Study of the Effects of a Two-Step Anneal on the End of Range Defects in Silicon

2002 ◽  
Vol 717 ◽  
Author(s):  
Renata A. Camillo-Castillo ◽  
Kevin. S. Jones ◽  
Mark E. Law ◽  
Leonard M. Rubin
Keyword(s):  
Defect Density ◽  
Low Energy ◽  
Extended Defects ◽  
Dislocation Loops ◽  
Extended Defect ◽  
Enhanced Diffusion ◽  
Interstitial Concentration ◽  
Transmission Electron ◽  
Concentration Peak ◽  
Scale Down

AbstractTransient enhanced diffusion (TED) is a challenge that the semi-conductor industry has been faced with for more than two decades. Numerous investigations have been conducted to better understand the mechanisms that govern this phenomenon, so that scale down can be acheived. {311} type defects and dislocation loops are known interstitial sources that drive TED and dopants such as B utilize these interstitials to diffuse throughout the Si lattice. It has been reported that a two-step anneal on Ge preamorphized Si with ultra-low energy B implants has resulted in shallower junction depths. This study examines whether the pre-anneal step has a measurable effect on the end of range defects. Si wafers were preamorphized with Ge at 10, 12, 15, 20 and 30keV at a dose of 1x1015cm-2 and subsequently implanted with 1x1015cm-2 1keV B. Furnace anneals were performed at 450, 550, 650 and 750°C; the samples were then subjected to a spike RTA at 950°C. The implant damage was analyzed using Quantitative Transmission Electron Microscopy (QTEM). At the low energy Ge preamorphization, little damage is observed. However at the higher energies the microstructure is populated with extended defects. The defects evolve into elongated loops as the preanneal temperature increases. Both the extended defect density and the trapped interstitial concentration peak at a preanneal temperature of 550°C, suggesting that this may be an optimal condition for trapping interstitials.

Onset of Extended Defect Formation and Enhanced Diffusion for Ultra-Low Energy Boron Implants

1999 ◽  
Vol 568 ◽  
Author(s):  
Jinning Liu ◽  
Kevin S. Jones ◽  
Daniel F. Downey ◽  
Sandeep Mehta
Keyword(s):  
Defect Formation ◽  
Low Energy ◽  
Dislocation Loops ◽  
Boron Diffusion ◽  
Extended Defect ◽  
Enhanced Diffusion ◽  
Annealing Conditions ◽  
Diffusion Enhancement ◽  
Spike Anneal ◽  
Low Thermal Budget

ABSTRACTTo meet the challenge of achieving ultra shallow p+/n source/drain extension junctions for 0.1 Oim node devices, ultra low energy boron implant and advanced annealing techniques have been explored. In this paper, we report the extended defect and boron diffusion behavior with various implant and annealing conditions. Boron implants were performed at energies from 0.25keV to lkeV and doses of 5 × 1014 cm−2 and 1 × 1015cm−2. Subsequent anneals were carried out in nitrogen ambient. The effect of energy, dose and oxide capping on extended defect formation and enhanced dopant diffusion was examined. It was observed that a thin screen oxide layer (35Å), grown prior to implantation, reduces the concentration of dopant in the Si by a significant amount as expected. This oxide also reduces the dislocation loops in the lattice and lowers diffusion enhancement of the dopant during annealing. The final junction depth can be optimized by using a low thermal budget spike anneal in a controlled oxygen ambient.

Fundamental Modeling of Transient Enhanced Diffusion through Extended Defect Evolution

1997 ◽  
Vol 469 ◽  
Author(s):  
A. H. Gencer ◽  
S. Chakravarthi ◽  
I. Clejan ◽  
S. T. Dunham
Keyword(s):  
Point Defect ◽  
Extended Defects ◽  
Dislocation Loops ◽  
Extended Defect ◽  
Enhanced Diffusion ◽  
Fundamental Model ◽  
Transient Enhanced Diffusion ◽  
Defect Evolution

Prediction of transient enhanced diffusion (TED) requires modeling of extended defects of many types, such as {311} defects, dislocation loops, boron-interstitial clusters, arsenic precipitates, etc. These extended defects not only form individually, but they also interact with each other through changes in point defect and solute concentrations. We have developed a fundamental model which can account for the behavior of a broad range of extended defects, as well as their interactions with each other. We have successfully applied and parameterized our model to a range of systems and conditions, some of which are presented in this paper.

