Effect of Untreated and Alkaline-Cleaned Surfaces on the Joint Strength of Plastic-Metal-Hybrids

2018 ◽  
Vol 6 (1) ◽  
pp. 23-31
Author(s):  
Birte Horn ◽  
◽  
Angela Ries ◽  
Wiebke Sophie Junior ◽  
Markus Kühn ◽  
...  
2017 ◽  
Vol 10 (1) ◽  
pp. 44-49
Author(s):  
Leo Hoffmann ◽  
Birgit Faißt ◽  
Kim Kose ◽  
Fred Eggers

2018 ◽  
Vol 38 (6) ◽  
pp. 583-589
Author(s):  
Christian Hopmann ◽  
Julian Schild ◽  
Simon Wurzbacher ◽  
A. Erman Tekkaya ◽  
Sigrid Hess

Abstract The combined deep drawing and back-moulding process shows great potential to reduce manufacturing costs of plastic/metal hybrids for structural components. To achieve this, a new mould technology with the components of both forming technologies is developed. By closing the mould, the inserted metal sheet is first deep drawn, and when the mould is fully closed, it is further formed by melt pressure. It can be shown that the forming quality of the second forming step mainly depends on the packing pressure. For a controlled flow of the metal, a downholder is necessary. By adjusting the downholder, force on the thinning of the metal through forming can be controlled.


Materials ◽  
2021 ◽  
Vol 14 (17) ◽  
pp. 5004
Author(s):  
Julius Moritz Berges ◽  
Kira van der Straeten ◽  
Georg Jacobs ◽  
Jörg Berroth ◽  
Arnold Gillner

Plastic-metal joints with a laser-structured metal surface have a high potential to reduce cost and weight compared to conventional joining technologies. However, their application is currently inhibited due to the absence of simulation methods and models for mechanical design. Thus, this paper presents a model-based approach for the strength estimation of laser-based plastic-metal joints. The approach aims to provide a methodology for the efficient creation of surrogate models, which can capture the influence of the microstructure parameters on the joint strength. A parametrization rule for the shape of the microstructure is developed using microsection analysis. Then, a parameterized finite element (FE) model of the joining zone on micro level is developed. Different statistical plans and model fits are tested, and the predicted strength of the FE model and the surrogate models are compared against experiments for different microstructure geometries. The joint strength is predicted by the FE model with a 3.7% error. Surrogate modelling using half-factorial experimental design and linear regression shows the best accuracy (6.2% error). This surrogate model can be efficiently created as only 16 samples are required. Furthermore, the surrogate model is provided as an equation, offering the designer a convenient tool to estimate parameter sensitivities.


2011 ◽  
Vol 12 ◽  
pp. 370-377 ◽  
Author(s):  
Andreas Roesner ◽  
Sven Scheik ◽  
Alexander Olowinsky ◽  
Arnold Gillner ◽  
Uwe Reisgen ◽  
...  
Keyword(s):  

2019 ◽  
Vol 8 ◽  
pp. 804-811
Author(s):  
Tobias Gebken ◽  
Markus Kühn ◽  
Michael Demes ◽  
Anke Müller ◽  
Klaus Dröder

2011 ◽  
Vol 1 (9) ◽  
pp. 93-96
Author(s):  
S. S. Kadam S. S. Kadam ◽  
◽  
P. A. Dixit P. A. Dixit

2018 ◽  
Vol 33 (5) ◽  
pp. 706-713
Author(s):  
L.-M. Wittmann ◽  
T. Kleffel ◽  
T. Mattner ◽  
D. Drummer
Keyword(s):  

Author(s):  
Prong Kongsubto ◽  
Sirarat Kongwudthiti

Abstract Organic solderability preservatives (OSPs) pad is one of the pad finishing technologies where Cu pad is coated with a thin film of an organic material to protect Cu from oxidation during storage and many processes in IC manufacturing. Thickness of OSP film is a critical factor that we have to consider and control in order to achieve desirable joint strength. Until now, no non-destructive technique has been proposed to measure OSP thickness on substrate. This paper reports about the development of EDS technique for estimating OSP thickness, starting with determination of the EDS parameter followed by establishing the correlation between C/Cu ratio and OSP thickness and, finally, evaluating the accuracy of the EDS technique for OSP thickness measurement. EDS quantitative analysis was proved that it can be utilized for OSP thickness estimation.


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