Effect of Excimer Laser Annealing on Optical Properties of GaN Films Deposited by R.F. Magnetron Sputtering

2001 ◽  
Vol 693 ◽  
Author(s):  
Man Young Sung ◽  
Woong-Je Sung ◽  
Yong-Il Lee ◽  
Chun-Il Park ◽  
Woo-Boem Choi ◽  
...  
Keyword(s):  
Thin Films ◽  
Energy Density ◽  
Magnetron Sputtering ◽  
Buffer Layer ◽  
Excimer Laser ◽  
Laser Annealing ◽  
Laser Energy ◽  
Laser Energy Density ◽  
Excimer Laser Annealing ◽  
Zno Buffer Layer

Abstract:GaN thin films on sapphire were grown by RF magnetron sputtering with ZnO buffer layer. The tremendous mismatch between the lattices of GaN and sapphire can be partly overcome by the use of thin buffer layer of ZnO. The dependence of GaN film quality on ZnO buffer layer was investigated by X-ray diffraction(XRD). The properties of the sputtered GaN are strongly dependent on ZnO buffer layer thickness. The optimum thickness of ZnO buffer layer is around 30nm. Using XRD analysis, we have found the optimal substrate temperature which can grow high quality GaN thin film. In addition, the effect of excimer laser annealing(ELA) on structural and electrical properties of GaN thin films was investigated. The surface roughness and images according to the laser energy density were investigated by atomic force microscopy(AFM) and it was confirmed that the crystallization was improved by increasing laser energy density.

Fast-Pulse Excimer-Laser-Induced Processes in a-Si:H

1989 ◽  
Vol 164 ◽  
Author(s):  
K. Winer ◽  
R.Z. Bachrach ◽  
R.I. Johnson ◽  
S.E. Ready ◽  
G.B. Anderson ◽  
...  
Keyword(s):  
Energy Density ◽  
Excimer Laser ◽  
Impurity Concentration ◽  
Laser Annealing ◽  
Laser Energy ◽  
Laser Energy Density ◽  
Excimer Laser Annealing ◽  
Near Surface ◽  
Pulse Excimer Laser ◽  
Fast Pulse

AbstractThe effects of fast-pulse excimer laser annealing of a-Si:H were investigated by measurements of electronic transport properties and impurity concentration depth profiles as a function of incident laser energy density. The dc dark conductivity of laser-annealed, highly-doped a-Si:H increases by a factor of ∼350 above a sharp laser energy density threshold whose magnitude increases with decreasing impurity concentration and which correlates with the onset of hydrogen evolution from and crystallization of the near-surface layer. The similarities between the preparation and properties of laser-crystallized a-Si:H and pc-Si:H are discussed.

Aligned Polycrystalline Silicon Array Thin Film by XeCl Excimer Laser Annealing for AMOLED Displays

2007 ◽  
Vol 124-126 ◽  
pp. 371-374 ◽  
Author(s):  
C.N. Chen ◽  
G.M. Wu ◽  
W.S. Feng
Keyword(s):  
Thin Film ◽  
Energy Density ◽  
Excimer Laser ◽  
Polycrystalline Silicon ◽  
Laser Annealing ◽  
Laser Energy ◽  
Annealing Atmosphere ◽  
Excimer Laser Annealing ◽  
Overlap Ratio ◽  
Xecl Excimer Laser

Low temperature polycrystalline silicon (LTPS) thin film transistors (TFTs) are demanded to fabricate high performance liquid crystal displays (LCD) and organic light-emitting diode displays (OLED). The mobility of poly-Si TFT can be two orders of magnitude higher than that of amorphous Si (a-Si) TFT. Excimer laser annealing has been studied to be the most promising technology to meet the stringent requirement in high speed operation. The process parameters were identified as a-Si thickness, laser energy density, overlap ratio, annealing atmosphere and pre-clean condition. The a-Si layer of 40-50 nm was deposited by plasma enhanced chemical vapor deposition (PECVD). The XeCl excimer laser was irradiated on the a-Si film at room temperature under N2 or N2/O2 environment. The energy density ranged 250-400 mJ/cm2, and the overlap ratio was 95-99%. The highly aligned poly-Si array thin film could be obtained. The grain size has been about 0.31x0.33 μm2, and the regular arrangement in poly-Si grains was discussed. In addition, the PMOS TFT has been fabricated from the aligned poly-Si array. The mobility was as high as 100 cm2/Vs and the sub-threshold swing was around 0.24 V/dec. The threshold voltage was -1.25 V and the on/off current ratio was about 106.