Defect Evolution from Low Energy, Amorphizing, Germanium Implants on Silicon

2001 ◽  
Vol 669 ◽  
Author(s):  
Andres F. Gutierrez ◽  
Kevin S. Jones ◽  
Daniel F. Downey
Keyword(s):  
Time Window ◽  
Low Energy ◽  
Dislocation Loops ◽  
Medium Energy ◽  
Evolutionary Pathway ◽  
Plan View ◽  
Enhanced Diffusion ◽  
Conventional Furnace ◽  
Transmission Electron ◽  
Defect Evolution

ABSTRACTPlan-view transmission electron microscopy (PTEM) was used to characterize defect evolution upon annealing of low-to-medium energy, 5-30 keV, germanium implants into silicon. The implant dose was 1 × 1015 ions/cm2, sufficient for surface amorphization. Annealing of the samples was done at 750 °C in nitrogen ambient by both rapid thermal annealing (RTA) and conventional furnace, and the time was varied from 10 seconds to 360 minutes. Results indicate that as the energy drops from 30 keV to 5 keV, an alternate path of excess interstitials evolution may exist. For higher implant energies, the interstitials evolve from clusters to {311}'s to loops as has been previously reported. However, as the energy drops to 5 keV, the interstitials evolve from clusters to small, unstable dislocation loops which dissolve and disappear within a narrow time window, with no {311}'s forming. These results imply there is an alternate evolutionary pathway for {311} dissolution during transient enhanced diffusion (TED) for these ultra-low energy implants.

Effects of Concurrent Co or Ti Silicidation on Transient Diffusion and End-of-Range Damage in Phosphorus Implanted Silicon

1992 ◽  
Vol 262 ◽  
Author(s):  
J.W. Honeycutt ◽  
J. Ravi ◽  
G. A. Rozgonyi
Keyword(s):  
Secondary Ion Mass Spectrometry ◽  
Complete Removal ◽  
Dislocation Loops ◽  
Enhanced Diffusion ◽  
Depth Profiles ◽  
Enhanced Dissolution ◽  
Implantation Damage ◽  
Transmission Electron ◽  
Defect Behavior ◽  
Secondary Ion

ABSTRACTThe effects of Ti and Co silicidation on P+ ion implantation damage in Si have been investigated. After silicidation of unannealed 40 keV, 2×1015 cm-2 P+ implanted junctions by rapid thermal annealing at 900°C for 10–300 seconds, secondary ion mass spectrometry depth profiles of phosphorus in suicided and non-silicided junctions were compared. While non-silicided and TiSi2 suicided junctions exhibited equal amounts of transient enhanced diffusion behavior, the junction depths under COSi2 were significantly shallower. End-of-range interstitial dislocation loops in the same suicided and non-silicided junctions were studied by planview transmission electron microscopy. The loops were found to be stable after 900°C, 5 minute annealing in non-silicided material, and their formation was only slightly effected by TiSi2 or COSi2 silicidation. However, enhanced dissolution of the loops was observed under both TiSi2 and COSi2, with essentially complete removal of the defects under COSi2 after 5 minutes at 900°C. The observed diffusion and defect behavior strongly suggest that implantation damage induced excess interstitial concentrations are significantly reduced by the formation and presence of COSi2, and to a lesser extent by TiSi2. The observed time-dependent defect removal under the suicide films suggests that vacancy injection and/or interstitial absorption by the suicide film continues long after the suicide chemical reaction is complete.

scholarly journals Mechanisms of Enhanced Ionic Conduction at Interfaces in Ceramics

1994 ◽  
Vol 357 ◽  
Author(s):  
D. Lubben ◽  
F. A. Modine
Keyword(s):  
Film Thickness ◽  
Ionic Conduction ◽  
Defect Density ◽  
Ionic Conductivities ◽  
Dislocation Motion ◽  
Extended Defects ◽  
Epitaxial Relationship ◽  
Extended Defect ◽  
Charge Layer ◽  
Fine Grained

