2015 International 3D Systems Integration Conference (3DIC)
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83
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Published By IEEE

9781467393850
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration

2015 ◽  
Author(s):  
Tsung-Yen Tsai ◽  
Chien-Hung Lin ◽  
Chia-Lin Lee ◽  
Shan-Chun Yang ◽  
Kuan-Neng Chen
Keyword(s):  
3D Integration ◽  
Release Process ◽  
Temporary Bonding

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation

2015 ◽  
Author(s):  
Daniel H. Jung ◽  
Heegon Kim ◽  
Jonghoon J. Kim ◽  
Sukjin Kim ◽  
Joungho Kim ◽  
...  
Keyword(s):  
Fault Isolation ◽  
Through Silicon Via ◽  
Modeling And Analysis ◽  
Non Invasive

Design of a 3-D stacked floating-point Goldschmidt divider

2015 ◽  
Author(s):  
Jubee Tada ◽  
Ryusuke Egawa ◽  
Hiroaki Kobayashi
Keyword(s):  
Floating Point

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC

2015 ◽  
Author(s):  
Sumin Choi ◽  
Heegon Kim ◽  
Daniel H. Jung ◽  
Jonghoon J. Kim ◽  
Jaemin Lim ◽  
...  
Keyword(s):  
High Speed ◽  
3D Ic ◽  
Eye Diagram

Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration

2015 ◽  
Author(s):  
Chuan-An Cheng ◽  
Ryuichi Sugie ◽  
Tomoyuki Uchida ◽  
Kou-Hua Chen ◽  
Chi-Tsung Chiu ◽  
...  
Keyword(s):  
3D Integration ◽  
Through Silicon Vias ◽  
Electrical Investigation ◽  
Silicon Vias

Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC

2015 ◽  
Author(s):  
Hisashi Kino ◽  
Hideto Hashiguchi ◽  
Seiya Tanikawa ◽  
Yohei Sugawara ◽  
Shunsuke Ikegaya ◽  
...  
Keyword(s):  
Bending Stress ◽  
3D Ic ◽  
Cte Mismatch

Temperature-aware online testing of power-delivery TSVs

2015 ◽  
Author(s):  
Hua-Cheng Fu ◽  
Shi-Yu Huang ◽  
Ding-Ming Kwai ◽  
Yung-Fa Chou
Keyword(s):  
Power Delivery ◽  
Online Testing
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