scholarly journals Optimization of a 3-D high-power LED lamp: Orthogonal experiment method and experimental verification

2021 ◽  
pp. 52-52
Author(s):  
Chu-Xia Hua ◽  
Kang-Jia Wang
Keyword(s):  
Temperature Distribution ◽  
Optimal Design ◽  
High Power ◽  
Light Emitting Diode ◽  
Orthogonal Experiment ◽  
Light Emitting ◽  
Multiple Factors ◽  
Experiment Method ◽  
Orthogonal Experiment Method ◽  
Main Factors

The temperature distribution in a 3-D high-power light emitting diode(LED)lamp is affect by multiple factors, the orthogonal experiment method is adopted to elucidate three main factors, an experiment is designed to verify the main finding, which is useful for an optimal design of the LED lamp.

Manufacturing Process of Packaging Products by Orthogonal Test

2013 ◽  
Vol 469 ◽  
pp. 305-308
Author(s):  
Wei He ◽  
Yan Xin Li ◽  
A.S. Luyt ◽  
Tie Jun Ge
Keyword(s):  
Process Parameters ◽  
Visual Analysis ◽  
Orthogonal Experiment ◽  
Complex Structure ◽  
Orthogonal Test ◽  
Production Cycle ◽  
Plastic Packaging ◽  
Experiment Method ◽  
Orthogonal Experiment Method ◽  
Main Factors

For most plastic packaging products, injection molding is the most convenient, simple, widely applicable, especially for those thin, complex structure, smooth surface, and small moulds. Overdependence on experience, it is difficult to quickly design excellent products with short production cycle. In this paper, a common thin CD packaging mould was taken as a research object. By orthogonal experiment method and MPI software obtain the amount of warping deformation and a better group of process parameters. Within the range of orthogonal test, we explore the influence of various process parameters on warpage of injection. Besides, according to variance analysis that it is different from visual analysis to explore the main factors significantly, so that we obtain the most reliable and the best group of process parameters.

Phosphor concentration and geometry for high power white light emitting diode

2010 ◽  
Author(s):  
Kyung-Mi Moon ◽  
Se-Hwan An ◽  
Hyung-Kun Kim ◽  
Jung-Hye Chae ◽  
Yong-Jo Park
Keyword(s):  
White Light ◽  
High Power ◽  
Light Emitting Diode ◽  
Light Emitting

High-Power CW Operation of GaInAsP/InP Superluminescent Light-Emitting Diode with Tapered Active Region

2001 ◽  
Vol 40 (Part 2, No. 7A) ◽  
pp. L678-L680 ◽  
Author(s):  
Takeshi Yamatoya ◽  
Shigeaki Sekiguchi ◽  
Fumio Koyama ◽  
Kenichi Iga
Keyword(s):  
Active Region ◽  
High Power ◽  
Light Emitting Diode ◽  
Light Emitting ◽  
Cw Operation

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

Phosphor–silicone interaction effects in high power white light emitting diode packages

2017 ◽  
Vol 28 (23) ◽  
pp. 17557-17569 ◽  
Author(s):  
Jiajie Fan ◽  
Mengni Zhang ◽  
Xiao Luo ◽  
Cheng Qian ◽  
Xuejun Fan ◽  
...  
Keyword(s):  
White Light ◽  
High Power ◽  
Light Emitting Diode ◽  
Interaction Effects ◽  
Light Emitting

scholarly journals Thermal performance of heat sink with fluid pockets for high power light emitting diode

2017 ◽  
Vol 14 (4) ◽  
pp. 4846-4862
Author(s):  
Sangmesh ◽  
◽  
Gopalakrishna Keshava Narayana ◽  
Manjunath Shiraganhalli Honnaiah ◽  
Krishna Venkatesh ◽  
...  
Keyword(s):  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Light Emitting Diode ◽  
Light Emitting
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