Electrically Conductive Polyamide 11 Nanocomposites for Selective Laser Sintering: Properties Characterization

Author(s):  
Brian P. Ong ◽  
Hao Wu ◽  
Joseph H. Koo
2010 ◽  
Vol 113-116 ◽  
pp. 508-511 ◽  
Author(s):  
Wei Liang Zeng ◽  
Yan Ling Guo

According to its advantages, such as low-cost and green biological etc., Wood-Plastic Composite(WPC) is more suitable for make parts by Selective Laser Sintering(SLS) rapid prototyping (RP) process. With optimal design of components, the parts made by WPC have good mechanical properties as well as with good laser sintering properties. In order to further improve the surface quality of the parts, the post-processing–infiltrating with wax–is introduced. After post-processing, the void fraction is decreased from 51% to 7%, surface quality has been greatly improved, Ra belows 13µm on average, after polishing the surface is more smooth and Ra belows 5µm averagely,compared to those without post processing, surface roughness decrease 22% and 73% respectively.


2017 ◽  
Vol 302 (11) ◽  
pp. 1700211 ◽  
Author(s):  
Zhichao Li ◽  
Zhanhua Wang ◽  
Xinpeng Gan ◽  
Daihua Fu ◽  
Guoxia Fei ◽  
...  

2020 ◽  
Vol 91 ◽  
pp. 106786
Author(s):  
Beate Scherer ◽  
Ingo Leonard Kottenstedde ◽  
Wolfgang Bremser ◽  
Frank-Michael Matysik

2021 ◽  
pp. 102445
Author(s):  
Gabrielle R. Esposito ◽  
Theo J. Dingemans ◽  
Raymond A. Pearson

Author(s):  
Nilabh Roy ◽  
Obehi Dibua ◽  
Chee Seng Foong ◽  
Michael Cullinan

The ability to create 3D ICs can significantly increase transistor packing density, reduce chip area and power dissipation leading to possibilities of large-scale on-chip integration of different systems. A promising process for this application is the microscale additive manufacturing (AM) of 3D interconnect structures and capability of writing 3D metal structures with feature sizes of approximately 1 μm on a variety of substrates. Current microscale AM techniques are limited in their capabilities to produce 3D conductive interconnect structures. This paper presents the design and development of a new micro AM technique — microscale selective laser sintering (μ-SLS) — which overcomes many of the limitations of other micro AM processes to achieve true micron sized, electrically conductive features on a variety of substrates. This paper will present preliminary results from set of sintering experiments on copper (Cu) nanoparticle (NP) ink using the continuous wave (CW) laser to be employed in the μ-SLS system which will be compared to Cu NP sintering results produced with other laser sources such as nanosecond (ns) & femtosecond (fs) lasers. This study is important to estimate the optimum working range of fluence/irradiance to be used in the μ-SLS setup depending upon the laser employed. In general, it provides an experimental estimate of the sintering fluence/irradiance range of Cu NPs depending upon the type of laser used and compares their sintering quality based on morphology of sintered spots.


RSC Advances ◽  
2020 ◽  
Vol 10 (35) ◽  
pp. 20405-20413
Author(s):  
Yipu Jin ◽  
Ning Chen ◽  
Yijun Li ◽  
Qi Wang

Polyamide 11/BaTiO3/graphene nanocomposite SLS part with enhanced dielectric and piezoelectric properties due to its special discontinuous graphene network and microspores.


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