scholarly journals Formation of Coherent Tungsten Ultra-Fine Particle Arrays by Nd: YAG Laser Irradiation

1999 ◽  
Vol 63 (9) ◽  
pp. 1105-1108
Author(s):  
Yuji Kawakami ◽  
Shinya Sasaki ◽  
Eiichi Ozawa
1990 ◽  
Vol 11 (Supplement) ◽  
pp. 477-480
Author(s):  
Masako Hashimoto ◽  
Junji Kato ◽  
Hiroshi Ono

2021 ◽  
Vol 11 (6) ◽  
pp. 176-187
Author(s):  
Mahammed Athar Alli Saikh ◽  
Prithwiraj Mohapatra

The manuscript aims to provide glimpse on updated information relating thermo-mechanical dry coating processes (TMDCP) suiting in modifying surface attributes of fine and ultra-fine particle (FiUlFiP). FiUlFiPs are the integral component of pharmaceutical processes. They exhibit complex and queer properties, are conferred mostly from their surface attributes colligated with their higher surface area. Particle engineering technocrats extensively working for modifying surface & surface attributes of FiUlFiPs. These efforts are to find their worthy applications & new functionalities. Among available diverse particle engineering technologies/ process, TMDCP, a dry coating process (DCP), advocated being worthy and efficient. The TMDCP finds multidisciplinary applications, mostly in drug development & drug delivery. Said DCP involves fixing and/or attaching coating material (CoM) as particles herein synonym guest particle (GP) onto core/substrate particle (CSP) herein synonym host particle (HP). Attaching/ fixing the GPs onto HPs, in TMDCP, involve their mechanical and/or thermal interactions. Scientific literatures are evidencing diverse techniques and/or process, basing on discussed interactions. Amongst them novel techniques/ processes are Hybridization, Magnetically assisted impaction coating process (MAICP), Mechanofusion, Theta-composer, and high shear compaction. In this area diverse devices/ equipments are prevailing in market. Important are Hybridizer, Magnetically assisted impaction coater (MAIC), Theta-composer, Mechanofusion, Quadro Comil®, Cyclomix®, and many others. Attempt of this article is to discuss and present their method of working, working principle, applicability, limitations, and benefits. Contained information might be beneficial for professionals of pharmaceutical and allied field. Keywords: dry coating, equipment, particles, processes, thermo-mechanical.


1987 ◽  
Vol 8 (3) ◽  
pp. 193-194
Author(s):  
Takashi Ogawa ◽  
Taiichi Kudoh ◽  
Atsushi Ogawa ◽  
Yozo Yamada ◽  
Shuji Ida ◽  
...  

1987 ◽  
Vol 137 (6) ◽  
Author(s):  
H. Washida ◽  
H. Sakagami ◽  
Y. Iwase ◽  
S. Sasaki ◽  
N. Daikuzono

2003 ◽  
Vol 437-438 ◽  
pp. 281-284
Author(s):  
Y.K.E. Arianto ◽  
Na Peng Bo ◽  
S.M. Surono Akbar

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000067-000070
Author(s):  
Akito Endo ◽  
Hiroki Tsuda ◽  
Jun Akedo

High throughput fine electrical wiring on the non flat surface is desired for the integration between LSI chips and micro electric components such as MEMS chips, micro actuator devices and micro optical devise in the wide frequency range. Ink-jet printing method is one of the good candidates as a direct writing method on the non flat substrate. However, by conventional ink-jet printing, it is very difficult to realize the fine wiring pattern less than 30μm in these practical conditions. We develop a newly ink-jet printing system assisted by YAG laser to reduce the pattern width and to increase the large transmittance current at high frequency range. At first, we investigated heating effect of a substrate by normal heater for a patterned dot size at the Ag ink droplet diameter of 45μm. As results, a dot diameter decreased from 178μm to 74μm according to increase the substrate temperature from 22 C° to 100 C° . Next the Si substrate was heated by the YAG laser irradiation with consideration of the above experimental results. The Ag wiring was drawn on the Si substrate using a 35μm diameter droplet by an ink-jet system. Therefore the line width was decreased with about 200μm to about 40μm and at the scanning speed 3 mm/s. The wiring width was determined by the balance between the heat supplements by laser irradiation and the volume of ink droplet. In this presentation, electrical properties of ink-jet patterned Ag line with laser irradiation will be reported.


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