Heat Transfer Enhancement in Film Boiling due to Lift Forces on the Taylor-Helmholtz Instability in Low Forced Convection from a Horizontal Surface

2010 ◽  
Vol 17 (2) ◽  
pp. 197-204 ◽  
Author(s):  
F. J. Arias ◽  
F. Reventos
Author(s):  
Emad Y. Tanbour ◽  
Ramin K. Rahmani

Enhancement of the natural and forced convection heat transfer has been the subject of numerous academic and industrial studies. Air blenders, mechanical agitators, and static mixers have been developed to increase the forced convection heat transfer rate in compressible and incompressible flows. Stationary inserts can be efficiently employed as heat transfer enhancement devices in the natural convection systems. Generally, a stationary heat transfer enhancement insert consists of a number of equal motionless segments, placed inside of a pipe in order to control flowing fluid streams. These devices have low maintenance and operating costs, low space requirements and no moving parts. A range of designs exists for a wide range of specific applications. The shape of the elements determines the character of the fluid motion and thus determines thermal effectiveness of the insert. There are several key parameters that may be considered in the design procedure of a heat transfer enhancement insert, which lead to significant differences in the performance of various designs. An ideal insert, for natural conventional heat transfer in compressible flow applications, provides a higher rate of heat transfer and a thermally homogenous fluid with minimized pressure drop and required space. To choose an insert for a given application or in order to design a new insert, besides experimentation, it is possible to use Computational Fluid Dynamics to study the insert performance. This paper presents the outcomes of the numerical studies on industrial stationary heat transfer enhancement inserts and illustrates how a heat transfer enhancement insert can improve the heat transfer in buoyancy driven compressible flows. Using different measuring tools, thermal performance of two different inserts (twisted and helix) are studied. It is shown that the helix design leads to a higher rate of heat transfer, while causes a lower pressure drop in the flowfield, suggesting the insert effectiveness is higher for the helix design, compared to a twisted plate.


Author(s):  
Sezer O¨zerinc¸ ◽  
Almıla G. Yazıcıog˘lu ◽  
Sadık Kakac¸

A nanofluid is defined as the suspension of nanoparticles in a base liquid. Studies in the last decade have shown that significant amount of thermal conductivity and heat transfer enhancement can be obtained by using nanofluids. In the first part of this study, classical forced convection heat transfer correlations developed for pure fluids are used to predict the experimental values of heat transfer enhancement of nanofluids. It is seen that the experimental values of heat transfer enhancement exceed the enhancement predictions of the classical correlations. On the other hand, a recent correlation based on the thermal dispersion phenomenon created by the random motion of nanoparticles predicts the experimental data well. In the second part of the study, in order to further examine the validity of the thermal dispersion approach, a numerical analysis of forced convection heat transfer of Al2O3/water nanofluid inside a circular tube in the laminar flow regime is performed by utilizing single phase assumption. A thermal dispersion model is applied to the problem and variation of thermal conductivity with temperature and variation of thermal dispersion with local axial velocity are taken into account. The agreement of the numerical results with experimental data might be considered as an indication of the validity of the approach.


2014 ◽  
Vol 1082 ◽  
pp. 327-331
Author(s):  
Thiago Antonini Alves ◽  
Murilo A. Barbur ◽  
Felipe Baptista Nishida

In this research, a study of the heat transfer enhancement in electronic components mounted in channels was conducted by using different materials in the conductive substrate. In this context, a numerical analysis was performed to investigate the cooling of 3D protruding heaters mounted on the bottom wall (substrate) of a horizontal rectangular channel using the ANSYS/FluentTM 15.0 software. Three different materials of the conductive substrate were analyzed, polymethyl methacrylate (PMMA), fiberglass reinforced epoxy laminate (FR4), and pure aluminum (Al). Uniform heat generation rate was considered for the protruding heaters and the cooling process happened through a steady laminar airflow, with constant properties. The fluid flow velocity and temperature profiles were uniform at the channel entrance. For the adiabatic substrate, the cooling process occurred exclusively by forced convection. For the conductive substrate, the cooling process was characterized by conjugate forced convection-conduction heat transfer through two mechanisms; one directly between the heaters surfaces and the flow by forced convection, and the other through conduction at the interfaces heater-substrate in addition to forced convection from the substrate to the fluid flow at the substrate surface. The governing equations and boundary conditions were numerically solved through a coupled procedure using the Control Volumes Method in a single domain comprising the solid and fluid regions. Commonly used properties in cooling of electronics components mounted in a PCB and typical geometry dimensions were utilized in the results acquisition. Some examples were presented, indicating the dependence of the substrate thermal conductivity related to the Reynolds number on the heat transfer enhancement. Thus, resulting in a lower work temperature at the electronic components.


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