scholarly journals Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L

2019 ◽  
Vol 14 (2) ◽  
pp. 30-39 ◽  
Author(s):  
Ahmed Ali Akbar Akbar ◽  
Sami Abualnoun A Ajeel ◽  
Safaa Mohammed Hassoni
Keyword(s):  
Stainless Steel ◽  
Diffusion Bonding ◽  
Empirical Relationship ◽  
Pure Copper ◽  
Ductile Failure ◽  
Solid Solution Phase ◽  
Aisi 304L ◽  
Bonding Parameters ◽  
High Microhardness ◽  
Type Aisi

This work deals with determination of optimum conditions of direct diffusion bonding welding of austenitic stainlesssteel type AISI 304L with Oxygen Free High Conductivity (OFHC) pure copper grade (C10200) in vacuum atmosphere of (1.5 *10-5 mbr.). Mini tab (response surface) was applied for optimizing the influence of diffusion bonding parameters (temperature, time and applied load) on the bonding joints characteristics and the empirical relationship was evaluated which represents the effect of each parameter of the process. The yield strength of diffusion bonded joint was equal to 153 MPa and the efficiency of joint was equal to 66.5% as compared with hard drawn copper. The diffusion zone reveals high microhardness than copper side due to solid solution phase formation of (CuNi). The failure of bonded joints always occurred on the copper side and fracture surface morphologies are characterized by ductile failure mode with dimple structure. Optimum bonding conditions were observed at temperature of 650 ◦C, duration time of 45 min. and the applied stress of 30 MPa. The maximum depth of diffuse copper in stainless steel side was equal 11.80 µm.

Exhibition of veiled features in diffusion bonding of titanium alloy and stainless steel via copper

2017 ◽  
Vol 115 (1) ◽  
pp. 115 ◽  
Author(s):  
Gopinath Thirunavukarasu ◽  
Sukumar Kundu ◽  
Tapas Laha ◽  
Deb Roy ◽  
Subrata Chatterjee
Keyword(s):  
Stainless Steel ◽  
Diffusion Bonding ◽  
Pure Copper ◽  
Bonding Time ◽  
304 Stainless Steel ◽  
Time Interval ◽  
Reaction Products ◽  
Bonding Pressure ◽  
Ternary Intermetallic Compounds ◽  
Cu Foil

An investigation was carried out to know the extent of influence of bonding-time on the interface structure and mechanical properties of diffusion bonding (DB) of TiA|Cu|SS. DB of Ti6Al4V (TiA) and 304 stainless steel (SS) using pure copper (Cu) of 200-μm thickness were processed in vacuum using 4-MPa bonding-pressure at 1123 K from 15 to 120 min in steps of 15 min. Preparation of DB was not possible when bonding-time was less than 60 min as the bonding at Cu|SS interface was unsuccessful in spite of effective bonding at TiA|Cu interface; however, successful DB were produced when the bonding-time was 60 min and beyond. DB processed for 60 and 75 min (classified as shorter bonding-time interval) showed distinctive characteristics (structural, mechanical, and fractural) as compared to the DB processed for 90, 105, and 120 min (classified as longer bonding-time interval). DB processed for 60 and 75 min exhibited layer-wise Cu–Ti-based intermetallics at TiA|Cu interface, whereas Cu|SS interface was completely free from reaction products. The layer-wise structure of Cu–Ti-based intermetallics were not observed at TiA|Cu interface in the DB processed for longer bonding-time; however, the Cu|SS interface had layer-wise ternary intermetallic compounds (T1, T2, and T3) of Cu–Fe–Ti-based along with σ phase depending upon the bonding-time chosen. Diffusivity of Ti-atoms in Cu-layer (DTi in Cu-layer) was much greater than the diffusivity of Fe-atoms in Cu-layer (DFe in Cu-layer). Ti-atoms reached Cu|SS interface but Fe-atoms were unable to reach TiA|Cu interface. It was observed that DB fractured at Cu|SS interface when processed for shorter bonding-time interval, whereas the DB processed for longer bonding-time interval fractured apparently at the middle of Cu-foil region predominantly due to the existence of brittle Cu–Fe–Ti-based intermetallics.

