Abstract
The physiochemical effect on the microcutting of pure copper is studied through characterization on the cross-sectioned microgroove. An obvious reduction in cutting force and thrust force can be obtained with the application of ink surfactant. The surface roughness of microgroove with physiochemical effect is 12 nm, and that without physiochemical effect is 17 nm. The average grain size of the ink-affected sample is 67.9 µm within the microgroove zone, and that of the ink-free sample is 48.3 µm within the microgroove zone, moreover, the grain size of ink-free microgroove near the microgroove surface is larger than that far away from the microgroove surface. Additionally, the grain orientations of ink-affected cross-sectioned surface present anisotropy, while that of ink-free cross-sectioned surface are towards {101} direction. Based on the calculation and analysis of geometrically necessary dislocation, it can be inferred that the induced stress and temperature in the sample with physiochemical effect are higher than that without physiochemical effect, which can provide enough driving energy for recrystallization.