scholarly journals Development of a Tougher Grade of Polycrystalline Diamond Cutting Tool.

1999 ◽  
Vol 65 (8) ◽  
pp. 1092-1095
Author(s):  
Yasuyuki KANADA ◽  
Tomohiro FUKAYA ◽  
Junichi SHIRAISHI ◽  
Tetsuo NAKAI
Keyword(s):  
Cutting Tool ◽  
Polycrystalline Diamond ◽  
Diamond Cutting ◽  
Diamond Cutting Tool

scholarly journals Forming of silumins with the addition of carbide phase – the analysis of inserts temperatures during the cutting process

Mechanik ◽  
2017 ◽  
Vol 90 (2) ◽  
pp. 128-132
Author(s):  
Piotr Putyra ◽  
Lucyna Jaworska ◽  
Maciej Dyzia ◽  
Marcin Podsiadło
Keyword(s):  
High Speed ◽  
Cutting Tool ◽  
Polycrystalline Diamond ◽  
Cutting Parameters ◽  
Thermal Camera ◽  
Diamond Cutting ◽  
Ceramic Phase ◽  
Chip Formation Mechanism ◽  
The Stability ◽  
Diamond Cutting Tool

The stability of PCD inserts in the machining of cast composite materials containing 10 vol.% of ceramic phase is presented. Tests were carried out using a polycrystalline diamond cutting tool and the turning and milling center Mori Seiki NL2000SY. The VBB wear parameters of inserts according to the standard PN-ISO 3685:1996 were determinated. The influence of the cutting parameters (speed, feed rate, depth of the cut) on the temperature of PCD inserts was investigated. The analysis of chip formation mechanism during the processing at different cutting parameters was performed. The study was carried out using the FLIR A655 thermal camera and the high speed camera Phantom MIRO M310.

3347 Development of forming technique for nano-polycrystalline diamond cutting tool using pulsed fiber laser

2011 ◽  
Vol 2011.6 (0) ◽  
pp. _3347-1_-_3347-4_ ◽  
Author(s):  
Yoshifumi AMAMOTO ◽  
Masafumi YOSHIDA ◽  
Takuya SEMBA ◽  
Hitoshi SUMIYA
Keyword(s):  
Fiber Laser ◽  
Cutting Tool ◽  
Polycrystalline Diamond ◽  
Diamond Cutting ◽  
Pulsed Fiber Laser ◽  
Diamond Cutting Tool

Microtexture Generation Using Controlled Chatter Machining in Ultraprecision Diamond Turning

2015 ◽  
Vol 3 (2) ◽  
Author(s):  
Syed Adnan Ahmed ◽  
Jeong Hoon Ko ◽  
Sathyan Subbiah ◽  
Swee Hock Yeo
Keyword(s):  
Cutting Tool ◽  
Cutting Speed ◽  
Diamond Turning ◽  
Diamond Cutting ◽  
Machined Surface ◽  
Excited Vibration ◽  
Mass And Heat Transfer ◽  
Tool Shank ◽  
Diamond Cutting Tool

This paper describes a new method of microtexture generation in precision machining through self-excited vibrations of a diamond cutting tool. Conventionally, a cutting tool vibration or chatter is detrimental to the quality of the machined surface. In this study, an attempt is made to use the cutting tool's self-excited vibration during a cutting beneficially to generate microtextures. This approach is named as “controlled chatter machining (CCM).” Modal analysis is first performed to study the dynamic behavior of the cutting tool. Turning processes are then conducted by varying the tool holder length as a means to control vibration. The experimental results indicate that the self-excited diamond cutting tool can generate microtextures of various shapes, which depend on the cutting tool shank, cutting speed, feed, and cutting depth. The potential application of this proposed technique is to create microtextures in microchannels and microcavities to be used in mass and heat transfer applications.

