Application to Non Destructive Physical Analysis Method Using X-ray CT Imaging

2010 ◽  
Author(s):  
Akira Mizoguchi ◽  
Minoru Sugawara ◽  
Masahide Nakamura ◽  
Koichiro Takeuchi
Keyword(s):  
Failure Analysis ◽  
Three Dimensional ◽  
Ct Imaging ◽  
Temperature Cycling ◽  
Physical Analysis ◽  
Printed Wiring Boards ◽  
X Ray ◽  
X Ray Imaging ◽  
X Ray Computed ◽  
Non Destructive

Abstract We have been paying attention to the development of the nondestructive physical analysis (NDPA) technology. We think that NDPA is a technology which doesn't depend on the worker's capability or experience. There are many NDPA techniques, and analysis using X-ray imaging is one of the principal techniques. Due to the progress of the image analysis using computers in recent years, X-ray imaging have been evolving from two dimensional images to three dimensional imaging. We have been applying X-ray CT imaging to actual failure analysis and reliability evaluation since 2008. At ISTFA 2009, we reported on the effectiveness of X-ray Computed Tomography (CT) images in the failure analysis. [1] We confirmed that the X-ray CT image had various applications, for example, screening for counterfeit parts, the detection of the defect of the multi-layers printed wiring boards (multi-layers PWB), the structure confirmation of caulking contacts, and the detection of cracks or voids of the solder joint. This paper discusses the effectiveness of X-ray CT imaging in failure analysis and discusses the effectiveness of applying X-ray CT imaging to the propagation of cracks occurring at solder joints during temperature cycling test.

On-Site Non-Destructive Inspection of Bridges Using the 950 keV X-Band Electron Linac X-ray Source

2017 ◽  
Vol 12 (3) ◽  
pp. 578-584 ◽  
Author(s):  
Mitsuru Uesaka ◽  
◽  
Yuki Mitsuya ◽  
Eiko Hashimoto ◽  
Katsuhiro Dobashi ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Bridge Inspection ◽  
Electron Linac ◽  
X Ray ◽  
Band Electron ◽  
Reconstruction Methods ◽  
X Ray Imaging ◽  
X Band ◽  
Near Future ◽  
Non Destructive

Regular diagnosis of the structural health of infrastructure, such as bridges, is indispensable to ensure safety and reliable operation of the society. Non-destructive tests based on X-ray imaging are powerful tools to inspect the inside of a concrete structure in detail. Establishing a diagnostic method of bridges based on X-ray visualization is required to examine the internal conditions and helps in the rationalization of maintenances. We demonstrated our 950 keV X-band electron linac based X-ray source for on-site actual bridge inspection and visualized the inner structure of a bottom floor slab. For the more precise inspection of the conditions of wires and rods, we applied three-dimensional image reconstruction methods for bridge mock-up samples. Partial angle computed tomography and tomosynthesis gave cross section images of the samples with 1 mm resolution. We are planning to investigate another part of the bridge, with the 950 keV X-ray system in the near future.

Effectiveness of Non Destructive Physical Analysis Method Using X-ray CT Imaging

2009 ◽  
Author(s):  
Akira Mizoguchi ◽  
Koichiro Takeuchi
Keyword(s):  
Ct Images ◽  
Physical Analysis ◽  
Nondestructive Analysis ◽  
X Ray ◽  
Destructive Analysis ◽  
X Ray Computed ◽  
Analytical Result ◽  
Test Use ◽  
Non Destructive

Abstract Now we are attempting to apply non destructive analysis from evaluation tests or failure analysis to acceptance tests or production tests. Needless to say non destructive analysis has an advantage of conserving the state of samples and the reducing the time of analysis as compared to conventional methods with destructive physical analysis. Moreover, we are paying attention to the following reasons for nondestructive physical analysis. It is difficult to keep the reproducibility of the analysis because of the high skill level required for destructive physical analysis. On the other hand, high reproducibility can be easily achieved by fixing the condition or parameters of the device during nondestructive analysis when performed by tools like X-ray. Moreover, we expect that neither the analytical result nor the quality of the nondestructive analysis depends upon the worker's capability. In this paper we will discuss the following two items from the viewpoint of quality assurance. 1. The method of the screening for fake parts (1) The procedure flow for the production discontinued parts (2) The comparison and examination between the diagnostic using X-ray computed tomography (X-ray CT) images and various examinations (3) Other observation cases using X-ray CT images 2. Effectiveness and consideration in reliability evaluation test using X-ray CT image (1) Comparison of observation cases with a variety of jointing points in parts (2) Consideration of application of nondestructive observation technique in reliability test Use of X-ray CT images is effective in diagnosing the quality of the product or the process. Moreover, we find that use of X-ray CT images is effective for the improvement of the reproducibility of the evaluation examination. Then we find that use of X-ray CT images can reduce the time of evaluation examination too.

X-Ray Computed Tomography Studies of 3D Meso-Defect Volume Distribution Changes of Cement Paste due to Carbonation

2010 ◽  
Vol 163-167 ◽  
pp. 3061-3066 ◽  
Author(s):  
Jian De Han ◽  
Gang Hua Pan ◽  
Wei Sun ◽  
Cai Hui Wang ◽  
Hui Rong
Keyword(s):  
Computed Tomography ◽  
Cement Paste ◽  
Volume Fraction ◽  
Three Dimensional ◽  
Volume Distribution ◽  
X Ray ◽  
Before And After ◽  
X Ray Computed ◽  
Non Destructive ◽  
Defect Volume

X-ray computed tomography (XCT), a non-destructive test, was used to study three dimensional (3D) meso-defect volume distribution changes of cement paste due to carbonation. The 3D meso-defect volume from 0.02mm3 ~5mm3 before and after carbonation was analyzed through add-on modules of 3D defect analysis. The experimental results show that the meso-defect volume fraction before and after carbonation are 0.7685% and 2.44%, respectively. After carbonation, the smaller defect increased significantly than the bigger defect.

Addressing Failure Analysis Challenges in Advanced Packages and MEMS using a Novel Phase and Darkfield X-Ray Imaging System

2020 ◽  
Author(s):  
S.H. Lau ◽  
Sheraz Gul ◽  
Guibin Zan ◽  
David Vine ◽  
Sylvia Lewis ◽  
...  
Keyword(s):  
Failure Modes ◽  
Imaging System ◽  
Dark Field ◽  
Organic Substrates ◽  
Mechanical Shock ◽  
X Ray ◽  
X Ray Imaging ◽  
X Ray Computed ◽  
2D And 3D ◽  
Non Destructive

Abstract Currently gaps in non-destructive 2D and 3D imaging in PFA for advanced packages and MEMS exist due to lack of resolution to resolve sub-micron defects and the lack of contrast to image defects within the low Z materials. These low Z defects in advanced packages include sidewall delamination between Si die and underfill, bulk cracks in the underfill, in organic substrates, Redistribution Layer, RDL; Si die cracks; voids within the underfill and in the epoxy. Similarly, failure modes in MEMS are often within low Z materials, such as Si and polymers. Many of these are a result of mechanical shock resulting in cracks in structures, packaging fractures, die adhesion issues or particles movements into critical locations. Most of these categories of defects cannot be detected non-destructively by existing techniques such as C-SAM or microCT (micro x-ray computed tomography) and XRM (X-ray microscope). We describe a novel lab-based X-ray Phase contrast and Dark-field/Scattering Contrast system with the potential to resolve these types of defects. This novel X-ray microscopy has spatial resolution of 0.5 um in absorption contrast and with the added capability of Talbot interferometry to resolve failure issues which are related to defects within organic and low Z components.

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