scholarly journals Corrosion Behavior of Diffusion Bonding Joints of (OFHC) Copper with Stainless Steel 304L in 3.5% NaCl

2018 ◽  
Vol 21 (1) ◽  
pp. 74
Author(s):  
Sami Abualnoun Ajeel ◽  
Ahmed Ali Akbar Akbar ◽  
Safaa Mohammed Hassoni
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
Corrosion Behavior ◽  
Current Density ◽  
Diffusion Bonding ◽  
Corrosion Current Density ◽  
Pure Copper ◽  
Corrosion Current ◽  
Stainless Steel 304L ◽  
Materials Used

The present work deals with direct diffusion bonding welding without interlayer of austenitic stainless steel type AISI 304L with Oxygen Free High Conductivity pure copper (OFHC) in vacuum atmosphere (1.5 *10-5 mbr.). The optimum bonding conditions are temperature of 650 ◦C, duration time of 45 min. and the applied stress of 30 MPa, in order to secure a tight contact between the mating surfaces. The corrosion behavior of diffusion bonding joints in 3.5% Nacl is studied to evaluate the corrosion resistance of welding joints by using Potentiodynamic method. The observed microstructure of corroded specimen of optimum diffusion bonding joint shows that the corrosion current density has low value as compared with base materials used. During polarization, galvanic coupling is observed between two materials used. At passivity region, inverse polarity is occurred at 450mV. Therefore, passive stainless steel 304 L behaves as cathode respective to pure copper, the corrosion behavior of the diffusion bonding joint was mostly by copper side. The corrosion results indicate the presence of galvanic effect. The corrosion current density of copper, stainless steel 304L and bond joints condition were (3.66 µA/cm2, 1.62 µA/cm2 and 1.85µA/cm2) respectively. A SEM examination of corroded diffusion bonding joint indicates that the galvanic corrosion happened on copper side. The corrosion rate of bonding joint conditions was 0.85 mpy, which is less than 1%. This means that corrosion resistance of bond joint is more than excellent.

316L Stainless Steel Diffusion Bonding Optimized Parameters

2017 ◽  
Author(s):  
Gustavo Nuernberg ◽  
Grégori Rosinski ◽  
Priscila Gonçalves ◽  
Marcus Mortean ◽  
Regis Henrique Goncalves e Silva ◽  
...  
Keyword(s):  
Stainless Steel ◽  
Diffusion Bonding ◽  
316L Stainless Steel

scholarly journals Thermal Stress-Based Diffusion Bonding Method: the Case of Oxygen Free Copper to 316L Stainless Steel

2015 ◽  
Vol 56 (10) ◽  
pp. 1683-1687 ◽  
Author(s):  
Takashi Harumoto ◽  
Osamu Ohashi ◽  
Hiroki Tsushima ◽  
Miho Narui ◽  
Kensaku Aihara ◽  
...  
Keyword(s):  
Stainless Steel ◽  
Thermal Stress ◽  
Diffusion Bonding ◽  
316L Stainless Steel ◽  
Bonding Method

scholarly journals Influence of Activated Fluxes on the Bead Shape of A-TIG Welds on Carbon and Low-Alloy Steels in Comparison with Stainless Steel AISI 304L

Metals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 530
Author(s):  
Jerzy Niagaj
Keyword(s):  
Stainless Steel ◽  
Penetration Depth ◽  
High Strength ◽  
Tig Welding ◽  
Low Alloy Steels ◽  
Aisi 304L ◽  
A Tig Welding ◽  
Alloy Steels ◽  
Steel Aisi ◽  
Stainless Steel Aisi

The article presents results of comparative A-TIG welding tests involving selected unalloyed and fine-grained steels, as well as high-strength steel WELDOX 1300 and austenitic stainless steel AISI 304L. The tests involved the use of single ingredient activated fluxes (Cr2O3, TiO2, SiO2, Fe2O3, NaF, and AlF3). In cases of carbon and low-alloy steels, the tests revealed that the greatest increase in penetration depth was observed in the steels which had been well deoxidized and purified during their production in steelworks. The tests revealed that among the activated fluxes, the TiO2 and SiO2 oxides always led to an increase in penetration depth during A-TIG welding, regardless of the type and grade of steel. The degree of the aforesaid increase was restricted within the range of 30% to more than 200%.

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