Strengthening Κ-Carbide Steels Using Residual Dislocation Content

2021 ◽  
Author(s):  
Thomas Wei Jie Kwok ◽  
Khandaker Mezanur Rahman ◽  
Vassili A. Vorontsov ◽  
David Dye
Keyword(s):  
2019 ◽  
Vol 117 (1) ◽  
pp. 196-204 ◽  
Author(s):  
John P. Hirth ◽  
Greg Hirth ◽  
Jian Wang

A different type of defect, the coherency disclination, is added to disclination types. Disconnections that include disclination content are considered. A criterion is suggested to distinguish disconnections with dislocation content from those with disclination content. Electron microscopy reveals unit disconnections in a low albite grain boundary, defects important in grain boundary sliding. Disconnections of varying step heights are displayed and shown to define both deformed and recovered structures.


2007 ◽  
Vol 46 (No. 14) ◽  
pp. L307-L310 ◽  
Author(s):  
Krishnan Balakrishnan ◽  
Akria Bandoh ◽  
Motoaki Iwaya ◽  
Satoshi Kamiyama ◽  
Hiroshi Amano ◽  
...  

1982 ◽  
Vol 14 ◽  
Author(s):  
Mark Vaudin ◽  
Dieter Ast

ABSTRACTThe dislocation structure of a near coincidence Σ=5 [001]twist boundary in silicon was studied using transmission electron microscopy. Secondary dislocations, with localized cores, were observed in the boundary accommodating a small deviation (<.5°) from perfect coincidence. The O-lattice theory for general low angle boundaries was extended to calculate the expected dislocation content of near coincidence boundaries. Comparison between predictions and observations was used to deduce information on the primary dislocation structure of the boundary.


2013 ◽  
Vol 205-206 ◽  
pp. 65-70
Author(s):  
Ali Ghaderi ◽  
Semih Senkader

A major performance limiting factor of multicrystalline silicon wafers is structural defects, mainly dislocations, reducing solar cell efficiency. Dislocations are formed during crystallisation process. Characterization of dislocation-content is necessary both to optimise the crystallisation and to eliminate bad wafers before cell processing. We developed two techniques to characterise dislocations: conventional etch-pit counting modified for full size wafers using a new etch-recipe and a novel etch-pit counting algorithm. Secondly we developed a technique to estimate the dislocation content directly from photoluminescence images of as-cut wafers.


2018 ◽  
Vol 134 (3) ◽  
pp. 692-694 ◽  
Author(s):  
V. Paidar ◽  
A. Ostapovets ◽  
T. Káňa

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