Laser prototyping of printed circuit boards

2013 ◽  
Vol 21 (3) ◽  
Author(s):  
M. Nowak ◽  
A. Antończak ◽  
P. Kozioł ◽  
K. Abramski
Keyword(s):  
Solid State ◽  
Process Parameters ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Conversion Algorithm ◽  
Optimization Of Process Parameters ◽  
Laser Systems ◽  
Basic Parameters

AbstractThis paper describes the application of laser micromachining to rapid prototyping of printed circuit boards (PCB) using nano-second lasers: the solid-state Nd:YAG (532/1064 nm) laser and the Yb:glass fiber laser (1060 nm). Our investigations included tests for various mask types (synthetic lacquer, light-sensitive emulsion and tin). The purpose of these tests was to determine some of the basic parameters such as the resolution of PCB prototyping, speed of processing and quality of PCB mapping with commonly available laser systems. Optimization of process parameters and the proposed conversion algorithm have allowed us to produce circuit boards with a resolution similar to that of the Laser Direct Imaging (LDI) technology.

scholarly journals Development of the Digital Site for Chemical Processes in the Manufacturing of Printed Circuit Boards

Inventions ◽  
2021 ◽  
Vol 6 (3) ◽  
pp. 48
Author(s):  
Fedor V. Vasilyev ◽  
Arkadiy M. Medvedev ◽  
Fedor A. Barakovsky ◽  
Maksim A. Korobkov
Keyword(s):  
Process Parameters ◽  
Printed Circuit Boards ◽  
Chemical Processes ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Digital Production ◽  
System Components ◽  
Digital Methods ◽  
Controllable Process

The article defines digital methods for controlling the quality of chemical processes. An architecture of a digital production line, which ensures the distribution of the computational load between the system components, is proposed. We considered the process of developing a prototype of a digital production site for servicing the etching operation during which controllable process parameters are determined; both hardware and software structures of the digital site are proposed. Studying the site operability, we determined the relationships between the process parameters, which made it possible to determine the boundaries of the designed system.

scholarly journals Food Waste-Assisted Metal Extraction from Printed Circuit Boards: The Aspergillus niger Route

2021 ◽  
Vol 9 (5) ◽  
pp. 895
Author(s):  
Carlotta Alias ◽  
Daniela Bulgari ◽  
Fabjola Bilo ◽  
Laura Borgese ◽  
Alessandra Gianoncelli ◽  
...  
Keyword(s):  
Solid State ◽  
Aspergillus Niger ◽  
Food Waste ◽  
Solid State Fermentation ◽  
Printed Circuit Boards ◽  
Electronic Waste ◽  
Metal Extraction ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards

A low-energy paradigm was adopted for sustainable, affordable, and effective urban waste valorization. Here a new, eco-designed, solid-state fermentation process is presented to obtain some useful bio-products by recycling of different wastes. Urban food waste and scraps from trimmings were used as a substrate for the production of citric acid (CA) by solid state fermentation of Aspergillus niger NRRL 334, with a yield of 20.50 mg of CA per gram of substrate. The acid solution was used to extract metals from waste printed circuit boards (WPCBs), one of the most common electronic waste. The leaching activity of the biological solution is comparable to a commercial CA one. Sn and Fe were the most leached metals (404.09 and 67.99 mg/L, respectively), followed by Ni and Zn (4.55 and 1.92 mg/L) without any pre-treatments as usually performed. Commercial CA extracted Fe more efficiently than the organic one (123.46 vs. 67.99 mg/L); vice versa, biological organic CA recovered Ni better than commercial CA (4.55 vs. 1.54 mg/L). This is the first approach that allows the extraction of metals from WPCBs through CA produced by A. niger directly grown on waste material without any sugar supplement. This “green” process could be an alternative for the recovery of valuable metals such as Fe, Pb, and Ni from electronic waste.

scholarly journals Development of a Physical Separation Route for the Concentration of Base Metals from Old Wasted Printed Circuit Boards

Minerals ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 1014
Author(s):  
Pedro Jorge Walburga Keglevich de Buzin ◽  
Weslei Monteiro Ambrós ◽  
Irineu Antônio Schadach de Brum ◽  
Rejane Maria Candiota Tubino ◽  
Carlos Hoffmann Sampaio ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Electronic Devices ◽  
Preliminary Evidence ◽  
Composition Analysis ◽  
Base Metals ◽  
Circuit Boards ◽  
Physical Separation ◽  
Printed Circuit ◽  
Processing Circuit

Wastes from old electronic devices represent a significant part of the electronic scrap generated in developing countries, being commonly sold by collectors as low-value material to recycling hubs abroad. Upgrading the quality of this waste type could drive the revenue of recyclers, and thus, boost the recycling market. On this basis, this study investigated the possibility of concentrating metals from old wasted printed circuit boards through a physical separation-based route. Preparation of samples comprised fragmentation, size classification, density, and magnetic separation steps, followed by chemical and macro composition analysis. Cu, Al, Fe, and Sn constituted the major metals encountered in the scraps, including some peak concentrations of Zn, Sb, Pb, Ba, and Mn. Four distinct concentrate products could be obtained after suitable processing: (a) a light fraction composed of plastics and resins; (b) an aluminum concentrate; (c) a magnetic material concentrate, containing mainly iron; (d) a final concentrate containing more than 50% in mass of copper and enriched with nonferrous metals. Preliminary evidence showed that further processes, like the separation of copper wires through drumming, can potentially improve the effectiveness of the proposed processing circuit and should guide future works.