AbstractA large enhancement in the ionic conductivity of certain compounds occurs when the compound is produced as a composite material containing a finely-dispersed non-conductor such as SiO2 or Al2O3 This effect has been reported on for more than 20 years, and it is well established that the enhancement is associated with the presence of interfaces. The popular explanation has been based on a model which contends that the enhancement is due to a space-charge layer which forms to compensate a net charge layer at an interface. A different model proposes that extended defects such as dislocations and grain boundaries, either resulting from or stabilized by the interface, are responsible for the enhancement. This paper describes recent experiments which strongly support the latter model. The ionic conductivities of LiI and CaF2 thin films grown on sapphire(0001) substrates were monitored in-situ during deposition as a function of film thickness and deposition conditions. LiI films grown at 27°C exhibited a region of enhanced conduction within 100 nm of the substrate and a lesser enhancement as the film thickness was increased further. This conduction enhancement was not stable but annealed out with a characteristic log(time) dependence. The observed annealing behavior was fit with a model based on dislocation motion which implies that the increase in conduction near the interface is due to extended defects generated during the growth process. LiI films grown at higher temperatures (100°C) in order to reduce the grown-in defects showed no interfacial conduction enhancement. X-ray diffraction measurements suggest that these high-temperature LiI films nucleate as faceted epitaxial islands with a stable misfit dislocation density defined by the epitaxial relationship between the substrate and film. CaF2 films grown at 200°C showed a behavior similar to the 27°C LiI films, with a region of thermally unstable enhanced conduction that occurs within 10 nm of the substrate. Amorphous Al2O3 films deposited over the CaF2 layers created no additional enhancement but did increase the stability of the conduction, consistent with an extended defect model. Simultaneous deposition of CaF2 and Al2O3 produced films consisting of very-fine-grained CaF2 and particles of amorphous Al2O23 (5-10 nm grain and particle size) and a high defect density which was stable even well above the growth temperature. Measured conduction in the composite at 200°C was approximately 360 times that of bulk CaF2.

Effects of Nonmelt Laser Annealing on a 5keV Boron Implant in Silicon

2000 ◽  
Vol 610 ◽  
Author(s):  
Susan Earles ◽  
Mark Law ◽  
Kevin Jones ◽  
Rich Brindos ◽  
omit Talwar
Keyword(s):  
Thermal Processing ◽  
Laser Annealing ◽  
Defect Density ◽  
Ramp Rate ◽  
Rapid Thermal Anneal ◽  
Extended Defect ◽  
Enhanced Diffusion ◽  
Post Annealing ◽  
Laser Anneal ◽  
Laser Thermal Processing

AbstractTo investigate the effects of ramp rate on the transient enhanced diffusion of boron in silicon, laser thermal processing (LTP) in the nonmelt regime has been investigated. A nonmelt laser anneal has been performed on a 5 keV, 1e15 boron implant. The implant energy of 5keV was chosen to simplify analysis. A rapid thermal anneal (RTA) at 1000°C and furnace anneals at 750 °C were used to show the effect of post annealing on the LTPd samples. Results show the sheet resistance drops by up to a factor of two for samples receiving the nonmelt LTP and the RTA compared with the samples just receiving the RTA. An increase in the hall mobility was also observed for the samples receiving the LTP. The nonmelt LTP was also shown to strongly affect the extended defect density. During post anneals, a higher density of smaller defects evolved in the samples receiving the LTP.

Structure Determination of Clusters Formed in Ultra-Low Energy High-Dose Implanted Silicon

2005 ◽  
Vol 108-109 ◽  
pp. 303-308 ◽  
Author(s):  
N. Cherkashin ◽  
Martin J. Hÿtch ◽  
Fuccio Cristiano ◽  
A. Claverie
Keyword(s):  
Electron Microscopy ◽  
Geometric Phase ◽  
Low Energy ◽  
High Dose ◽  
Dislocation Loops ◽  
Weak Beam ◽  
Transmission Electron ◽  
Geometric Phase Analysis

In this work, we present a detailed structural characterization of the defects formed after 0.5 keV B+ implantation into Si to a dose of 1x1015 ions/cm2 and annealed at 650°C and 750°C during different times up to 160 s. The clusters were characterized by making use of Weak Beam and High Resolution Transmission Electron Microscopy (HRTEM) imaging. They are found to be platelets of several nanometer size with (001) habit plane. Conventional TEM procedure based on defect contrast behavior was applied to determine the directions of their Burger’s vectors. Geometric Phase Analysis of HRTEM images was used to measure the displacement field around these objects and, thus, to unambiguously determine their Burger’s vectors. Finally five types of dislocation loops lying on (001) plane are marked out: with ] 001 [1/3 ≅ b and b ∝ [1 0 1], [-1 0 1], [0 1 1], [0 -1 1].