Excimer (XeCl) Laser Annealing of PbZr0.4Ti0.6O3 Thin Film at Low Temperature for TFT FeRAM Application

2004 ◽  
Vol 830 ◽  
Author(s):  
W. X. Xianyu ◽  
H. S. Cho ◽  
J. Y. Kwon ◽  
H.X. Yin ◽  
T. Noguchi
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Energy Density ◽  
Laser Irradiation ◽  
Excimer Laser ◽  
Laser Annealing ◽  
Laser Energy ◽  
Perovskite Phase ◽  
Hysteresis Loops ◽  
Xecl Laser

ABSTRACTIn this study, we successfully produced PbZr0.4Ti0.6O3 (PZT (40/60)) thin films with high crystallinity and high remnant polarization (Pr) at low process temperatures using pulsed excimer (XeCl) laser irradiation. In our experiments, amorphous PZT films were prepared on Pt/Ti/SiO2/Si substrates by a sol-gel method. A two-step process was used to crystallize the amorphous thin films: the films were annealed at 550°C for 10 min to initiate the nucleation of the PZT perovskite phase, and then annealed with an excimer laser heating at 400°C in a 120 Torr nitrogen gas atmosphere. Laser energy density was varied from 150 to 750 mJ/cm2 per pulse. x-ray diffraction (XRD) patterns show that 150–200 mJ/cm2 range multi-shot excimer laser irradiation drastically improved the crystallinity of the PZT perovskite phase, and FESEM photographs show that the PZT thin film has uniform-sized crystal grains. The ferroelectric properties were found to depend on the laser energy density and shot number. Before the laser annealing, the films show hysteresis loops with low Pr and the loops do not saturate. After laser annealing, the films show highly saturated hysteresis loops, with the Pr increasing from 2.2 μC/cm2 to 23.0 μC/cm2. We also propose a new technology for fabrication of thin film transistor (TFT)-driven FeRAM devices on arbitrary insulator substrate such as on glass.

Excimer Laser Annealed Poly-Si TFT Technologies

1995 ◽  
Vol 377 ◽  
Author(s):  
Fujio Okumura ◽  
Kenji Sera ◽  
Hiroshi Tanabe ◽  
Katsuhisa Yuda ◽  
Hiroshi Okumura
Keyword(s):  
Energy Density ◽  
Leakage Current ◽  
Excimer Laser ◽  
Laser Annealing ◽  
Laser Energy ◽  
Gate Insulator ◽  
Excimer Laser Annealing ◽  
Threshold Voltage Shift ◽  
Si Films ◽  
Current Reduction

ABSTRACTThis paper describes the excimer laser annealed (ELA) poly-Si TFT technologies in terms of excimer laser annealing of Si films, the leakage current, and the TFT stability. A laser energy density and a shot dependencies of TFT characteristics was analyzed by TEM, SEM, and Raman. The mobility increases with increasing not only the energy density but also the shot density. The mobility increase with the energy density is due to the grain size enlargement. On the other hand, the mobility increase up to 10 to 20 shots is due to a decrease of defects, including small grains, grain boundaries and defects inside grains. The contribution of grain-growth is small. The ELA TFT has a micro-offset structure to reduce the leakage current. Moreover, we have proposed a dynamic leakage current reduction structure. The combination of these technologies provides a sufficiently small leakage current for AMLCDs. The stability of the gate insulator was analyzed. The TFT shows negative threshold voltage shift under gate bias stress. This is due to water penetration and the subsequent field activated chemical reaction in the gate insulator. The dissociation of Si-OH bonds with hydrogen-bonded water was a fundamental contributor. The shift was suppressed sufficiently by hydrogen passivation. Obtained ELA TFTs;s have mobilities of over 100 cm2/Vsec, threshold voltages of less than 3 V, effective leakage currents of less than 10−13 A, and are stable more than 10 years.

scholarly journals Crystal Growth of Low-Temperature Processed Poly-Si by Excimer Laser Annealing. Dependences of Poly-Si Grain on Energy Density and Shot Number.