scholarly journals THE QUALITY CONTROL OF PLATED-THROUGH HOLES OF PRINTED CIRCUIT BOARDS BY PULSED LASER HEATING

2021 ◽  
Vol 3 (65) ◽  
pp. 96-102
Author(s):  
Vyacheslav A. Sergeev ◽  
◽  
Maksim Y. Salnikov ◽  
Azat M. Nizametdinov ◽  
◽  
...  
Keyword(s):  
Quality Control ◽  
Temperature Measurement ◽  
Printed Circuit Boards ◽  
Heat Removal ◽  
Thermal Control ◽  
Contact Method ◽  
Circuit Boards ◽  
Ir Camera ◽  
Printed Circuit

The article gives a brief overview of standard methods of quality control and defect diagnostics of plated-through holes (PTH) of printed circuit boards (PCB) and considers their main disadvantages. It scrutinizes the methods of thermal control, which are reduced to PTH heating and monitoring the temperature. The main disadvantage of common methods is that they require a contact during heating the PTH and temperature measurement, which leads to significant errors and low reliability of control. The article describes a non-contact method involving heating only one side of the PTH by a laser beam and non-contact temperature measurement of the PTH ends by an IR camera. The authors propose a thermal equivalent scheme of PTH to analyze the transient thermal processes in PTH, which takes into account the heat removal from the plating of PTH into the PCB material. It is shown that the quality of plating can be estimated by the temperature difference between the upper (heated) and lower ends of the PTH, and the quality of adhesion between PTH plating and the PCB material can be estimated by the ratio of temperature increments. The article describes peculiarities of this method and gives the results of its testing on a real sample.

scholarly journals Comparative assessment of the conditions of direct and electrochemical metallization of blind holes of multilayer printed circuit boards

2019 ◽  
Vol 58 (5) ◽  
pp. 98-104
Author(s):  
Radic R. Latypov ◽  
◽  
Alexandra O. Desyatova ◽  
Sergey V. Golybev ◽  
Larisa N. Maskaeva ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Comparative Assessment ◽  
Copper Coating ◽  
Circuit Board ◽  
Circuit Boards ◽  
Drilling Depth ◽  
Printed Circuit ◽  
Catalyst Layers

The metal blind holes acting as interconnectors allow significantly reduce the number of layers, increase the efficiency of trace and decrease interference between the holes and signal conductors in the high frequency printed circuit boards. In this work, a comparative assessment of the conditions of direct and electrochemical metallization blind holes with diameters: 0,2; 0.25; 0.3; 0.4; 0.6; 0.8; 1.0 mm and a drilling depth of 0.5 mm located on experimental four-layer multilayer printed circuit boards, differing in the method of applying a conductive and copper coating was carried out. It has been established that in case non-fulfillment of mandatory conditions for the production of blind holes, in particular the aspect ratio is less than or equal to unity, incomplete metallization of the walls and especially the bottom of the holes is observed. The ways of combining the processes of direct and electrochemical metallization of holes, which provide the required thickness and quality of the copper coating at reduction of general duration of operations have been proposed based on the experimental data obtained during the work with multilayer printed boards. Also it has been established that the joint placement of blind holes with a smaller and larger diameter on one multilayer printed circuit board requires a more long direct metallization in combination with electrochemical at low values of current density. Copper films deposited on the walls of the holes and on the surface of the contact pads, regardless of the proposed way of metallization, have a highly dispersed structure. The composition of the palladium catalyst layers has been studied by energy dispersive analysis. The conductive coating on the blind hole’s walls contains between 1.55 and 6.77 at.% palladium.

scholarly journals Polypropylene Composites Reinforced by Nonmetallic from Waste Printed Circuit Boards Using Spout-Fluid Bed Coating with PP Particles Enhance Fluidization

Polymers ◽  
2021 ◽  
Vol 13 (18) ◽  
pp. 3106
Author(s):  
Man Wu ◽  
Jingxia Jiang ◽  
Cuiping Meng ◽  
Xiude Hu ◽  
Henglai Xie ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Polypropylene Composites ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Fluid Bed ◽  
Coating Methods ◽  
Ft Ir ◽  
Fluid Bed Coating

Nonmetallic materials recycled from waste printed circuit boards (N-WPCBs) were modified by coating KH-550 in a spout-fluid bed. To improve the effect of the modification, PP particles were used to enhance the fluidization quality of the N-WPCB particles in the coating modification. Then, the modified N-WPCBs were used as fillers to fabricate PP/N-WPCB composites. The method of coating in a spout-fluid bed with PP particles enhanced fluidization and showed the best modification effect compared to other coating methods. The FT-IR and SEM results demonstrated that interfacial bonding between N-WPCBs and PP could be enhanced by modified N-WPCBs, which improved the mechanical properties of the composites. When the mass ratio of PP to N-WPCBs is 100:75 and the dose of KH-550 is 4 phr, the flexural strength, tensile strength, and impact strength of the composites increase by 16.60%, 23.22%, and 23.64%, respectively. This would realize the high-value utilization of N-WPCBs with coating modification in the spout-fluid bed.

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