Three-Dimensional Molded Interconnect Devices (3D-MID)

2014 ◽  
pp. I-XII ◽  
Keyword(s):  
Three Dimensional ◽  
Molded Interconnect Devices

MEMS Packaging with 3D-MID Technology

2011 ◽  
Vol 2011 (1) ◽  
pp. 000484-000490
Author(s):  
Nouhad Bachnak
Keyword(s):  
Mobile Phone ◽  
Electronic Circuit ◽  
Three Dimensional ◽  
Industrial Technology ◽  
Mems Packaging ◽  
Optical Circuits ◽  
Molded Interconnect Devices ◽  
Function Density

3D-MID (three dimensional molded interconnect devices) technology (which is already broadly used for 3D-MID mobile phone antennas) is also used for MEMS packaging and sensors applications. 3D-MID allows miniaturization by the integration of mechanical and electronic functions in one part. The 3D electronic circuit is integrated into a 3D plastic casing or carrier, making it possible to achieve much more compact construction and much greater function density. More and more applications involving electrical and electro-optical circuits are made using 3D-MID technology. Typical 3D-MID applications are: Sensor packaging, LED packaging, security casings, RFIDs and Antennas. The main areas of application are in the automotive, medical, industrial technology and telecommunications sectors.

A Multilayer Process for the Connection of Fine-Pitch-Devices on Molded Interconnect Devices (MIDs)

2008 ◽  
Author(s):  
Thomas Leneke ◽  
Soeren Hirsch ◽  
Bertram Schmidt
Keyword(s):  
Flip Chip ◽  
Three Dimensional ◽  
Area Array ◽  
Fine Pitch ◽  
Key Factor ◽  
Functional Features ◽  
Escape Routing ◽  
Electrical Connections ◽  
Molded Interconnect Devices ◽  
Metallization Process

A key factor for the propagation of technological applications is the miniaturization of respective components, subsystems and overall systems. To meet future requirements in such size decreasing environments the packaging and mounting technology needs new impulses. 3D-MIDs (three-dimensional molded interconnect devices) exhibit a high potential for smart packages and assemblies. A three-dimensional shaped circuit carrier allows the integration of various functional features (e.g. electrical connections, housing, thermal management, mechanical support). This combination makes a further system shrinking possible. Yet, the mounting of high-density area-array fine-pitch packaged semiconductors (BGA, CSP, MCM) or bare dies to 3D-MIDs is problematic. The lack of a three-dimensional multilayer technology makes a collision free escape routing for devices with a high I/O count difficult. Therefore a new 3D-MID multilayer process was developed and combined with an established 3D-MID metallization process. A demonstrator with three metallization layers, capable, e.g., for flip-chip mounting of area-array packages, is fabricated. The multilayer structure of the demonstrator is investigated with respect to the mechanical and electrical behavior.

Design and Simulation of Molded Interconnect Devices with Two Shot Molding

2011 ◽  
Vol 295-297 ◽  
pp. 1651-1655
Author(s):  
Yong Zhuo ◽  
Juan Peng ◽  
Yan Jun Wu
Keyword(s):  
Optimal Design ◽  
Three Dimensional ◽  
Manufacturing Processes ◽  
Specific Design ◽  
Product Model ◽  
Simulation Tools ◽  
Integrated Environment ◽  
Feature Technology ◽  
Effective Design ◽  
Molded Interconnect Devices

Three Dimensional Molded Interconnect Devices (3D-MID) has enormous potential for rationalization in both manufacturing process and the freedom to design of mechatronic products. Two shot molding is one of the most important and commonly used methods among the various MID manufacturing processes. Currently, there is a lack of effective design and simulation tools that can be used for MID with two shot molding. In this paper, an integrated product model using feature technology, some MID-specific design functions, and one special interface based on the API of Moldflow Plastics Insight (MPI) and the COM-Technology are presented. These developed product model, functions and interface increase the efficiency of the MID design process, and the design and simulation integrated environment also towards the rational and optimal design of MID products with two shot molding.

scholarly journals Flexible free-standing SU-8 microfluidic impedance spectroscopy sensor for 3-D molded interconnect devices application

2016 ◽  
Vol 5 (1) ◽  
pp. 55-61 ◽  
Author(s):  
Marc-Peter Schmidt ◽  
Aleksandr Oseev ◽  
Christian Engel ◽  
Andreas Brose ◽  
Bertram Schmidt ◽  
...  
Keyword(s):  
Impedance Spectroscopy ◽  
Flip Chip ◽  
Three Dimensional ◽  
Impedance Spectrum ◽  
Fabrication Technology ◽  
Free Standing ◽  
Flexible Polymer ◽  
Opposite Electrode ◽  
Electrical Connections ◽  
Molded Interconnect Devices

