scholarly journals Roll-bond condenser in a two-phase thermosyphon loop for power electronics cooling

2012 ◽  
Author(s):  
F. Agostini ◽  
T. Gradinger
Keyword(s):  
Power Electronics ◽  
Electronics Cooling ◽  
Two Phase

Assessment of Two-Phase Cooling of Power Electronics Using Roll-Bonded Condensers

2014 ◽  
Vol 7 (1) ◽  
Author(s):  
Thomas B. Gradinger ◽  
Francesco Agostini
Keyword(s):  
Thermal Resistance ◽  
Power Electronics ◽  
Power Level ◽  
Electronics Cooling ◽  
Heat Sinks ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Fin Efficiency ◽  
Heat Transfer Coefficients ◽  
Free Air

Two-phase thermosyphons with condensers from roll-bonded panels, short “roll-bond thermosiphons,” are attractive for power-electronics cooling. Using simulations, the performance of roll-bond thermosyphons and classical heat sinks is compared. The roll-bond thermosyphons are advantageous in terms of trade-off between thermal resistance, cooler volume or mass, and sound-power level. Under forced convection, where air-side heat-transfer coefficients are comparatively high, the classical heat sink suffers from low fin efficiency and limited heat spreading. By increasing the number of panels, the roll-bond thermosyphon enables low thermal resistances that cannot be practically reached with classical heat sinks. For free air convection, the roll-bond thermosyphon allows a significant reduction of thermal resistance and cooler mass.

A ROBUST ANALYTIC MODEL OF FOLDED FIN COLD PLATES FOR AUTOMOTIVE POWER ELECTRONICS COOLING

2020 ◽  
Author(s):  
Andrew J. Bomar ◽  
Thomas M. Adams
Keyword(s):  
Power Electronics ◽  
Electronics Cooling ◽  
Analytic Model ◽  
Cold Plates

Review of Two-phase Electronics Cooling for Army Vehicle Applications

2010 ◽  
Author(s):  
Darin Sharar ◽  
Nicholas R. Jankowski ◽  
Brian Morgan
Keyword(s):  
Electronics Cooling ◽  
Two Phase

Passive two-phase cooling for automotive power electronics

2014 ◽  
Author(s):  
Gilberto Moreno ◽  
Jana R. Jeffers ◽  
Sreekant Narumanchi ◽  
Kevin Bennion
Keyword(s):  
Power Electronics ◽  
Two Phase ◽  
Two Phase Cooling

Two-Phase Flow in Microchannels

2001 ◽  
Author(s):  
G. Hetsroni ◽  
A. Mosyak ◽  
Z. Segal
Keyword(s):  
Heat Sink ◽  
High Speed ◽  
Single Phase ◽  
Flow Boiling ◽  
Electronics Cooling ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Two Phase ◽  
Infrared Radiometry ◽  
Phase Water

Abstract Experimental investigation of a heat sink for electronics cooling is performed. The objective is to keep the operating temperature at a relatively low level of about 323–333K, while reducing the undesired temperature variation in both the streamwise and transverse directions. The experimental study is based on systematic temperature, flow and pressure measurements, infrared radiometry and high-speed digital video imaging. The heat sink has parallel triangular microchannels with a base of 250μm. According to the objectives of the present study, Vertrel XF is chosen as the working fluid. Experiments on flow boiling of Vertrel XF in the microchannel heat sink are performed to study the effect of mass velocity and vapor quality on the heat transfer, as well as to compare the two-phase results to a single-phase water flow.

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

2001 ◽  
Author(s):  
S. I. Haider ◽  
Yogendra K. Joshi ◽  
Wataru Nakayama
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Closed Loop ◽  
Two Phase Flow ◽  
Natural Circulation ◽  
Saturation Temperature ◽  
Electronics Cooling ◽  
Phase Flow ◽  
Two Phase

Abstract The study presents a model for the two-phase flow and heat transfer in the closed loop, two-phase thermosyphon (CLTPT) involving co-current natural circulation. Most available models deal with two-phase thermosyphons with counter-current circulation within a closed, vertical, wickless heat pipe. The present research focuses on CLTPTs for electronics cooling that face more complex two-phase flow patterns than the vertical heat pipes, due to closed loop geometry and smaller tube size. The present model is based on mass, momentum, and energy balances in the evaporator, rising tube, condenser, and the falling tube. The homogeneous two-phase flow model is used to evaluate the friction pressure drop of the two-phase flow imposed by the available gravitational head through the loop. The saturation temperature dictates both the chip temperature and the condenser heat rejection capacity. Thermodynamic constraints are applied to model the saturation temperature, which also depends upon the local heat transfer coefficient and the two-phase flow patterns inside the condenser. The boiling characteristics of the enhanced structure are used to predict the chip temperature. The model is compared with experimental data for dielectric working fluid PF-5060 and is in general agreement with the observed trends. The degradation of condensation heat transfer coefficient due to diminished vapor convective effects, and the presence of subcooled liquid in the condenser are expected to cause higher thermal resistance at low heat fluxes. The local condensation heat transfer coefficient is a major area of uncertainty.

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