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.


1992 ◽  
Author(s):  
JOHN CONRAD ◽  
M. ABUZRIBA ◽  
J. BLANCHARD ◽  
D. CHAPEK ◽  
A. CHEN ◽  
...  

1997 ◽  
Vol 93 (2-3) ◽  
pp. 247-253 ◽  
Author(s):  
R.J. Matyi ◽  
D.L. Chapek ◽  
D.P. Brunco ◽  
S.B. Felch ◽  
B.S. Lee

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