2015 International 3D Systems Integration Conference (3DIC)
Latest Publications

TOTAL DOCUMENTS

83

(FIVE YEARS 0)

H-INDEX

6

(FIVE YEARS 0)

Published By IEEE

9781467393850

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334595 ◽

2015 ◽

Author(s):

Sumin Choi ◽

Heegon Kim ◽

Daniel H. Jung ◽

Jonghoon J. Kim ◽

Jaemin Lim ◽

...

Keyword(s):

3D Ic ◽

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On TSV array defect detection method using two ring-oscillators considering signal transitions at adjacent TSVs

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334594 ◽

2015 ◽

Author(s):

Hiroyuki Yotsuyanagi ◽

Akihiro Fujiwara ◽

Masaki Hashizume

Keyword(s):

Defect Detection ◽

Detection Method ◽

Ring Oscillators

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Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334581 ◽

2015 ◽

Author(s):

Chuan-An Cheng ◽

Ryuichi Sugie ◽

Tomoyuki Uchida ◽

Kou-Hua Chen ◽

Chi-Tsung Chiu ◽

...

Keyword(s):

3D Integration ◽

Through Silicon Vias ◽

Electrical Investigation ◽

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Design of a 3-D stacked floating-point Goldschmidt divider

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334598 ◽

2015 ◽

Author(s):

Jubee Tada ◽

Ryusuke Egawa ◽

Hiroaki Kobayashi

Keyword(s):

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Proposed static timing analysis framework for extracted 3D integrated circuits (3D-STA)

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334604 ◽

2015 ◽

Author(s):

Mohamed N. ElBahey ◽

DiaaEldin S. Khalil ◽

Hani F. Ragai

Keyword(s):

Integrated Circuits ◽

Timing Analysis ◽

Analysis Framework ◽

Static Timing Analysis ◽

Static Timing ◽

3D Integrated Circuits

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An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334613 ◽

2015 ◽

Author(s):

Tsung-Yen Tsai ◽

Chien-Hung Lin ◽

Chia-Lin Lee ◽

Shan-Chun Yang ◽

Kuan-Neng Chen

Keyword(s):

3D Integration ◽

Release Process ◽

Temporary Bonding

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Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334599 ◽

2015 ◽

Author(s):

Daniel H. Jung ◽

Heegon Kim ◽

Jonghoon J. Kim ◽

Sukjin Kim ◽

Joungho Kim ◽

...

Keyword(s):

Fault Isolation ◽

Through Silicon Via ◽

Modeling And Analysis ◽

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Temperature-aware online testing of power-delivery TSVs

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334617 ◽

2015 ◽

Author(s):

Hua-Cheng Fu ◽

Shi-Yu Huang ◽

Ding-Ming Kwai ◽

Yung-Fa Chou

Keyword(s):

Power Delivery ◽

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All-wet TSV filling with highly adhesive displacement plated Cu seed layer

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334609 ◽

2015 ◽

Author(s):

Kohei Ohta ◽

Atsushi Hirate ◽

Yuto Miyachi ◽

Tomohiro Shimizu ◽

Shoso Shingubara

Keyword(s):

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Power tile optimization and packaging for efficient temperature management of ASIC's in networking applications

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334607 ◽

2015 ◽

Author(s):

Susheela Narasimhan

Keyword(s):

Temperature Management

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