Effect of texture shape on machining performance of textured diamond cutting tool

2019 ◽  
Vol 60 ◽  
pp. 21-27 ◽  
Author(s):  
Noritaka Kawasegi ◽  
Takumi Kawashima ◽  
Noboru Morita ◽  
Kazuhito Nishimura ◽  
Makoto Yamaguchi ◽  
...  
Keyword(s):  
Cutting Tool ◽  
Machining Performance ◽  
Diamond Cutting ◽  
Diamond Cutting Tool

Investigation of diamond cutting tool lapping system based on on-machine image measurement

2011 ◽  
Vol 56 (1-4) ◽  
pp. 79-86 ◽  
Author(s):  
Zhongjun Qiu ◽  
Feng Zhou Fang ◽  
Liyu Ding ◽  
Qunzhang Zhao
Keyword(s):  
Cutting Tool ◽  
Image Measurement ◽  
Diamond Cutting ◽  
Diamond Cutting Tool ◽  
Machine Image

Single Point Diamond Turning of Silicon by Using Micro-Laser Assisted Machining Technique

2014 ◽  
Author(s):  
Hossein Mohammadi ◽  
H. Bogac Poyraz ◽  
Deepak Ravindra ◽  
John A. Patten
Keyword(s):  
Fiber Laser ◽  
Cutting Tool ◽  
Single Point ◽  
Diamond Turning ◽  
Depth Of Cut ◽  
Beam Diameter ◽  
Diamond Cutting ◽  
Laser Assisted Machining ◽  
Diamond Cutting Tool ◽  
Si Wafer

In this study, single point diamond turning (SPDT) is coupled with the micro-laser assisted machining (μ-LAM) technique. The μ-LAM system is used to preferentially heat and thermally soften the work piece material in contact with a diamond cutting tool. In μ-LAM the laser and cutting tool are integrated into a single package, i.e. the laser energy is delivered by a single mode fiber laser to and through a diamond cutting tool. This hybrid method can potentially increase the critical depth of cut (DoC), i.e., a larger ductile-to-brittle transition (DBT) depth, in ductile regime machining, resulting in a higher material removal rate (MRR). An IR continuous wave (CW) fiber laser, wavelength of 1064nm and max power of 100W with a beam diameter of 10μm, is used in this investigation. In the current study SPDT tests were employed on single crystal silicon (Si) wafer which is very brittle and hard to machine by conventional methods. Different outputs such as surface roughness and depth of cut for different set of experiments were analyzed. Results show that an unpolished surface of a Si wafer can be machined in one pass to get a very good surface finish. The Ra was brought down from 1.2μm to 275nm only in one pass which is a very promising result for machining the Si wafer.

Force Analysis, Mechanical Energy and Laser Heating Evaluation of Scratch Tests on Silicon Carbide (4H-SiC) in Micro-Laser Assisted Machining (µ-LAM) Process

2009 ◽  
Author(s):  
Amir R. Shayan ◽  
Huseyin Bogac Poyraz ◽  
Deepak Ravindra ◽  
Muralidhar Ghantasala ◽  
John A. Patten
Keyword(s):  
Laser Beam ◽  
Cutting Forces ◽  
Laser Heating ◽  
Cutting Tool ◽  
Work Piece ◽  
Force Analysis ◽  
Diamond Cutting ◽  
Laser Assisted Machining ◽  
Scratch Tests ◽  
Diamond Cutting Tool

The purpose of applying a laser beam in the micro-laser assisted machining (μ-LAM) process is to preferentially heat and thermally soften the surface layer of the work piece material (4H-SiC) at the interface with a diamond cutting tool. In the μ-LAM process the laser beam (1480 nm and 400 mW) is delivered to the work piece material through a transparent diamond cutting tool. Thus the cutting tool and the laser system are integrated and coupled; in contrast with other LAM processes where the cutting tool and laser are separate and distinct systems. Scratches were made on a 4H-SiC substrate using the μ-LAM process. The characteristics of the scratches, such as depth and width, are principally a function of the cutting tool geometry, applied forces, cutting speed, and laser heating. White light interferometer microscopy and Atomic Force Microscopy (AFM) techniques were used to measure the geometry (depth and width) of the scratches. Force analysis was carried out to evaluate the laser heating effect on the cutting forces and the measured depth of cut. The force analysis included an evaluation of the mechanical work, specific energy, and understanding the effect of laser heating on the cutting process. The scratch tests performed on 4H-SiC with the laser heating showed that there is a greater than 50% reduction in relative calculated hardness values of work piece material, resulting in a significant reduction in cutting forces.

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