scholarly journals The Influence of Technological Factors on Physico-Mechanical Properties and Electrical Conductivity of Copper Matrix Composite Materials

2018 ◽  
Vol 11 (4) ◽  
pp. 427-432
Author(s):  
Trunova Alina I. ◽  
◽  
Babkin Vladimir G. ◽  
2007 ◽  
Vol 534-536 ◽  
pp. 929-932 ◽  
Author(s):  
Tungwai Leo Ngai ◽  
Zhi Yu Xiao ◽  
Yuan Biao Wu ◽  
Yuan Yuan Li

Conventional powder metallurgy processing can produce copper green compacts with density less than 8.3 g/cm3 (a relative density of 93%). Performances of these conventionally compacted materials are substantially lower than their full density counterparts. Warm compaction, which is a simple and economical forming process to prepare high density powder metallurgy parts or materials, was employed to develop a Ti3SiC2 particulate reinforced copper matrix composite with high density, high electrical conductivity and high strength. In order to clarify the warm compaction behaviors of copper powder and to optimize the warm compaction parameters, effects of lubricant concentration and compaction pressure on the green density of the copper compacts were studied. Copper compact with a green density of 8.57 g/cm3 can be obtained by compacting Cu powder with a pressure of 700 MPa at 145°C. After sintered at 1000°C under cracked ammonia atmosphere for 60 minutes, density of the sintered compact reached 8.83 g/cm3 (a relative density of 98.6%). Based on these fabrication parameters a Ti3SiC2 particulate reinforced copper matrix composite was prepared. Its density, electrical conductivity, ultimate tensile strength, elongation percentage and tribological behaviors were studied.


2011 ◽  
Vol 183-185 ◽  
pp. 1586-1590
Author(s):  
Wei Ping Liu

Copper slag was used to prepare copper powder by way of slurry electrolysis, and the copper powder was used to fabricate copper matrix composite materials reinforced with chemical plating surface modified alumina particulates. Alumina particulates were pretreated in ultrasonic field by chemical copper plating in order to make alumina particulates covered with a layer of copper film and form Al2O3/Cu composite powders. Copper matrix composite materials strengthened with alumina particulates were synthesized by means of pressure molding and sintering. Microstructure of copper matrix composites was researched by means of SEM. SEM analysis shows that alumina particulates distribute in the copper-based body evenly, and combine with copper closely. The effects of sintering temperature, pressure and alumina content on the compactness and hardness of copper matrix composites were studied by orthogonal tests. The compactness of composites increases with the sintering temperature and pressure increasing, and decreases with the alumina content increasing. The hardness of composite materials increases with the sintering temperature, pressure and alumina particulates increasing.


2006 ◽  
Vol 532-533 ◽  
pp. 596-599 ◽  
Author(s):  
Tungwai Leo Ngai ◽  
Yuan Yuan Li ◽  
Zhao Yao Zhou

Increasing density is the best way to increase the performance of powder metallurgy materials. Conventional powder metallurgy processing can produce copper green compacts with density less than 8.3g/cm3 (a relative density of 93%). Performances of these conventionally compacted materials are substantially lower than their full density counterparts. Warm compaction, which is a simple and economical forming process to prepare high density powder metallurgy parts or materials, was employed to develop a Ti3SiC2 particulate reinforced copper matrix composite with high strength, high electrical conductivity and good tribological behaviors. Ti3SiC2 particulate reinforced copper matrix composites, with 1.25, 2.5 and 5 mass% Ti3SiC2 were prepared by compacting powder with a pressure of 700 MPa at 145°C, then sintered at 1000°C under cracked ammonia atmosphere for 60 minutes. Their density, electrical conductivity and ultimate tensile strength decrease with the increase in particulate concentration, while hardness increases with the increase in particulate concentration. A small addition of Ti3SiC2 particulate can increase the hardness of the composite without losing much of electrical conductivity. The composite containing 1.25 mass% Ti3SiC2 has an ultimate tensile strength of 158 MPa, a hardness of HB 58, and an electrical resistivity of 3.91 x 10-8 Ω.m.


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