Preparation of colloidal Tin sulfide nanoparticles by Pulse Laser Ablation in Liquid (PLAL)

2018 ◽  
Vol 8 (3) ◽  
pp. 1-12
Author(s):  
Sevan Ali
2018 ◽  
Vol 1027 ◽  
pp. 012002
Author(s):  
Ali Aqeel Salim ◽  
Noriah Bidin ◽  
Hazri Bakhtiar ◽  
Sib Krishna Ghoshal ◽  
Mohammed Al Azawi ◽  
...  

Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.


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