Joining YSZ electrolyte to AISI 441 interconnect for solid oxide cells using the Ag interlayer: Enhanced mechanical and aging properties
Abstract Conventional Ag-CuO braze can lead to two electrolyte/interconnect joining issues: over-oxidation at the steel interconnect and hydrogen-induced decomposition of CuO. This work demonstrates that a pure Ag interlayer, instead of Ag-CuO braze, can join YSZ electrolyte to AISI 441 interconnect in air. Reliable joining between YSZ and AISI 441 can be realized at 920 °C. A dense and thin oxide layer (~2 μm) is formed at the AISI 441 interface. Also, an interatomic joining at the YSZ/Ag interface is detected by TEM observation. Obtained joints display high shear strengths (~86.1 MPa), 161% higher than that of joints brazed by Ag-CuO braze (~33 MPa). After aging in reducing and oxidizing atmospheres (800 °C/300 h), joints remain tight and dense, indicating a better aging performance. This technique eliminates the CuO-induced issues, which will extend lifetimes for SOFC/SOEC stacks and other ceramic/metal joining applications.
Joining 3YSZ Electrolyte to AISI 441 Interconnect Using the Ag Particle Interlayer: Enhanced Mechanical and Aging Properties
