scholarly journals Pemodelan 3D Lapisan Dasar Laut Dan Identifikasi Ketebalan Sedimen Berdasarkan Kombinasi Data Pengukuran Sub-Bottom Profiler Dan Single Beam Echosounder (Studi Kasus: Alur Akses Timur Surabaya)

2021 ◽  
Vol 4 (2) ◽  
pp. 124
Author(s):  
Windy Hapsari ◽  
Bambang Kun Cahyono
Keyword(s):  
Sound Velocity ◽  
Single Beam

Pelabuhan merupakan salah satu fasilitas umum yang memiliki peran penting dalam keselamatan navigasi pelayaran. Shipping yang aman harus didukung dengan pemantauan dan pemeliharaan secara berkala untuk mendapatkan informasi terkini tentang kedalaman, dasar laut, dan sedimentasi. Jika sedimentasi terakumulasi secara terus menerus dalam waktu singkat di alur akses (jalur pelayaran), maka dapat meningkatkan kemungkinan terjadinya kecelakaan kapal. Kajian ini mencoba memetakan dan menganalisis kondisi batimetri dan sedimentasi untuk mendukung pemantauan dan pemeliharaan rutin alur akses Timur Pelabuhan Tanjung Perak Surabaya. Metode yang digunakan dalam penelitian ini adalah survei akustik berdasarkan data pengukuran Sub-Bottom Profiler (SBP) dan Single Beam Echosounder (SBES). Data yang diperoleh kemudian dikoreksi oleh Sound Velocity Profiler (SVP), data pasang surut, dan draft transduser. Kualitas data kemudian diuji berdasarkan IHO SP-44 2008 dan uji t-studentized dengan tingkat kepercayaan 95%. Hasil dari penelitian ini adalah model 3 dimensi, profil kedalaman, ketebalan, dan volume lapisan sedimen dasar laut. Hasil penelitian menunjukkan bahwa alur akses Timur Surabaya memiliki empat lapisan dasar laut yaitu permukaan dan tiga lapisan sedimen di bawahnya. Kedalaman lapisan bervariasi antara 3 m sampai 16,8 m. Kualitas data kedalaman lapisan atas dikontrol oleh IHO S-44 2008 dengan nilai uji hitung 0,509 (nilai toleransi ± 0,509), sedangkan kualitas data SBP (diukur menggunakan t-studentized uji) mendapatkan nilai hitung sebesar -1,287 dengan toleransi ± 1,96. Artinya kualitas datanya bagus. Berdasarkan model 3d, rata-rata ketebalan lapisan secara berurutan adalah 5,84 m, 1,072 m, 0,758 m, dan 6.355 m, sedangkan total volume sedimen adalah 24.894.422,949 m3.

Sound velocity of glassy Pd 80 Si 20 after heavy-ion irradiation at low temperatures

2002 ◽  
Vol 82 (11) ◽  
pp. 2333-2339
Author(s):  
G. Schumacher ◽  
R. C. Birtcher ◽  
D. P. Renusch ◽  
M. Grimsditch ◽  
L. E. Rehn
Keyword(s):  
Sound Velocity ◽  
Low Temperatures ◽  
Ion Irradiation ◽  
Heavy Ion ◽  
Heavy Ion Irradiation

Experimental Study of Particle Size, Sound Velocity, and Resonance Phenomena in a Two-Phase Foam Flow

2001 ◽  
Vol 32 (4-6) ◽  
pp. 5
Author(s):  
A. P. Sevast'yanov ◽  
I. V. An ◽  
S. I. Vainshtein ◽  
Yu. A. Sevast'yanov ◽  
A. V. Sidnev ◽  
...  
Keyword(s):  
Experimental Study ◽  
Particle Size ◽  
Sound Velocity ◽  
Two Phase ◽  
Foam Flow ◽  
Resonance Phenomena

Fabrication of two-layer integrated phase mask and single-beam, single exposure fabrication of 3D photonic crystal template using the mask

2008 ◽  
Author(s):  
Yuankun Lin ◽  
Ahmad Harb ◽  
Daniel Rodriguez ◽  
Karen Lozano ◽  
Di Xu ◽  
...  
Keyword(s):  
Photonic Crystal ◽  
Phase Mask ◽  
Single Exposure ◽  
Single Beam

Optimizing Gas-Assisted Processes for Ga and Xe FIB Circuit Edit Application

2016 ◽  
Author(s):  
Valery Ray ◽  
Josef V. Oboňa ◽  
Sharang Sharang ◽  
Lolita Rotkina ◽  
Eddie Chang ◽  
...  
Keyword(s):  
Inductively Coupled Plasma ◽  
Structural Damage ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Beam Width ◽  
Ion Source ◽  
Reconstruction Technique ◽  
Beam Diameter ◽  
Current Profile ◽  
Single Beam

Abstract Despite commercial availability of a number of gas-enhanced chemical etches for faster removal of the material, there is still lack of understanding about how to take into account ion implantation and the structural damage by the primary ion beam during focused ion beam gas-assisted etching (FIB GAE). This paper describes the attempt to apply simplified beam reconstruction technique to characterize FIB GAE within single beam width and to evaluate the parameters critical for editing features with the dimensions close to the effective ion beam diameter. The approach is based on reverse-simulation methodology of ion beam current profile reconstruction. Enhancement of silicon dioxide etching with xenon difluoride precursor in xenon FIB with inductively coupled plasma ion source appears to be high and relatively uniform over the cross-section of the xenon beam, making xenon FIB potentially suitable platform for selective removal of materials in circuit edit application.

Sample Preparation and Preservation for TEM Analysis of Copper Interconnect Integrated Circuit

2004 ◽  
Author(s):  
Qiang Gao ◽  
Mark Zhang ◽  
Ming Li ◽  
Chorng Niou ◽  
W.T. Kary Chien
Keyword(s):  
Integrated Circuit ◽  
Thermal Exposure ◽  
Ambient Atmosphere ◽  
Ion Milling ◽  
Tem Analysis ◽  
Single Beam ◽  
Copper Interconnect ◽  
Beam Modulation ◽  
Area Of Interest ◽  
Transmission Electron

Abstract This paper examines copper-interconnect integrated circuit transmission electron microscope (TEM) sample contamination. It investigates the deterioration of the sample during ion milling and storage and introduces prevention techniques. The paper discusses copper grain agglomeration issues barrier/seed step coverage checking. The high temperature needed for epoxy solidifying was found to be harmful to sidewall coverage checking of seed. Single beam modulation using a glass dummy can efficiently prevent contamination of the area of interest in a TEM sample during ion milling. Adoption of special low-temperature cure epoxy resin can greatly reduce thermal exposure of the sample and prevent severe agglomeration of copper seed on via sidewall. TEM samples containing copper will deteriorate when stored in ordinary driers and sulphur contamination was found at the deteriorated point on the sample. Isolation of the sample from the ambient atmosphere has been verified to be very effective in protecting the TEM sample from deterioration.

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