Shinku ◽  
2000 ◽  
Vol 43 (12) ◽  
pp. 1120-1125 ◽  
Author(s):  
Naoto MATSUO ◽  
Hisashi ABE ◽  
Naoya KAWAMOTO ◽  
Ryouhei TAGUCHI ◽  
Tomoyuki NOUDA ◽  
...  
Keyword(s):  
Crystal Growth ◽  
Energy Density ◽  
Low Temperature ◽  
Excimer Laser ◽  
Laser Annealing ◽  
Excimer Laser Annealing ◽  
Shot Number

Crystal Growth of Silicon Thin Films on Glass by Excimer Laser Annealing: A Molecular-Dynamics Study

2006 ◽  
Vol 45 (5B) ◽  
pp. 4344-4346 ◽  
Author(s):  
Shinji Munetoh ◽  
Takahide Kuranaga ◽  
Byoung Min Lee ◽  
Teruaki Motooka ◽  
Takahiko Endo ◽  
...  
Keyword(s):  
Thin Films ◽  
Molecular Dynamics ◽  
Crystal Growth ◽  
Excimer Laser ◽  
Laser Annealing ◽  
Excimer Laser Annealing ◽  
Silicon Thin Films

Pulsed Excimer Laser Processing of AlN/GaN Thin Films

1996 ◽  
Vol 449 ◽  
Author(s):  
W. S. Wong ◽  
L. F. Schloss ◽  
G.S. Sudhir ◽  
B. P. Linder ◽  
K-M. Yu ◽  
...  
Keyword(s):  
Thin Films ◽  
Energy Density ◽  
Excimer Laser ◽  
Laser Processing ◽  
Laser Annealing ◽  
Rutherford Backscattering Spectrometry ◽  
Pulsed Laser ◽  
Emission Peak ◽  
Dopant Activation ◽  
Pulsed Laser Annealing

ABSTRACTA KrF (248 nm) excimer laser with a 38 ns pulse width was used to study pulsed laser annealing of AIN/GaN bi-layers and dopant activation of Mg-implanted GaN thin films. For the AIN/GaN bi-layers, cathodoluminescence (CL) showed an increase in the intensity of the GaN band-edge peak at 3.47 eV after pulsed laser annealing at an energy density of 2000 mJ/cm2. Rutherford backscattering spectrometry of a Mg-implanted A1N (75 nm thick)/GaN (1.0 μm thick) thin-film heterostructure showed a 20% reduction of the 4He+ backscattering yield after laser annealing at an energy density of 400 mJ/cm2. CL measurements revealed a 410 nm emission peak indicating the incorporation of Mg after laser processing.

Electrical/Optical Properties of Thin Transparent Oxide Films Deposited Using DC Magnetron Sputtering

2004 ◽  
Vol 449-452 ◽  
pp. 989-992
Author(s):  
Byung Soo So ◽  
Sung Moon Kim ◽  
Young Sin Pyo ◽  
Young Hwan Kim ◽  
Jin-Ha Hwang
Keyword(s):  
Optical Properties ◽  
Magnetron Sputtering ◽  
Thermal Annealing ◽  
Excimer Laser ◽  
Indium Tin Oxide ◽  
Laser Annealing ◽  
Dc Magnetron Sputtering ◽  
Excimer Laser Annealing ◽  
Plastic Substrates ◽  
Ito Thin Films

Amorphous indium tin oxide (ITO) thin films were grown on plastic substrates, PES (polyethersulfone) using low temperature DC magnetron sputtering. Various post-annealing techniques are attempted to optimize conductivity, transmittance, and roughness: i) conventional thermal annealing, ii) excimer laser annealing, and iii) UV irradiation. The electrical/optical properties were measured using Hall-measurement, DC 4-point resistance measurement, and UV spectrometry along with micro-structural characterization. Optimized UV treatment exhibits enhanced conductivity and smooth surface, compared to those of conventional thermal annealing and excimer laser annealing.

Formation of Q-carbon by adjusting sp3 content in diamond-like carbon films and laser energy density of pulsed laser annealing

Carbon ◽  
2020 ◽  
Vol 167 ◽  
pp. 504-511 ◽  
Author(s):  
Hiroki Yoshinaka ◽  
Seiko Inubushi ◽  
Takanori Wakita ◽  
Takayoshi Yokoya ◽  
Yuji Muraoka
Keyword(s):  
Energy Density ◽  
Laser Annealing ◽  
Laser Energy ◽  
Pulsed Laser ◽  
Carbon Films ◽  
Laser Energy Density ◽  
Diamond Like Carbon ◽  
Pulsed Laser Annealing
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