Peel Strength in the Cu/Cr/Polyimide System

1996 ◽  
Vol 436 ◽  
Author(s):  
I. S. Park ◽  
Jin Yu ◽  
Y. B. Park
Keyword(s):  
Plastic Deformation ◽  
Metal Layer ◽  
Peel Test ◽  
Peel Strength ◽  
Metal Films ◽  
X Ray ◽  
Pretreatment Condition ◽  
Beam Analysis ◽  
Pretreatment Conditions ◽  
Elastoplastic Beam

AbstractIn order to understand the effects of plastic deformation and the interfacial fracture energy on the peel strength, thickness of the metal layer and the pretreatment conditions of polyimide were varied in the Cu/Cr/polyimide system. The work expenditure during the peel test was estimated using the stress strain curves of metal films, X-ray measurements of the plastic strain in the peeled films, and the elastoplastic beam analysis. Results indicate that the peel strength is strongly affected by the film thickness and the pretreatment condition in a synergistic way, and that the measured peel strength is more a measure of the plastic deformation during the peel test than a measure of the true interfacial energy.

Estimation of the Interfacial Fracture Energy of Metal/Polymer System in Microelectronic Packaging

2001 ◽  
Vol 682 ◽  
Author(s):  
J.Y. Song ◽  
Jin Yu
Keyword(s):  
Fracture Energy ◽  
Power Density ◽  
Polymer System ◽  
Peel Test ◽  
Interfacial Fracture ◽  
Peel Strength ◽  
Rf Plasma ◽  
Plasma Power ◽  
Interfacial Fracture Energy ◽  
Elastoplastic Beam

ABSTRACTThe interfacial fracture energies of flexible Cu/Cr/Polyimide system were deduced from the T peel test. The T peel strength and peel angle were strongly affected by the metal thickness and the biased rf plasma power density of the polyimide pretreatment. The plastic bending works of metal and polyimide dissipated during peel test were estimated from the direct measurement of maximum root curvatures using the elastoplastic beam analysis. The interfacial fracture energy between Cr and polyimide increased with the rf plasma power density and saturated, but was pretty much independent of the metal film thickness and the peel angle.

An Adhesion Study of Copper and Chromium Films to Polyimide

1993 ◽  
Vol 323 ◽  
Author(s):  
T. G. Chung ◽  
Jin Yu ◽  
Y.-H. Kim ◽  
E. C. Ahn ◽  
I. S. Park
Keyword(s):  
Adhesion Strength ◽  
Polymer Surface ◽  
Peel Test ◽  
Peel Strength ◽  
Metal Strip ◽  
Rf Plasma ◽  
X Ray Diffraction ◽  
X Ray ◽  
High Adhesion ◽  
Chromium Films

AbstractAdhesion of Cu and Cr to polyimide was studied by 90° peel test, AES, and X-ray diffraction. The two necessary conditions of the high adhesion strength were the presence of Cr interlayer and the preactivation of the polymer surface by RF plasma treatment. The Cr is thought to react with activated polyimide to form carbide-like bonds which enhance the adhesion strength drastically. Correlations between the peel strength and C260/Cr527 Auger PHR from the peeled metal strip were good. Qualitatively, the peel strength is related to the amount of plastic deformation done on the metal strip during peeling.

Adhesion of Copper to Polytetrafluoroethylene

1989 ◽  
Vol 153 ◽  
Author(s):  
Yong-Kil Kim ◽  
Chin-An Chang ◽  
A.G. Schrott ◽  
J. Andreshak ◽  
M. Cali
Keyword(s):  
Photoelectron Spectroscopy ◽  
Ion Beam ◽  
Peel Test ◽  
Peel Strength ◽  
Interface Morphology ◽  
Ion Beam Sputtering ◽  
Polymer Substrates ◽  
X Ray ◽  
Beam Sputtering ◽  
Scanning Electron

AbstractAn enhancement of the adhesion between copper and polytetrafluoroethylene (PTFE) has been studied. Thin-films of copper were electron-beam deposited on the surface of the polymer substrates. Peel test measurements showed that, without any treatment of the substrates, the adhesion was poor with a peel strength of 1-2 g/mm. A pronounced enhancement of the adhesion has been obtained when the fluorocarbon substrates were treated by either an ultraviolet (UV) irradiation, an ion-beam presputtering prior to the metal deposition, or heat treatments after the deposition. Among the treatments employed, the ion-beam sputtering was the most effective in improving the adhesion. The roles of the treatments and possible reasons for the enhanced adhesion are discussed in conjunction with the studies of interface morphology and chemistry using Scanning Electron Microscopy, Rutherford Backscattering Spectroscopy, and X-ray Photoelectron Spectroscopy.

