Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

2017 ◽  
Author(s):  
Nilabh Roy ◽  
Obehi Dibua ◽  
Chee Seng Foong ◽  
Michael Cullinan
Keyword(s):  
Large Scale ◽  
Continuous Wave ◽  
Selective Laser Sintering ◽  
Laser Sintering ◽  
Electrically Conductive ◽  
Chip Area ◽  
Metal Structures ◽  
Preliminary Results ◽  
Laser Sources ◽  
On Chip

The ability to create 3D ICs can significantly increase transistor packing density, reduce chip area and power dissipation leading to possibilities of large-scale on-chip integration of different systems. A promising process for this application is the microscale additive manufacturing (AM) of 3D interconnect structures and capability of writing 3D metal structures with feature sizes of approximately 1 μm on a variety of substrates. Current microscale AM techniques are limited in their capabilities to produce 3D conductive interconnect structures. This paper presents the design and development of a new micro AM technique — microscale selective laser sintering (μ-SLS) — which overcomes many of the limitations of other micro AM processes to achieve true micron sized, electrically conductive features on a variety of substrates. This paper will present preliminary results from set of sintering experiments on copper (Cu) nanoparticle (NP) ink using the continuous wave (CW) laser to be employed in the μ-SLS system which will be compared to Cu NP sintering results produced with other laser sources such as nanosecond (ns) & femtosecond (fs) lasers. This study is important to estimate the optimum working range of fluence/irradiance to be used in the μ-SLS setup depending upon the laser employed. In general, it provides an experimental estimate of the sintering fluence/irradiance range of Cu NPs depending upon the type of laser used and compares their sintering quality based on morphology of sintered spots.

Physical Modeling for Selective Laser Sintering Process

2017 ◽  
Vol 17 (2) ◽  
Author(s):  
Arash Gobal ◽  
Bahram Ravani
Keyword(s):  
Physical Modeling ◽  
Large Scale ◽  
Selective Laser Sintering ◽  
Powdered Material ◽  
Laser Sintering ◽  
Industrial Applications ◽  
Transient Temperature ◽  
Sintering Process ◽  
Powder Bed ◽  
Selective Heating

The process of selective laser sintering (SLS) involves selective heating and fusion of powdered material using a moving laser beam. Because of its complicated manufacturing process, physical modeling of the transformation from powder to final product in the SLS process is currently a challenge. Existing simulations of transient temperatures during this process are performed either using finite-element (FE) or discrete-element (DE) methods which are either inaccurate in representing the heat-affected zone (HAZ) or computationally expensive to be practical in large-scale industrial applications. In this work, a new computational model for physical modeling of the transient temperature of the powder bed during the SLS process is developed that combines the FE and the DE methods and accounts for the dynamic changes of particle contact areas in the HAZ. The results show significant improvements in computational efficiency over traditional DE simulations while maintaining the same level of accuracy.

scholarly journals Architecture and Design of a Spiking Neuron Processor Core Towards the Design of a Large-scale Event-Driven 3D-NoC-based Neuromorphic Processor

2020 ◽  
Vol 77 ◽  
pp. 04003
Author(s):  
Mark Ogbodo ◽  
Khanh Dang ◽  
Fukuchi Tomohide ◽  
Abderazek Abdallah
Keyword(s):  
Low Power ◽  
Large Scale ◽  
Fault Tolerant ◽  
Three Dimensional ◽  
Spiking Neuron ◽  
Chip Area ◽  
Processor Core ◽  
Neuromorphic Systems ◽  
Event Driven ◽  
On Chip

Neuromorphic computing tries to model in hardware the biological brain which is adept at operating in a rapid, real-time, parallel, low power, adaptive and fault-tolerant manner within a volume of 2 liters. Leveraging the event driven nature of Spiking Neural Network (SNN), neuromorphic systems have been able to demonstrate low power consumption by power gating sections of the network not driven by an event at any point in time. However, further exploration in this field towards the building of edge application friendly agents and efficient scalable neuromorphic systems with large number of synapses necessitates the building of small-sized low power spiking neuron processor core with efficient neuro-coding scheme and fault tolerance. This paper presents a spiking neuron processor core suitable for an event-driven Three-Dimensional Network on Chip (3D-NoC) SNN based neuromorphic systems. The spiking neuron Processor core houses an array of leaky integrate and fire (LIF) neurons, and utilizes a crossbar memory in modelling the synapses, all within a chip area of 0.12mm2 and was able to achieves an accuracy of 95.15% on MNIST dataset inference.

Three-Dimensional Modeling of Selective Laser Sintering of Two-Component Metal Powder Layers

2005 ◽  
Vol 128 (1) ◽  
pp. 299-306 ◽  
Author(s):  
Tiebing Chen ◽  
Yuwen Zhang
Keyword(s):  
Metal Powder ◽  
Continuous Wave ◽  
Selective Laser Sintering ◽  
Three Dimensional ◽  
Laser Sintering ◽  
Powder Layer ◽  
Metal Powders ◽  
Gaussian Laser Beam ◽  
Scanning Velocity ◽  
Three Dimensional Modeling

Laser sintering of a metal powder mixture that contains two kinds of metal powders with significantly different melting points under a moving Gaussian laser beam is investigated numerically. The continuous-wave laser-induced melting accompanied by shrinkage and resolidification of the metal powder layer are modeled using a temperature-transforming model. The liquid flow of the melted low-melting-point metal driven by capillary and gravity forces is also included in the physical model. The numerical results are validated by experimental results, and a detailed parametric study is performed. The effects of the moving heat source intensity, the scanning velocity, and the thickness of the powder layer on the sintering depth, the configuration of the heat affected zone, and the temperature distribution are discussed.

