scholarly journals Change in Resistivity of a Cu-4 wt%Ti Alloy during Tensile Deformation at 77°K

1971 ◽  
Vol 35 (8) ◽  
pp. 764-769 ◽  
Author(s):  
Kazuo Saito ◽  
Tokuzo Tsujimoto
Keyword(s):  
Tensile Deformation ◽  
Ti Alloy

The Research on Superplasticity of Two New Ti Alloys

2007 ◽  
Vol 551-552 ◽  
pp. 405-410
Author(s):  
Yong Qing Zhao ◽  
Heng Lei Qu ◽  
L.Y. Zeng
Keyword(s):  
Strain Rate ◽  
Tensile Deformation ◽  
Structural Evolution ◽  
High Strength ◽  
Grain Boundary Sliding ◽  
Dislocation Creep ◽  
Ti Alloy ◽  
Maximum Elongation ◽  
Tensile Deformation Behavior ◽  
Boundary Sliding

The superplastic tensile deformation behavior and structural evolution of two kinds of α+β titanium alloys were investigated in this paper, one is a new high strength high toughness Ti alloy with damage tolerance called TC21, and the other is a new superplastic Ti alloy so called Ti-SP2500. The results indicated that TC21 alloy has good superplasticity at the temperature from 720 to 960 and with the strain rate of 5.510-5s-1∼1.110-2s-1. On the optimal superplastic condition, the maximum elongation is over 1300%. During the superplastic tensile deformation, the dynamic recrystallization occurs in deformation zone of the specimens and the superplasticity is improved. Ti-SP2500 alloy has good superplasticity at the temperature from 720°C to 800°C and with the strain rate of 6.67 10-4s-1∼1.1110-2s-1. The maximum elongation for Ti-SP2500 alloy will exceed 2200% at 780°C with the strain rate of 5.5610-3s-1. Its superplastic deformation mechanism is controlled by grain boundary sliding, and the grain deformation and dislocation creep has the coordinating action.

scholarly journals Tensile Deformation of Fe-1.5% Ti Alloy Single Crystals Bearing Hydrogen

1974 ◽  
Vol 60 (14) ◽  
pp. 2165-2172 ◽  
Author(s):  
Tadahisa NAKAMURA ◽  
Toru KAJIMA
Keyword(s):  
Single Crystals ◽  
Tensile Deformation ◽  
Ti Alloy

Mechanism of saturated flow stress during hot tensile deformation of a TA15 Ti alloy

2015 ◽  
Vol 86 ◽  
pp. 146-151 ◽  
Author(s):  
Gang Liu ◽  
Kehuan Wang ◽  
Binbin He ◽  
Mingxin Huang ◽  
Shijian Yuan
Keyword(s):  
Flow Stress ◽  
Tensile Deformation ◽  
Ti Alloy ◽  
Saturated Flow ◽  
Hot Tensile Deformation

TEM examination of 2014-SiC metal matrix composite

1988 ◽  
Vol 46 ◽  
pp. 726-727
Author(s):  
M. G. Burke ◽  
M. N. Gungor ◽  
P. K. Liaw
Keyword(s):  
Metal Matrix Composite ◽  
Metal Matrix Composites ◽  
Matrix Composite ◽  
Metal Matrix ◽  
Tensile Deformation ◽  
Microstructural Characterization ◽  
Thin Foil ◽  
Matrix Alloy ◽  
Matrix Composites ◽  
Ion Milling

Aluminum-based metal matrix composites offer unique combinations of high specific strength and high stiffness. The improvement in strength and stiffness is related to the particulate reinforcement and the particular matrix alloy chosen. In this way, the metal matrix composite can be tailored for specific materials applications. The microstructural characterization of metal matrix composites is thus important in the development of these materials. In this study, the structure of a p/m 2014-SiC particulate metal matrix composite has been examined after extrusion and tensile deformation.Thin-foil specimens of the 2014-20 vol.% SiCp metal matrix composite were prepared by dimpling to approximately 35 μm prior to ion-milling using a Gatan Dual Ion Mill equipped with a cold stage. These samples were then examined in a Philips 400T TEM/STEM operated at 120 kV. Two material conditions were evaluated: after extrusion (80:1); and after tensile deformation at 250°C.

Shock consolidation of Ni-Ti alloy powder

1986 ◽  
Vol 44 ◽  
pp. 430-431
Author(s):  
Naresh N. Thadhani ◽  
Thad Vreeland ◽  
Thomas J. Ahrens
Keyword(s):  
Alloy Powder ◽  
Amorphous Material ◽  
Ti Alloy ◽  
Two Phase ◽  
Near Surface ◽  
Optical Micrograph ◽  
Shock Compaction ◽  
Powder Particles ◽  
Ti Powder ◽  
Rapidly Solidified

A spherically-shaped, microcrystalline Ni-Ti alloy powder having fairly nonhomogeneous particle size distribution and chemical composition was consolidated with shock input energy of 316 kJ/kg. In the process of consolidation, shock energy is preferentially input at particle surfaces, resulting in melting of near-surface material and interparticle welding. The Ni-Ti powder particles were 2-60 μm in diameter (Fig. 1). About 30-40% of the powder particles were Ni-65wt% and balance were Ni-45wt%Ti (estimated by EMPA).Upon shock compaction, the two phase Ni-Ti powder particles were bonded together by the interparticle melt which rapidly solidified, usually to amorphous material. Fig. 2 is an optical micrograph (in plane of shock) of the consolidated Ni-Ti alloy powder, showing the particles with different etching contrast.

Evolution of the microstructure of Cu(Ti)/SiO2 layers annealed in NH3

1995 ◽  
Vol 53 ◽  
pp. 452-453
Author(s):  
J. Liu ◽  
N. D. Theodore ◽  
D. Adams ◽  
S. Russell ◽  
T. L. Alford ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Titanium Nitride ◽  
Large Scale ◽  
Standard Procedure ◽  
Alloy Film ◽  
Electron Beam Evaporation ◽  
Copper Metallization ◽  
Nominal Composition ◽  
Ti Alloy ◽  
Thermally Grown

Copper-based metallization has recently attracted extensive research because of its potential application in ultra-large-scale integration (ULSI) of semiconductor devices. The feasibility of copper metallization is, however, limited due to its thermal stability issues. In order to utilize copper in metallization systems diffusion barriers such as titanium nitride and other refractory materials, have been employed to enhance the thermal stability of copper. Titanium nitride layers can be formed by annealing Cu(Ti) alloy film evaporated on thermally grown SiO2 substrates in an ammonia ambient. We report here the microstructural evolution of Cu(Ti)/SiO2 layers during annealing in NH3 flowing ambient.The Cu(Ti) films used in this experiment were prepared by electron beam evaporation onto thermally grown SiO2 substrates. The nominal composition of the Cu(Ti) alloy was Cu73Ti27. Thermal treatments were conducted in NH3 flowing ambient for 30 minutes at temperatures ranging from 450°C to 650°C. Cross-section TEM specimens were prepared by the standard procedure.

Texture and crystallite microstrain development during tensile deformation of copper - simulation and comparison to experimental results

2001 ◽  
Vol 11 (PR4) ◽  
pp. Pr4-61-Pr4-68
Author(s):  
S. Aris ◽  
R. V. Martins ◽  
J. Wegener ◽  
V. Honkimäki ◽  
A. Pyzalla
Keyword(s):  
Tensile Deformation ◽  
Experimental Results
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