Correction: Modeling of Sanal Flow Choking Condition and Design Optimization of High Performance Dual-thrust SRMs

2018 ◽  
Author(s):  
VR Sanal Kumar ◽  
Vigneshwaran Sankar ◽  
Nichith Chandrasekaran ◽  
Sulthan Ariff Rahman M ◽  
Roshan Vignesh Baskaran
Keyword(s):  
Design Optimization ◽  
High Performance ◽  
Flow Choking

Modeling of Sanal Flow Choking Condition and Design Optimization of High Performance Dual-thrust SRMs

2018 ◽  
Author(s):  
VR Sanal Kumar ◽  
Vigneshwaran Sankar ◽  
Nichith Chandrasekaran ◽  
Sulthan Ariff Rahman M ◽  
Roshan Vignesh Baskaran
Keyword(s):  
Design Optimization ◽  
High Performance ◽  
Flow Choking

Design of Thin-Film Thermoelectric Microcoolers

2000 ◽  
Author(s):  
D.-J. Yao ◽  
C.-J. Kim ◽  
G. Chen
Keyword(s):  
Thin Film ◽  
Electron Transport ◽  
Design Optimization ◽  
Heat Loss ◽  
Size Effects ◽  
High Performance ◽  
Film Plane ◽  
Shape Design ◽  
Membrane Structures ◽  
Classical Size

Abstract Thin-film thermoelectric devices have potentially higher efficiency than bulk ones due to quantum and classical size effects of electrons and phonons. In this paper, we discuss the design of thin-film thermoelectric microcoolers for achieving high performance. The devices considered are membrane structures based on electron transport along the film plane. A model is developed to include the effects of heat loss and leg shape. Design optimization is performed based on the modeling results.

Multiobjective Design Optimization of Microchannel Cooling System Using High Performance Thermal Vias in LTCC Substrates

2013 ◽  
Vol 10 (1) ◽  
pp. 40-47 ◽  
Author(s):  
Aparna Aravelli ◽  
Singiresu S. Rao ◽  
Hari K. Adluru
Keyword(s):  
Heat Transfer ◽  
Design Optimization ◽  
High Performance ◽  
Cooling System ◽  
Optimization Technique ◽  
Optimization Theory ◽  
Thermal Design ◽  
Design Variables ◽  
Microchannel Cooling ◽  
Multiobjective Design

Increased heat generation in semiconductor devices for demanding applications leads to the investigation of highly efficient cooling solutions. Effective options for thermal management include passing of cooling liquid through the microchannel heat sink and using highly conductive materials. In the author's previous work, experimental and computational analyses were performed on LTCC substrates using embedded silver vias and silver columns forming microchannels. This novel technique of embedding silver vias along with forced convection using a coolant resulted in higher heat transfer rates. The present work investigates the design optimization of this cooling system (microheat exchanger) using systems optimization theory. A new multiobjective optimization problem was formulated for the heat transfer in the LTCC model using the log mean temperature difference (LMTD) method of heat exchangers. The goal is to maximize the total heat transferred and to minimize the coolant pumping power. Structural and thermal design variables are considered to meet the manufacturability and energy requirements. Pressure loss and volume of the silver metal are used as constraints. A hybrid optimization technique using sequential quadratic programming (SQP) and branch and bound method of integer programming has been developed to solve the microheat exchanger problem. The optimal design is presented and sensitivity analysis results are discussed.

Design optimization of low-power high-performance DSP building blocks

2004 ◽  
Vol 39 (7) ◽  
pp. 1131-1139 ◽  
Author(s):  
T. Gemmeke ◽  
M. Gansen ◽  
H.J. Stockmanns ◽  
T.G. Noll
Keyword(s):  
Low Power ◽  
Design Optimization ◽  
High Performance ◽  
Building Blocks

High performance parametric design optimization of RF devices

2016 ◽  
Author(s):  
George Stantchev ◽  
Simon Cooke ◽  
John Petillo ◽  
Serguei Ovtchinnikov ◽  
Alex Burke ◽  
...  
Keyword(s):  
Design Optimization ◽  
High Performance ◽  
Parametric Design ◽  
Rf Devices
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