The problem of the electrical discharge in an internally wired capacitor

The present work investigates the dynamics of electrical discharges in a capacitor where both plates are internally connected by a conducting wire. A simplifying assumption used to solve the problem is to consider a uniform distribution of the surface charges on the plates. This implies uniform electric fields as well, and allows to calculate the current in the wire as if it were flowing along a simple RC circuit. We show that although the assumption is good if the conductivity of the wire is small, it fails if the conductivity becomes larger than a critical value. The device's behavior beyond this critical value is then analyzed and discussed. The relevance of the problem is discussed in connection to solid-state devices, as well as in problem solving contexts.

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Effects of Electrical Discharges in Low Pressure Gases on the Morphology of Polyethylene Crystals

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100052730 ◽

1974 ◽

Vol 32 ◽

pp. 544-545

Author(s):

L.H. Bolz ◽

D.H. Reneker

Keyword(s):

Power Distribution ◽

Electrical Discharge ◽

Dielectric Breakdown ◽

Ionic Species ◽

Low Pressure ◽

Polymer Surfaces ◽

Electrical Discharges ◽

Adhesive Bonds ◽

Power Distribution Lines ◽

Modification Of The Surface

The attack, on the surface of a polymer, by the atomic, molecular and ionic species that are created in a low pressure electrical discharge in a gas is interesting because: 1) significant interior morphological features may be revealed, 2) dielectric breakdown of polymeric insulation on high voltage power distribution lines involves the attack on the polymer of such species created in a corona discharge, 3) adhesive bonds formed between polymer surfaces subjected to such SDecies are much stronger than bonds between untreated surfaces, 4) the chemical modification of the surface creates a reactive surface to which a thin layer of another polymer may be bonded by glow discharge polymerization.

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Preparation of Thin Cadmium Telluride Samples for Electron Microscope Studies

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100052754 ◽

1974 ◽

Vol 32 ◽

pp. 548-549

Author(s):

T. J. Magee ◽

J. Peng ◽

J. Bean

Keyword(s):

Electron Microscope ◽

Sulfuric Acid ◽

Solid State ◽

Sample Preparation ◽

Cadmium Telluride ◽

Potassium Dichromate ◽

Optical Components ◽

The Past ◽

Solid State Devices

Cadmium telluride has become increasingly important in a number of technological applications, particularly in the area of laser-optical components and solid state devices, Microstructural characterizations of the material have in the past been somewhat limited because of the lack of suitable sample preparation and thinning techniques. Utilizing a modified jet thinning apparatus and a potassium dichromate-sulfuric acid thinning solution, a procedure has now been developed for obtaining thin contamination-free samples for TEM examination.

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Current Status of Solid-State X-Ray Systems

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100117789 ◽

1985 ◽

Vol 43 ◽

pp. 158-161

Author(s):

Martin Peckerar ◽

Anastasios Tousimis

Keyword(s):

Solid State ◽

Electric Fields ◽

Spectral Lines ◽

Current Status ◽

Mobile Charge ◽

Electron Hole ◽

X Ray ◽

Sensing Systems ◽

Transmission Electron ◽

Electron Microscopes

Solid state x-ray sensing systems have been used for many years in conjunction with scanning and transmission electron microscopes. Such systems conveniently provide users with elemental area maps and quantitative chemical analyses of samples. Improvements on these tools are currently sought in the following areas: sensitivity at longer and shorter x-ray wavelengths and minimization of noise-broadening of spectral lines. In this paper, we review basic limitations and recent advances in each of these areas. Throughout the review, we emphasize the systems nature of the problem. That is. limitations exist not only in the sensor elements but also in the preamplifier/amplifier chain and in the interfaces between these components.Solid state x-ray sensors usually function by way of incident photons creating electron-hole pairs in semiconductor material. This radiation-produced mobile charge is swept into external circuitry by electric fields in the semiconductor bulk.

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