Abstract. The current contribution reports about the fabrication technology for the development of novel microfluidic impedance spectroscopy sensors that are directly attachable on 3-D molded interconnect devices (3D-MID) that provides an opportunity to create reduced-scale sensor devices for 3-D applications. Advantages of the MID technology in particular for an automotive industry application were recently discussed (Moser and Krause, 2006). An ability to integrate electrical and fluidic parts into the 3D-MID platform brings a sensor device to a new level of the miniaturization. The demonstrated sensor is made of a flexible polymer material featuring a system of electrodes that are structured on and embedded in the SU-8 polymer. The sensor chips can be directly soldered on the MID due to the electroless plated contact pads. A flip chip process based on the opposite electrode design and the implementation of all fluidic and electrical connections at one side of the sensors can be used to assemble the sensor to a three-dimensional substrate. The developed microfluidic sensor demonstrated a predictable impedance spectrum behavior and a sufficient sensitivity to the concentration of ethanol in deionized water. To the best of our knowledge, there is no report regarding such sensor fabrication technology.

Design of the printing pattern on film for three-dimensional molded interconnect devices

2017 ◽  
Vol 37 (6) ◽  
pp. 1722-1731
Author(s):  
Ren Hao Liu ◽  
Wen-Bin Young ◽  
Hsu Pe Ming
Keyword(s):  
Three Dimensional ◽  
Molded Interconnect Devices

Realization of a Modeling and Simulation System for MID Laser Direct Structuring Equipment

2013 ◽  
Vol 427-429 ◽  
pp. 528-532
Author(s):  
Wen Juan Hu ◽  
Yong Zhuo ◽  
Xuan Wu ◽  
Guo Wei Lan ◽  
Xin Zhao
Keyword(s):  
Modeling And Simulation ◽  
Three Dimensional ◽  
Simulation System ◽  
Machining Process ◽  
Efficient Technology ◽  
Three Dimensional Modeling ◽  
Dimensional Modeling ◽  
Electromechanical Integrated ◽  
Integrated Device ◽  
Molded Interconnect Devices

The LDS is the most advanced and efficient technology in the MID (molded interconnect devices) electromechanical integrated device manufacturing technology. In this paper, the key technologies about modeling of LDS equipment, kinematic analysis of the machine system and optical system and how to combine them to achieve simulation were introduced, the MID modeling and simulation system for LDS equipment was developed based on Open CASCADE, The method of building the component tree was used to achieve the design of the main of the device. By adding the component model and defining the position and sports relationship, completed the three dimensional modeling of main structure and established the motion model. And combined with the MID cellular antenna model, the simulation of the laser machining process about the product has been completed on this system. The result verifies the validity of the simulation system.

Effect of fillers on the metallization of laser-structured polymer parts

2017 ◽  
Vol 37 (2) ◽  
pp. 151-161 ◽  
Author(s):  
Andreas J. Fischer ◽  
Steve Meister ◽  
Dietmar Drummer
Keyword(s):  
Functional Integration ◽  
Three Dimensional ◽  
Circuit Boards ◽  
Matrix Polymer ◽  
Glass Spheres ◽  
The Matrix ◽  
Inorganic Fillers ◽  
Processing Properties ◽  
Molded Interconnect Devices

Abstract Molded interconnect devices offer great potential as a substitute for circuit boards, especially regarding three-dimensional shaping and functional integration. Applying circuits to polymer substrates can be performed by means of LPKF laser direct structuring® (LDS). There, the matrix polymer is filled with a special metal additive, enabling laser activation and subsequent metallization. Important effects emerge from additional inorganic fillers inside the matrix polymer, e.g. the (thermo)mechanical behavior and the processing properties. In this work, the degree to which inorganic fillers affect the quality of metallization is investigated. An increase in the plating thickness was successfully achieved by adding varying amounts of talc platelets (diameter 7 μm) to a PA10T-based copolyamide filled with 4 and 8 wt% LDS additive, in contrast to poor metal deposition adding only LDS additive. Additionally, talc and glass spheres with a diameter of 50 μm were used, leading to unsatisfactory metallization results. To explain this behavior, adhering LDS particles were found on the talc platelets with a diameter of 7 μm on the surface of the laser-structured specimen. The talc platelets and glass spheres of 50 μm were not available in sufficient dimensions on the surface and thus led to worse plating results.

Research on MID Application in RFID Based on Intelligent Materials

2011 ◽  
Vol 282-283 ◽  
pp. 244-247
Author(s):  
Wen Jin Xu
Keyword(s):  
Internet Of Things ◽  
Embedded System ◽  
Design Process ◽  
Three Dimensional ◽  
The Internet ◽  
Manufacture Process ◽  
New Type ◽  
Design And Manufacture ◽  
Molded Interconnect Devices ◽  
The Internet Of Things

In this paper, the three-dimensional molding mechanical and electrical integration unit Molded Interconnect Devices (MID) is introduced. It is a new type of electronic component. And the following part of the article presents the Internet of Things (IOT). From the design and manufacture process, the paper describes the possibility and necessity using MID in IOT technology, as RFID and Embedded System. In the end, the MID design process is presented.

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