scholarly journals COMMENTS ON THE RANGE OF APPLICABILITY OF THE GRAIN BOUNDARY (SECONDARY) DISLOCATION MODEL TO HIGH ANGLE GRAIN BOUNDARIES.

1972 ◽  
Author(s):  
R.W. Balluffi ◽  
T.Y. Tan
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Dislocation Model ◽  
High Angle ◽  
Secondary Dislocation

Measurement of the Displacement Across a Coincidence Grain Boundary

1977 ◽  
Vol 35 ◽  
pp. 124-125
Author(s):  
J. W. Matthews ◽  
W. M. Stobbs
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Stacking Fault ◽  
The Other ◽  
Measuring Technique ◽  
High Angle ◽  
Twin Boundaries ◽  
Rigid Displacement ◽  
Cubic Crystals ◽  
Lattice Displacement

Many high-angle grain boundaries in cubic crystals are thought to be either coincidence boundaries (1) or coincidence boundaries to which grain boundary dislocations have been added (1,2). Calculations of the arrangement of atoms inside coincidence boundaries suggest that the coincidence lattice will usually not be continuous across a coincidence boundary (3). There will usually be a rigid displacement of the lattice on one side of the boundary relative to that on the other. This displacement gives rise to a stacking fault in the coincidence lattice.Recently, Pond (4) and Smith (5) have measured the lattice displacement at coincidence boundaries in aluminum. We have developed (6) an alternative to the measuring technique used by them, and have used it to find two of the three components of the displacement at {112} lateral twin boundaries in gold. This paper describes our method and presents a brief account of the results we have obtained.

Observations of dislocation interactions with recrystallized grain boundaries

1988 ◽  
Vol 46 ◽  
pp. 628-629
Author(s):  
C. W. Price
Keyword(s):  
Dislocation Density ◽  
Grain Boundary ◽  
Strain Rate ◽  
Grain Boundaries ◽  
Dislocation Structure ◽  
Hot Deformation ◽  
Static Recrystallization ◽  
High Dislocation Density ◽  
High Angle ◽  
Dislocation Interactions

Little evidence exists on the interaction of individual dislocations with recrystallized grain boundaries, primarily because of the severely overlapping contrast of the high dislocation density usually present during recrystallization. Interesting evidence of such interaction, Fig. 1, was discovered during examination of some old work on the hot deformation of Al-4.64 Cu. The specimen was deformed in a programmable thermomechanical instrument at 527 C and a strain rate of 25 cm/cm/s to a strain of 0.7. Static recrystallization occurred during a post anneal of 23 s also at 527 C. The figure shows evidence of dissociation of a subboundary at an intersection with a recrystallized high-angle grain boundary. At least one set of dislocations appears to be out of contrast in Fig. 1, and a grainboundary precipitate also is visible. Unfortunately, only subgrain sizes were of interest at the time the micrograph was recorded, and no attempt was made to analyze the dislocation structure.

scholarly journals Image Simulations of Ge Twin Boundaries.

1992 ◽  
Vol 295 ◽  
Author(s):  
Stuart Mckernan ◽  
C. Barry Carter
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
High Angle ◽  
Structural Units ◽  
Twin Boundaries ◽  
Large Unit ◽  
Unit Cells ◽  
The Individual ◽  
Image Simulations

AbstractGeneral high-angle tilt grain boundaries may be described by an arrangement of repeating structural units. Some grain-boundary defects may also be modeled by the incorporation of structural units of related boundary structures into the boundary. The simulation of these structures requires the use of prohibitively large unit cells. The possibility of modeling these boundaries by the superposition of image simulations of the individual structural units isinvestigated.

Fracture Strengths of Individual Grain Boundaries in Ni3Ai Using a Miniaturized Disk Bend Test

1991 ◽  
Vol 238 ◽  
Author(s):  
Douglas E. Meyers ◽  
Alan J. Ardell
Keyword(s):  
Plastic Deformation ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Grain Growth ◽  
Coincident Site Lattice ◽  
Bend Test ◽  
High Angle ◽  
Load Drop ◽  
Site Lattice ◽  
Special Boundaries

