High κ Gate Dielectrics For Si And Compound Semiconductors By Molecular Beam Epitaxy

2002 ◽  
Vol 745 ◽  
Author(s):  
J. Raynien Kwo ◽  
Minghwei Hong

ABSTRACTThe ability of controlling the growth and interfaces of ultrathin dielectric films on Si and compound semiconductors by ultrahigh vacuum physical vapor deposition has led to comprehensive studies of gate stacks employing the high κ gate oxide Ga2O3(Gd2O3), and the rare earth oxides Gd2O3 and Y2O3. The epitaxy and the interfaces of Gd2O3 on GaAs, GaN, and Si were characterized with atomic precision, and show strong tendency to conform to the underlying substrate, thus providing insight into the fundamental mechanism for low interfacial state density and effective passivation of GaAs and GaN surfaces. These Gd2O3 and Y2O3 gate stacks of abrupt interfaces and controlled microstructures were employed as a model system to elucidate critical issues of materials integration in CMOS scaling.

2002 ◽  
Vol 747 ◽  
Author(s):  
J. Raynien Kwo ◽  
Minghwei Hong

ABSTRACTThe ability of controlling the growth and interfaces of ultrathin dielectric films on Si and compound semiconductors by ultrahigh vacuum physical vapor deposition has led to comprehensive studies of gate stacks employing the high κ gate oxide Ga2O3(Gd2O3), and the rare earth oxides Gd2O3 and Y2O3. The epitaxy and the interfaces of Gd2O3 on GaAs, GaN, and Si were characterized with atomic precision, and show strong tendency to conform to the underlying substrate, thus providing insight into the fundamental mechanism for low interfacial state density and effective passivation of GaAs and GaN surfaces. These Gd2O3 and Y2O3 gate stacks of abrupt interfaces and controlled microstructures were employed as a model system to elucidate critical issues of materials integration in CMOS scaling.


2020 ◽  
Vol 116 (22) ◽  
pp. 222104
Author(s):  
Takuma Doi ◽  
Shigehisa Shibayama ◽  
Wakana Takeuchi ◽  
Mitsuo Sakashita ◽  
Noriyuki Taoka ◽  
...  

2003 ◽  
Vol 83 (3) ◽  
pp. 533-535 ◽  
Author(s):  
R. J. Carter ◽  
E. Cartier ◽  
A. Kerber ◽  
L. Pantisano ◽  
T. Schram ◽  
...  

2016 ◽  
Vol 119 (20) ◽  
pp. 204101 ◽  
Author(s):  
Y. Guo ◽  
H. Li ◽  
J. Robertson
Keyword(s):  

2003 ◽  
Vol 786 ◽  
Author(s):  
B.P. Gila ◽  
B. Luo ◽  
J. Kim ◽  
R. Mehandru ◽  
J.R. LaRoche ◽  
...  

ABSTRACTThe study of the effects of substrate surface preparation of GaN, both in-situ and ex-situ and the subsequent deposition of dielectric materials is necessary to create a viable GaN FET technology. Surface preparation techniques have been explored using RHEED, AES, SIMS and C-V measurements to produce films of low interface trap density, 1–2E11 eV−1cm−2. A similar study of the as-fabricated HEMT surface was carried out to create a cleaning procedure prior to dielectric passivation. Dielectric films of Sc2O3 and MgO were deposited via gas-source MBE. Post-deposition materials characterization included AES, TEM, XRR and XPS, as well as gate pulse and isolation current measurements for the passivated HEMT devices. From this study, the relationship between the interface structure and chemistry and the quality of the oxide/nitride electrical interface has been determined. The resulting process has led to the near elimination of the current collapse phenomenon. In addition, the resulting oxide/nitride interface quality has allowed for the first demonstration of inversion in GaN.


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