Electrical/Optical Properties of Thin Transparent Oxide Films Deposited Using DC Magnetron Sputtering

2004 ◽  
Vol 449-452 ◽  
pp. 989-992
Author(s):  
Byung Soo So ◽  
Sung Moon Kim ◽  
Young Sin Pyo ◽  
Young Hwan Kim ◽  
Jin-Ha Hwang

Amorphous indium tin oxide (ITO) thin films were grown on plastic substrates, PES (polyethersulfone) using low temperature DC magnetron sputtering. Various post-annealing techniques are attempted to optimize conductivity, transmittance, and roughness: i) conventional thermal annealing, ii) excimer laser annealing, and iii) UV irradiation. The electrical/optical properties were measured using Hall-measurement, DC 4-point resistance measurement, and UV spectrometry along with micro-structural characterization. Optimized UV treatment exhibits enhanced conductivity and smooth surface, compared to those of conventional thermal annealing and excimer laser annealing.

1996 ◽  
Vol 198-200 ◽  
pp. 821-824 ◽  
Author(s):  
Xinfan Huang ◽  
Zhifeng Li ◽  
Wei Wu ◽  
Kunji Chen ◽  
Xiaoyuan Chen ◽  
...  

2004 ◽  
Vol 460 (1-2) ◽  
pp. 291-294 ◽  
Author(s):  
Wonsuk Chung ◽  
Michael O. Thompson ◽  
Paul Wickboldt ◽  
Daniel Toet ◽  
Paul G. Carey

2001 ◽  
Vol 693 ◽  
Author(s):  
Man Young Sung ◽  
Woong-Je Sung ◽  
Yong-Il Lee ◽  
Chun-Il Park ◽  
Woo-Boem Choi ◽  
...  

Abstract:GaN thin films on sapphire were grown by RF magnetron sputtering with ZnO buffer layer. The tremendous mismatch between the lattices of GaN and sapphire can be partly overcome by the use of thin buffer layer of ZnO. The dependence of GaN film quality on ZnO buffer layer was investigated by X-ray diffraction(XRD). The properties of the sputtered GaN are strongly dependent on ZnO buffer layer thickness. The optimum thickness of ZnO buffer layer is around 30nm. Using XRD analysis, we have found the optimal substrate temperature which can grow high quality GaN thin film. In addition, the effect of excimer laser annealing(ELA) on structural and electrical properties of GaN thin films was investigated. The surface roughness and images according to the laser energy density were investigated by atomic force microscopy(AFM) and it was confirmed that the crystallization was improved by increasing laser energy density.


2003 ◽  
Vol 42 (Part 1, No. 12) ◽  
pp. 7349-7353 ◽  
Author(s):  
Dae-Jin Kim ◽  
Seong-Eun Park ◽  
Hyun-Jung Kim ◽  
Je-Kil Ryu ◽  
Byungsung O ◽  
...  

Energies ◽  
2020 ◽  
Vol 13 (13) ◽  
pp. 3335
Author(s):  
Sanchari Chowdhury ◽  
Jinsu Park ◽  
Jaemin Kim ◽  
Sehyeon Kim ◽  
Youngkuk Kim ◽  
...  

The crystallization of hydrogenated amorphous silicon (a-Si:H) is essential for improving solar cell efficiency. In this study, we analyzed the crystallization of a-Si:H via excimer laser annealing (ELA) and compared this process with conventional thermal annealing. ELA prevents thermal damage to the substrate while maintaining the melting point temperature. Here, we used xenon monochloride (XeCl), krypton fluoride (KrF), and deep ultra-violet (UV) lasers with wavelengths of 308, 248, and 266 nm, respectively. Laser energy densities and shot counts were varied during ELA for a-Si:H films between 20 and 80 nm thick. All the samples were subjected to forming gas annealing to eliminate the dangling bonds in the film. The ELA samples were compared with samples subjected to thermal annealing performed at 850–950 °C for a-Si:H films of the same thickness. The crystallinity obtained via deep UV laser annealing was similar to that obtained using conventional thermal annealing. The optimal passivation property was achieved when crystallizing a 20 nm thick a-Si:H layer using the XeCl excimer laser at an energy density of 430 mJ/cm2. Thus, deep UV laser annealing exhibits potential for the crystallization of a-Si:H films for TOPCon cell fabrication, as compared to conventional thermal annealing.


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