Microstructure Evolution During Solid-State Selective Laser Sintering of Metallic Materials: A Phase-Field Simulation

2019 ◽  
Author(s):  
Xing Zhang ◽  
Yiliang Liao
Keyword(s):  
Solid State ◽  
Microstructure Evolution ◽  
Phase Field ◽  
Laser Power ◽  
Laser Scanning ◽  
Large Scale ◽  
Selective Laser Sintering ◽  
High Energy ◽  
Laser Sintering ◽  
Scanning Velocity

Abstract Selective laser sintering/melting (SLS/SLM) is a rapid prototyping technique that utilizes a high-energy laser beam to bind powder particles together for solid part fabrication. Due to the presence of several factors, microstructure-based material modeling can be of significant importance for optimizing processing parameters. To date, most researchers have put their efforts on simulating the microstructure of SLM-processed component, while few attentions have been paid to investigate the evolving of microstructure during SLS. In this work, a phase-field model is proposed to simulate the microstructure evolution during the solid-state SLS process. The microstructure evolution as affected by the laser power and scanning velocity are studied. It is found that the width of sintering neck increases with the increase of laser power and the decrease of laser scanning velocity. The modeling predictions are compared with the experimental data regarding the neck width between adjacent particles. In addition, it is demonstrated that this model is capable of carrying out large-scale simulations.

Selective Laser Sintering 3D Printing: A Way to Construct 3D Electrically Conductive Segregated Network in Polymer Matrix

2017 ◽  
Vol 302 (11) ◽  
pp. 1700211 ◽  
Author(s):  
Zhichao Li ◽  
Zhanhua Wang ◽  
Xinpeng Gan ◽  
Daihua Fu ◽  
Guoxia Fei ◽  
...  
Keyword(s):  
3D Printing ◽  
Polymer Matrix ◽  
Selective Laser Sintering ◽  
Laser Sintering ◽  
Electrically Conductive

Large Area Flexible Electronics Fabrication by Selective Laser Sintering of Nanoparticles with a Scanning Mirror

2009 ◽  
Vol 1196 ◽  
Author(s):  
Seung Hwan Ko ◽  
Heng Pan ◽  
Nico Hotz ◽  
Costas P. Grigoropoulos
Keyword(s):  
Flexible Electronics ◽  
Continuous Wave ◽  
Laser Energy ◽  
Selective Laser Sintering ◽  
Laser Sintering ◽  
Plasmon Mode ◽  
Metal Nanoparticle ◽  
Polymer Substrate ◽  
Large Area ◽  
Scanning Mirror

AbstractThe development of electric circuit fabrication on heat and chemically sensitive polymer substrates has attracted significant interest as a pathway to low-cost or large-area electronics. We demonstrated the large area, direct patterning of microelectronic structures by selective laser sintering of nanoparticles without using any conventional, very expensive vacuum or photoresist deposition steps. Surface monolayer protected gold nanoparticles suspended in organic solvent was spin coated on a glass or polymer substrate. Then low power continuous wave Ar-ion laser was irradiated as a local heat source to induce selective laser sintering of nanoparticles by a scanning mirror system. Metal nanoparticle possessed low melting temperature (<150°C) due to thermodynamic size effect, and high laser absorption due to surface plasmon mode. These make metal nanoparticles ideal for the low temperature, low laser energy selective laser processing, and further applicable for electronics fabrication on a heat sensitive polymer substrate. We extended our laser selective sintering of nanoparticles research to a large area (> 4” wafer) using scanning mirror to demonstrate current technology for industry level fabrication.

THE INFLUENCE OF SELECTIVE LASER SINTERING PARAMETERS ON TRIBOLOGICAL PROPERTIES OF PA 3200 GF POLYAMIDE

Tribologia ◽  
2018 ◽  
Vol 277 (1) ◽  
pp. 63-69 ◽  
Author(s):  
Czesław KUNDERA ◽  
Tomasz KOZIOR
Keyword(s):  
Coefficient Of Friction ◽  
Tribological Properties ◽  
Glass Fibre ◽  
Friction Pair ◽  
Selective Laser Sintering ◽  
Laser Sintering ◽  
Preliminary Results ◽  
The Coefficient Of Friction ◽  
Polyamide Powder

The paper presents the preliminary results of tribological research on the material used in the selective laser sintering technology, SLS. The samples in the shape of rings were manufactured of PA 3200 GF polyamide powder additionally reinforced with glass fibre, which is based on pure PA 2200 polyamide. The tests were carried out on a tribological T-15 tester, ring-on-disc type imitating the cooperation conditions of elements, e.g., the rings of the contact active seal. The main objective of the research was to determine the influence of the direction of the positioning of the models on the construction platform on the coefficient of friction and the wear of the cooperating friction pair components.

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