ABSTRACTThe results of our initial efforts at measuring the fracture strengths of grain boundaries In Ni3Al using a miniaturized disk-bend test are presented. The samples tested were 3 mm in diameter and between 150 and 300 μm thick. An Ingot of directlonally-solidlfled, boron-free Ni3Al containing 24% Al was annealed between 1300 and 1350 °C to induce grain growth, producing many grain boundaries In excess of 1.5 mm in length. Specimens were cut from these In such a way that one long grain boundary was located near a diameter of the specimen. The relative orientations of the grains on either side of the boundary were determined from electron channeling patterns. Low-angle boundaries are so strong they do not fracture; Instead the samples deform In a completely ductile manner. High-angle boundaries always fracture, but only after considerable plastic deformation of the two grains flanking them. Fracture is Indicated by a load drop in the load vs. displacement curves. A method involving extrapolation of the elastic portion of these curves to the displacement at fracture is used to estimate the fracture stresses. This procedure yields consistent values of the fracture strengths of high-angle boundaries. The measured stresses are large (∼2 to 3 GPa), but considerably smaller than those required for the fracture of special boundaries, as predicted by computer simulations. No correlation was found between the fracture stresses or loads and the geometry of the high-angle boundaries, many of which are close to, but deviate from, coincident site lattice orientations.

Observations and implications of grain boundary dislocation networks in high-angle YBa2Cu3O7−δ grain boundaries

1990 ◽  
Vol 5 (5) ◽  
pp. 919-928 ◽  
Author(s):  
S. E. Babcock ◽  
D. C. Larbalestier
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Weak Link ◽  
Coincidence Site Lattice ◽  
Boundary Structure ◽  
High Angle ◽  
Grain Boundary Structure ◽  
Transmission Electron ◽  
Means Of Transmission ◽  
Regular Networks

Regular networks of localized grain boundary dislocations (GBDs) have been imaged by means of transmission electron microscopy in three different types of high-angle grain boundaries in YBa2Cu3O7-δ, implying that these boundaries possess ordered structures upon which a significant periodic strain field is superimposed. The occurrence of these GBD networks is shown to be consistent with the GBD/Structural Unit and Coincidence Site Lattice (CSL)/Near CSL descriptions for grain boundary structure. Thus, these dislocations appear to be intrinsic features of the boundary structure. The spacing of the observed GBDs ranged from ∼10 nm to ∼100 nm. These GBDs make the grain boundaries heterogeneous on a scale that approaches the coherence length and may contribute to their weak-link character by producing the “superconducting micro-bridge” microstructure which has been suggested on the basis of detailed electromagnetic measurements on similar samples.

Microstructure characterization of one-directionally oriented ulexite

1998 ◽  
Vol 13 (3) ◽  
pp. 778-783 ◽  
Author(s):  
Yumi H. Ikuhara ◽  
Shinji Kondoh ◽  
Koichi Kikuta ◽  
Shin-ichi Hirano
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Small Angle ◽  
Stacking Faults ◽  
Contact Angles ◽  
Light Transmittance ◽  
High Angle ◽  
Electron Dose ◽  
Bundle Structure

Microstructures of ulexite were investigated by CTEM and low electron dose HREM. It was found that the longitudinal grains in ulexite were oriented to c-direction to form a bundle structure. There were a number of small-angle grain boundaries and stacking faults inside a grain in the ulexite. Cleavage microcracks and stacking faults were mostly introduced on the {010} of the ulexite. The high-angle grain boundaries mainly consisted of high coincidence boundaries, which was confirmed by a comparison of observed contact angles and calculated degree of coincidence at the boundaries. The light transmittance properties of the ulexite would depend on the defects such as stacking fault, small-angle grain boundary, and high-angle grain boundary.

Grain Boundary Mechanics – Influence of Mechanical Stress Fields on Grain Boundaries

2004 ◽  
Vol 819 ◽  
Author(s):  
Myrjam Winning
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Mechanical Stress ◽  
Rotation Axis ◽  
Temperature Deformation ◽  
High Angle ◽  
Symmetric Tilt ◽  
In Situ Experiments ◽  
Grain Boundary Motion

AbstractThe reaction of grain boundaries to mechanical stresses is reviewed. Results of in-situ experiments on planar, symmetric tilt grain boundaries with different tilt axes (<112>, <111> and <100>) as well as twist grain boundaries with <100> rotation axis will be presented. It was found that the motion of planar grain boundaries can be induced by an imposed external stress irrespective of the angle of misorientation i.e. irrespective whether the grain boundary was a low or high angle grain boundary. The observed activation enthalpies of the stress induced grain boundary motion allow conclusions on the migration mechanism. The motion of planar low and high angle grain boundaries under the influence of a mechanical stress field can be attributed to the movement of the grain boundary dislocations which comprise the structure of the boundary. A sharp transition between low and high angle grain boundaries was observed for different tilt axes. The fact that boundaries can also be moved by mechanical forces sheds new light on microstructure evolution during elevated temperature deformation.

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