A ROBUST ANALYTIC MODEL OF FOLDED FIN COLD PLATES FOR AUTOMOTIVE POWER ELECTRONICS COOLING

Mapping Intimacies ◽

10.1615/tfec2020.trn.032440 ◽

2020 ◽

Author(s):

Andrew J. Bomar ◽

Thomas M. Adams

Keyword(s):

Power Electronics ◽

Electronics Cooling ◽

Analytic Model ◽

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Numerical optimization of a power electronics cooling assembly

APEC 2001 Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat No 01CH37181) APEC-01 ◽

10.1109/apec.2001.912499 ◽

2002 ◽

Author(s):

G. Xiong ◽

M. Lu ◽

C.-L. Chen ◽

B.P. Wang ◽

D. Kehl

Keyword(s):

Power Electronics ◽

Numerical Optimization ◽

Electronics Cooling

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Application of Two-Phase Loop Thermosyphons and Pulsating Heat-Pipes to Power Electronics Cooling

Encyclopedia of Two-Phase Heat Transfer and Flow III ◽

10.1142/9789813229464_0004 ◽

2018 ◽

pp. 91-155

Author(s):

Bruno Agostini ◽

Daniele Torresin

Keyword(s):

Power Electronics ◽

Electronics Cooling ◽

Two Phase ◽

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1227 Experimental Study on Closed Loop Thermosyphon for Power Electronics Cooling

The Proceedings of Conference of Kansai Branch ◽

10.1299/jsmekansai.2010.85._12-27_ ◽

2010 ◽

Vol 2010.85 (0) ◽

pp. _12-27_

Author(s):

SUTOPO P.F. ◽

Katsuya FUKUDA ◽

Qiusheng LIU

Keyword(s):

Experimental Study ◽

Power Electronics ◽

Closed Loop ◽

Electronics Cooling

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Stereolithographically fabricated aluminum nitride microchannel substrates for integrated power electronics cooling

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2008.4544269 ◽

2008 ◽

Author(s):

Nicholas R. Jankowski ◽

Lauren Everhart ◽

Bruce R. Geil ◽

C. Wesley Tipton ◽

Jared Chaney ◽

...

Keyword(s):

Aluminum Nitride ◽

Power Electronics ◽

Electronics Cooling

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Experimental investigation on heat transfer enhancements in laminar flow with ferrofluids — Application to power electronics cooling

20th International Workshop on Thermal Investigations of ICs and Systems ◽

10.1109/therminic.2014.6972499 ◽

2014 ◽

Author(s):

Wahid Cherief ◽

Martin Wu ◽

Yvan Avenas ◽

Sebastien Ferrouillat ◽

Laurent Jossic ◽

...

Keyword(s):

Heat Transfer ◽

Experimental Investigation ◽

Laminar Flow ◽

Power Electronics ◽

Electronics Cooling

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Potential Refrigerants for Power Electronics Cooling

10.2172/886015 ◽

2005 ◽

Author(s):

M.R. Starke

Keyword(s):

Power Electronics ◽

Electronics Cooling

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Roll-bond condenser in a two-phase thermosyphon loop for power electronics cooling

Advanced Computational Methods and Experiments in Heat Transfer XII ◽

10.2495/ht120181 ◽

2012 ◽

Author(s):

F. Agostini ◽

T. Gradinger

Keyword(s):

Power Electronics ◽

Electronics Cooling ◽

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Numerical study of submerged impinging jets for power electronics cooling

International Journal of Heat and Mass Transfer ◽

10.1016/j.ijheatmasstransfer.2019.06.081 ◽

2019 ◽

Vol 141 ◽

pp. 707-718

Author(s):

Massimo Sabato ◽

Andrea Fregni ◽

Enrico Stalio ◽

Federico Brusiani ◽

Maurizio Tranchero ◽

...

Keyword(s):

Power Electronics ◽

Numerical Study ◽

Electronics Cooling ◽

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Numerical Investigation of Liquid Jet Impingement for Power Electronics Cooling in Electrified Transportation

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ◽

10.1109/itherm51669.2021.9503242 ◽

2021 ◽

Author(s):

Samantha Jones-Jackson ◽

Romina Rodriguez ◽

Manoj Gokhale ◽

Ali Emadi

Keyword(s):

Power Electronics ◽

Numerical Investigation ◽

Electronics Cooling ◽

Jet Impingement ◽

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Power Electronics Cooling Effectiveness Versus Thermal Inertia

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2005.846548 ◽

2005 ◽

Vol 20 (3) ◽

pp. 687-693 ◽

Author(s):

L. Meysenc ◽

M. Jylhakallio ◽

P. Barbosa

Keyword(s):

Power Electronics ◽

Thermal Inertia ◽

Electronics Cooling ◽

Cooling Effectiveness

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