Capacitance and Transient Photocapacitance Studies of Tetrahedral Amorphous Carbon

2000 ◽  
Vol 621 ◽  
Author(s):  
Kimon C. Palinginis ◽  
A. Ilie ◽  
W.I. Milne ◽  
J. David Cohen

ABSTRACTWe have applied junction capacitance and transient photocapacitance measurements to undoped tetrahedral amorphous carbon (ta-C)/silicon carbide (SiC) heterostructures to deduce defect densities and defect distributions in ta-C. The junction capacitance measurements show two thermally activated processes. One can be related to the activation of carriers out of defects at the ta-C/SiC interface while the other one with an activation energy of 0.36eV is an intrinsic property of the ta-C. The defect density at the ta-C/SiC interface is estimated to be roughly 9 ± 2 × 109 cm−2. The transient photocapacitance measurements have allowed us to observe the broader band tail of ta-C, giving a value (Urbach energy) of 230meV.

1990 ◽  
Vol 192 ◽  
Author(s):  
H. R. Park ◽  
J. Z. Liu ◽  
P. Roca i Cabarrocas ◽  
A. Maruyama ◽  
M. Isomura ◽  
...  

ABSTRACTUsing a Kr ion laser (λ = 647.1 nm) to produce a carrier generation rate G of 3 × 1020 cm−3s−1, we have saturated the light-induced defect generation in hydrogenated (and fluorinated) amorphous silicon (a-Si:H(F)), within a few hours near room temperature. While the defect generation rate scales roughly with 1/G2, the saturation defect densities Ns,sat are essentially independent of G. The saturation is not due to thermal annealing. We have further measured Ns,sat m 37 a-Si:H(F) films grown in six different reactors under different conditions. The results show that Ns,sat lies between 5 × 1016 and 2 × 1017 cm−3, that Ns,sat drops with decreasing optical gap and hydrogen content, and that Ns,sat is not correlated with the initial defect density or with the Urbach energy.


1998 ◽  
Vol 508 ◽  
Author(s):  
Kimon C. Palinginis ◽  
A. Ilie ◽  
B. Kleinsorge ◽  
W.I. Milne ◽  
J. D. Cohen

AbstractWe report the results of junction capacitance measurements on thin tetrahedral amorphous carbon (ta-C) films to deduce their defect densities. We find defect densities in the range 3 - 7 × 1017 cm−3 in the undoped ta-C films, and roughly an order of magnitude larger in the nitrogen doped (n-type) films. In some cases fairly uniform defect profiles were obtained covering a thickness of a couple of hundreds angstroems. We also observed a thermal activation process of carriers from defect states at the ta-C/c-Si interface with an activation energy in the range of 0.4eV to 0.5eV.


1999 ◽  
Vol 74 (3) ◽  
pp. 371-373 ◽  
Author(s):  
Kimon C. Palinginis ◽  
Yoram Lubianiker ◽  
J. David Cohen ◽  
Adelina Ilie ◽  
Britta Kleinsorge ◽  
...  

1995 ◽  
Vol 377 ◽  
Author(s):  
Daewon Kwon ◽  
J. David Cohen ◽  
Brent P. Nelson ◽  
Eugene Iwaniczko

ABSTRACTWe present the results of studies on the defect properties and the effect of light soaking for various hot wire deposited (HW) films. We employ junction capacitance measurements together with the transient photocapacitance spectroscopy to measure the deep defect densities in as-grown state (state A) and in light soaked state (state B). Good agreement is found between the defect densities measured from both measurements. The HW film with a hydrogen content of 10 – 12 at.% shows physical characteristics and defect densities similar to conventional PECVD films. The HW films with hydrogen content, CH, in the range 2 – 9 at.% show a smaller defect density in state B than the defect density of the film with higher CH. However, the film with a hydrogen level of less than 1 at.% exhibits markedly inferior physical properties.


1998 ◽  
Vol 73 (17) ◽  
pp. 2456-2458 ◽  
Author(s):  
N. M. J. Conway ◽  
A. Ilie ◽  
J. Robertson ◽  
W. I. Milne ◽  
A. Tagliaferro

1992 ◽  
Vol 258 ◽  
Author(s):  
L. Benatar ◽  
M. Grimbergen ◽  
A. Fahrenbruch ◽  
A. Lopez-Otero ◽  
D. Redfield ◽  
...  

ABSTRACTData are presented here that show the effects of temperature on the kinetics of metastable defect formation in undoped a-Si:H over the range 45°-110°C. CPM (Constant Photocurrent Method), photoconductivity, and dark conductivity measurements were made and provide independent checks of the defect generation behavior. A stretched exponential description of defect formation as a function of time was used to fit the CPM defect density data. The stretched exponential time constant, τSE, is thermally activated with an apparent activation energy of 1 eV, a value that agrees well with data for defect anneal and solar cell degradation. The data indicate that thermal terms are not negligible for temperatures as low as 45°C, and therefore should be included in any model of the kinetics of defect formation. The role of adistribution of anneal energies and the regimes of dominance of thermal and optical rate terms are discussed in the context of the model.


2010 ◽  
Vol 1245 ◽  
Author(s):  
Peter Hugger ◽  
JinWoo Lee ◽  
J. David Cohen ◽  
Guozhen Yue ◽  
Xixiang Xu ◽  
...  

AbstractWe have examined a series of a Si,Ge:H alloy devices deposited using both RF and VHF glow discharge in two configurations: SS/n+/i (a-SiGe:H)/p+/ITO nip devices and SS/n+/i (a-SiGe:H)/Pd Schottky contact devices, over a range of deposition rates. We employed drive-level capacitance profiling (DLCP), modulated photocurrent (MPC), and transient junction photo-current (TPI) measurement methods to characterize the electronic properties in these materials. The DLCP profiles indicated quite low defect densities (mid 1015 cm-3. to low 1016 cm-3 depending on the Ge alloy fraction) for the low rate RF (∼1Å/s) deposited a-SiGe:H materials. In contrast to the RF process, the VHF deposited a-SiGe:H materials did not exhibit nearly as rapid an increase of defect density with the deposition rate, remaining well below 1017 cm-3. up to rates as high as 10Å/s. Simple examination of the TPI spectra on theses devices allowed us to determine valence band-tail widths.. Modulated photocurrent (MPC) obtained for several of these a-SiGe:H devices allowed us to deduce the conduction band-tail widths. In general, the a-Si,Ge:H materials exhibiting narrower valence band-tail widths and lower defect densities correlated with the best device performance.


2004 ◽  
Vol 95 (9) ◽  
pp. 4829-4832 ◽  
Author(s):  
Churl Seung Lee ◽  
Jin-Koog Shin ◽  
Kwang Yong Eun ◽  
Kwang-Ryeol Lee ◽  
Ki Hyun Yoon

1998 ◽  
Vol 509 ◽  
Author(s):  
Kimon C. Palinginis ◽  
A. Ilie ◽  
B. Kleinsorge ◽  
W.I. Milne ◽  
J. D. Cohen

AbstractWe report the results of junction capacitance measurements on thin tetrahedral amorphous carbon (ta-C) films to deduce their defect densities. We find defect densities in the range 3 - 7 × 1017 cm−3 in the undoped ta-C films, and roughly an order of magnitude larger in the nitrogen doped (n-type) films. In some cases fairly uniform defect profiles were obtained covering a thickness of a couple of hundreds angstroems. We also observed a thermal activation process of carriers from defect states at the ta-C/c-Si interface with an activation energy in the range of 0.4eV to 0.5eV.


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