Defects and Phase Change Induced by Giant Electronic Excitations With GeV Ions And 30MeV Cluster Beam

1996 ◽  
Vol 439 ◽  
Author(s):  
P. Thevenard ◽  
M. Beranger ◽  
B. Canut ◽  
S. M. M. Ramos ◽  
N. Bonardi ◽  
...  
Keyword(s):  
Rutherford Backscattering Spectrometry ◽  
Electronic Energy ◽  
Extended Defects ◽  
Electronic Excitations ◽  
Dislocation Loops ◽  
Nuclear Collisions ◽  
Transmission Electron ◽  
F Center ◽  
Different Temperatures ◽  
Solid State Parameters

AbstractMgO and LiNbO 3 single crystals were bombarded with GeV swift heavy ions (Pb, Gd) and 30MeV C60 clusters to study the damage production induced by giant electronic processes at stopping power up to 100keV/nm. The defect creation was characterized by optical absorption, transmission electron microscopy (TEM) and Rutherford backscattering spectrometry in channeling geometry (RBS-C). In MgO point defects (F type centers) and extended defects (dislocation loops) were created by ionization processes in addition to those associated with nuclear collisions. The F-center concentration induced by electronic energy excitations was studied at different temperatures and as a function of the particle electronic energy losses. TEM revealed that dislocation loops were produced close to the particle trajectories and amorphization was never observed. On the opposite, in LiNbO3 continuous amorphous tracks were evidenced above a threshold near 5keV/nm. The dependance of this effects with various solid state parameters will be discussed.

Modeling of Extended Defects in Silicon

1996 ◽  
Vol 438 ◽  
Author(s):  
M. E. Law ◽  
K. S. Jones ◽  
S. K. Earles ◽  
A. D. Lilak ◽  
J-W. Xu
Keyword(s):  
Low Temperature ◽  
Experimental Work ◽  
Quantitative Model ◽  
Extended Defects ◽  
Form Complex ◽  
Extended Defect ◽  
Enhanced Diffusion ◽  
Transient Enhanced Diffusion ◽  
Short Time ◽  
Defect Behavior

AbstractTransient Enhanced Diffusion (TED) is one of the biggest modeling challenges present in predicting scaled technologies. Damage from implantation of dopant ions changes the diffusivities of the dopants and precipitates to form complex extended defects. Developing a quantitative model for the extended defect behavior during short time, low temperature anneals is a key to explaining TED. This paper reviews some of the modeling developments over the last several years, and discusses some of the challenges that remain to be addressed. Two examples of models compared to experimental work are presented and discussed.

Atomistic simulations of extrinsic defects evolution and transient enhanced diffusion in silicon

2001 ◽  
Vol 669 ◽  
Author(s):  
A. Claverie ◽  
B. Colombeau ◽  
F. Cristiano ◽  
A. Altibelli ◽  
C. Bonafos
Keyword(s):  
Ostwald Ripening ◽  
Physical Modelling ◽  
Defect Layer ◽  
Low Energy ◽  
Atomistic Simulations ◽  
Correct Prediction ◽  
Dislocation Loops ◽  
Enhanced Diffusion ◽  
Loss Term ◽  
Extrinsic Defects

ABSTRACTWe have implemented an atomistic simulation of the Ostwald ripening of extrinsic defects (clusters, {113}'s and dislocation loops) which occurs during annealing of ion implanted silicon. Our model describes the concomitant time evolution of the defects and of the supersaturation of Si interstitial atoms in the region. It accounts for the capture and emission of these interstitials to and from extrinsic defects (defined by their formation energy) of sizes up to thousands of atoms and includes a loss term due to the interstitial flux to the surface. This model reproduces well the dissolution of {113} defects in Si implanted wafers. We have subsequently studied the characteristics of TED in the case of B implantation at low and ultra low energy. In such cases, the distance between the defect layer and the surface plays a crucial role in determining the TED decay time. The simulations show that defect dissolution occurs earlier and for smaller sizes in the ultra-low energy regime. Under such conditions, TED is mostly characterized by its “pulse” component which takes place at the very beginning of the anneal, probably during the ramping up. In summary, we have shown that the physical modelling of the formation and of the growth of extrinsic defects leads to a correct prediction of the “source term” of Si interstitials and at the origin of TED.

Sign in / Sign up

Export Citation Format

Share Document