Adhesion of Copper to Polytetrafluoroethylene

1989 ◽  
Vol 154 ◽  
Author(s):  
Yong-Kil Kim ◽  
Chin-An Chang ◽  
A. G. Schrott ◽  
J. Andreshak ◽  
M. Cali
Keyword(s):  
Photoelectron Spectroscopy ◽  
Ion Beam ◽  
Peel Test ◽  
Peel Strength ◽  
Interface Morphology ◽  
Ion Beam Sputtering ◽  
Polymer Substrates ◽  
X Ray ◽  
Beam Sputtering ◽  
Scanning Electron

AbstractAn enhancement of the adhesion between copper and polytetrafluoroethylene (PTFE) has been studied. Thin-films of copper were electron-beam deposited on the surface of the polymer substrates. Peel test measurements showed that, without any treatment of the substrates, the adhesion was poor with a peel strength of 1–2 g/mm. A pronounced enhancement of the adhesion has been obtained when the fluorocarbon substrates were treated by either an ultraviolet (UV) irradiation, an ion-beam presputtering prior to the metal deposition, or heat treatments after the deposition. Among the treatments employed, the ion-beam sputtering was the most effective in improving the adhesion. The roles of the treatments and possible reasons for the enhanced adhesion are discussed in conjunction with the studies of interface morphology and chemistry using Scanning Electron Microscopy, Rutherford Backscattering Spectroscopy, and X-ray Photoelectron Spectroscopy.

Characterization of TiN Diffusion Barrier for Submicron Technology

1992 ◽  
Vol 260 ◽  
Author(s):  
G. A. Dixit ◽  
F. S. Chen ◽  
H. Zhang ◽  
G. D. Yao ◽  
C. C. Wei ◽  
...  
Keyword(s):  
Electron Spectroscopy ◽  
Metal Layer ◽  
Metal Films ◽  
X Ray Diffraction ◽  
Tin Films ◽  
X Ray ◽  
Barrier Metal ◽  
Tin Diffusion Barrier ◽  
Post Deposition

AbstractThe electrical properties and structure of reactively sputtered titanium nitride barrier metal films have been characterized. Junction leakages and yields for different post deposition treatments of the barrier metal layer are reported. TEM, x-ray diffraction and Auger electron spectroscopy have been used for the physical characterization of the TiN films.

X-ray detection of tensile plastic deformation in tough pitch copper.

1991 ◽  
Vol 3 (4) ◽  
pp. 179-183
Author(s):  
Kohji IDEMITSU ◽  
Takashi ENDOH ◽  
Mamoru KAWAKAMI ◽  
Makaki KOGA
Keyword(s):  
Plastic Deformation ◽  
X Ray

scholarly journals An Assessment of Surface Treatments for Adhesion of Polyimide Thin Films

Polymers ◽  
2021 ◽  
Vol 13 (12) ◽  
pp. 1955
Author(s):  
Marco Cen-Puc ◽  
Andreas Schander ◽  
Minerva G. Vargas Gleason ◽  
Walter Lang
Keyword(s):  
Flexible Electronics ◽  
Oxygen Plasma ◽  
Reactive Ion Etching ◽  
Peel Test ◽  
Scratch Test ◽  
Peel Strength ◽  
Surface Treatments ◽  
Oxygen Plasma Treatment ◽  
Polyimide Films ◽  
Ion Etching

Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.

Influence of Severe Plastic Deformation on Physicomechanical Properties of Ti-40 mas % Nb Alloy

2016 ◽  
Vol 685 ◽  
pp. 525-529
Author(s):  
Zhanna G. Kovalevskaya ◽  
Margarita A. Khimich ◽  
Andrey V. Belyakov ◽  
Ivan A. Shulepov
Keyword(s):  
Plastic Deformation ◽  
Severe Plastic Deformation ◽  
Cold Working ◽  
Young Modulus ◽  
Physicomechanical Properties ◽  
X Ray Diffraction ◽  
Refined Grains ◽  
X Ray ◽  
Initial Alloy ◽  
Composition Structure

The changes of the phase composition, structure and physicomechanical properties of Ti‑40 mas % Nb after severe plastic deformation are investigated in this paper. By the methods of microstructural, X-ray diffraction analysis and scanning electron microscopy it is determined that phase and structural transformations occur simultaneously in the alloy after severe plastic deformation. The martensitic structure formed after tempering disappears. The inverse α'' → β transformation occurs. The structure consisting of oriented refined grains is formed. The alloy is hardened due to the cold working. The Young modulus is equal to 79 GPa and it is less than that of initial alloy and close to the value obtained after tempering. It is possible that Young modulus is reduced by additional annealing.

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