Improving the efficiency of cyclic devices for collecting and processing information in monitoring and vibration diagnostics systems

2017 ◽  
Vol 11 (1) ◽  
pp. 81-94 ◽  
Author(s):  
A. P. Moroz ◽  
T. S. Abbasova ◽  
M. E. Stavrovsky

Identified the problem of increasing the efficiency of the collection device and the processing of information in telemetry monitoring systems and vibration diagnostics. The possibilities of CAD-programs for the calculation of vibro-impact processes and random vibration devices and printed circuit boards. A study of the frequency and random vibration study on the example of the PCB in SolidWorks environment. Abstract purpose, principle of operation, characteristics of the onboard telemetry information «Pyrite» system for measuring the parameters of aircraft, which are characterized by different phases and the duration of the flight telemetered site; It shows that the «Pyrite» equipment can be effectively used for the integrated telemetry information slowly evolving processes and rapidly changing processes of aircraft.

2000 ◽  
Author(s):  
James F. Tarter

Abstract Finite element analysis has been used in conjunction with developed algorithms to analyze forced response and random vibration response of printed circuit boards. Analytical predictions have been compared to random vibration test data for model correlation and validation of the analysis methods. The described methods provide design data for predicting deflections and G levels as a function of frequency or predicting RMS levels for random excitation. These data are utilized for initiating design changes and guiding component placement. Deflection versus frequency contributions for random excitation are analyzed to identify critical design frequencies. Forced response contour plots include effects of modal coupling, modal participation factors, and system damping. These data provide a better description of the expected operating deflection shapes man a simple mode shape. All of these methods are used to improve design integrity and ensure specification compliance prior to hardware fabrication. The analyses utilize aggregate board properties, and do not currently provide data for individual components which are installed on the board.


2020 ◽  
Vol 20 (3) ◽  
pp. 920-929
Author(s):  
S. G. S. Karthiheyan ◽  
Virendra Kumar Verma ◽  
S. Saravanan ◽  
Venkateshwaran Pappiah Ayyappan ◽  
Karthik Sathiyaseelan ◽  
...  

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara

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