Developing Diffusion Bonding Windows for Joining Powder Metallurgically Produced Pure Aluminium and Pure Copper

2014 ◽  
Vol 47 (1) ◽  
pp. 43
Author(s):  
A. Murugan ◽  
T. Senthilvelan ◽  
V. Balasubramanian
2017 ◽  
Vol 115 (1) ◽  
pp. 115 ◽  
Author(s):  
Gopinath Thirunavukarasu ◽  
Sukumar Kundu ◽  
Tapas Laha ◽  
Deb Roy ◽  
Subrata Chatterjee

An investigation was carried out to know the extent of influence of bonding-time on the interface structure and mechanical properties of diffusion bonding (DB) of TiA|Cu|SS. DB of Ti6Al4V (TiA) and 304 stainless steel (SS) using pure copper (Cu) of 200-μm thickness were processed in vacuum using 4-MPa bonding-pressure at 1123 K from 15 to 120 min in steps of 15 min. Preparation of DB was not possible when bonding-time was less than 60 min as the bonding at Cu|SS interface was unsuccessful in spite of effective bonding at TiA|Cu interface; however, successful DB were produced when the bonding-time was 60 min and beyond. DB processed for 60 and 75 min (classified as shorter bonding-time interval) showed distinctive characteristics (structural, mechanical, and fractural) as compared to the DB processed for 90, 105, and 120 min (classified as longer bonding-time interval). DB processed for 60 and 75 min exhibited layer-wise Cu–Ti-based intermetallics at TiA|Cu interface, whereas Cu|SS interface was completely free from reaction products. The layer-wise structure of Cu–Ti-based intermetallics were not observed at TiA|Cu interface in the DB processed for longer bonding-time; however, the Cu|SS interface had layer-wise ternary intermetallic compounds (T1, T2, and T3) of Cu–Fe–Ti-based along with σ phase depending upon the bonding-time chosen. Diffusivity of Ti-atoms in Cu-layer (DTi in Cu-layer) was much greater than the diffusivity of Fe-atoms in Cu-layer (DFe in Cu-layer). Ti-atoms reached Cu|SS interface but Fe-atoms were unable to reach TiA|Cu interface. It was observed that DB fractured at Cu|SS interface when processed for shorter bonding-time interval, whereas the DB processed for longer bonding-time interval fractured apparently at the middle of Cu-foil region predominantly due to the existence of brittle Cu–Fe–Ti-based intermetallics.


2013 ◽  
Vol 773-774 ◽  
pp. 818-823 ◽  
Author(s):  
Yasunori Harada ◽  
Masayuki Nunobiki

In shot peening, bombarding the surface with steel shot propelled at high velocity causes plastic deformation of surface. The process with the characteristic deformation was applied to joining process. Our approach has been applied to the butt joining of the dissimilar metal sheets. In this method, however, the joint strength was lower than the flow stress of base metal. The modified joining processing was being carried out to improve the bondability. In the present study, the joining of dissimilar metal sheets using a shot peening process was investigated to improve the bondability. In the joined section, the edge of the joint area of the sheets were slit using a laser. In this method, the edges of the sheet are overlapped the other sheet. When the connection is peened, the material undergoes large plastic deformation near the surface due to the collision of shots. In this process, particularly noteworthy is the plastic flow near surface layer. The edges of the sheet are joined to the other sheet, thus two sheets can be joined each other. In the experiment, the shot peening treatment was performed by using an air-type peening machine. The shots used were made of high carbon cast steel. Air pressure was 0.6 MPa and peening time was in the range of 30-240s. The metal sheets were commercial low-carbon steel, stainless steel, pure aluminium, aluminium alloy, and pure copper. The effects of processing conditions on the bondability were mainly examined. It was found that the present method was effective for joining of dissimilar metal sheets.


2019 ◽  
Vol 14 (2) ◽  
pp. 30-39 ◽  
Author(s):  
Ahmed Ali Akbar Akbar ◽  
Sami Abualnoun A Ajeel ◽  
Safaa Mohammed Hassoni

This work deals with determination of optimum conditions of direct diffusion bonding welding of austenitic stainlesssteel type AISI 304L with Oxygen Free High Conductivity (OFHC) pure copper grade (C10200) in vacuum atmosphere of (1.5 *10-5 mbr.). Mini tab (response surface) was applied for optimizing the influence of diffusion bonding parameters (temperature, time and applied load) on the bonding joints characteristics and the empirical relationship was evaluated which represents the effect of each parameter of the process. The yield strength of diffusion bonded joint was equal to 153 MPa and the efficiency of joint was equal to 66.5% as compared with hard drawn copper. The diffusion zone reveals high microhardness than copper side due to solid solution phase formation of (CuNi). The failure of bonded joints always occurred on the copper side and fracture surface morphologies are characterized by ductile failure mode with dimple structure. Optimum bonding conditions were observed at temperature of 650 ◦C, duration time of 45 min. and the applied stress of 30 MPa. The maximum depth of diffuse copper in stainless steel side was equal 11.80 µm.


2018 ◽  
Vol 21 (1) ◽  
pp. 74
Author(s):  
Sami Abualnoun Ajeel ◽  
Ahmed Ali Akbar Akbar ◽  
Safaa Mohammed Hassoni

The present work deals with direct diffusion bonding welding without interlayer of austenitic stainless steel type AISI 304L with Oxygen Free High Conductivity pure copper (OFHC) in vacuum atmosphere (1.5 *10-5 mbr.). The optimum bonding conditions are temperature of 650 ◦C, duration time of 45 min. and the applied stress of 30 MPa, in order to secure a tight contact between the mating surfaces. The corrosion behavior of diffusion bonding joints in 3.5% Nacl is studied to evaluate the corrosion resistance of welding joints by using Potentiodynamic method. The observed microstructure of corroded specimen of optimum diffusion bonding joint shows that the corrosion current density has low value as compared with base materials used. During polarization, galvanic coupling is observed between two materials used. At passivity region, inverse polarity is occurred at 450mV. Therefore, passive stainless steel 304 L behaves as cathode respective to pure copper, the corrosion behavior of the diffusion bonding joint was mostly by copper side. The corrosion results indicate the presence of galvanic effect. The corrosion current density of copper, stainless steel 304L and bond joints condition were (3.66 µA/cm2, 1.62 µA/cm2 and 1.85µA/cm2) respectively. A SEM examination of corroded diffusion bonding joint indicates that the galvanic corrosion happened on copper side. The corrosion rate of bonding joint conditions was 0.85 mpy, which is less than 1%. This means that corrosion resistance of bond joint is more than excellent.


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