Advanced non-destructive analysis technique capable of rapidly determining uranium mass contained in waste drum with high accuracy

Raman spectroscopy is a non-destructive analysis technique that provides detailed information about the chemical structure of the tumor. Raman spectra of 52 giant cell tumor of bone (GCTB), and 21...

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Universal Application of Load Board (L/B) and Socket with Direct Current Tester (DCT) for Various Packages

10.31399/asm.cp.istfa2021p0330 ◽

2021 ◽

Author(s):

Yi-Sheng Lin ◽

Yu-Hsiang Hsiao ◽

Pei-Yu Tseng ◽

Yu-Jen Chang ◽

Cheng-Hsin Liu ◽

...

Keyword(s):

Direct Current ◽

Semiconductor Industry ◽

Mapping Function ◽

Electrical Failure ◽

Defect Location ◽

Analysis Technique ◽

Destructive Analysis ◽

Solder Balls ◽

Non Destructive ◽

Universal Application

Abstract We develop a new workflow with O/S tester (Direct Current Tester, DCT) to detect quickly the defect location of failure packages, which can be used in the semiconductor industry for E-FA (Electrical Failure Analysis) fault localization for short, leakage, and open defects. This paper introduces the capability and presents two case studies identifying the defect location of solder balls where DCT with defect mapping function is useful as a non-destructive analysis technique. In this paper, the new methodology and application of DCT on open and short defects in various packages with different sizes have been presented. The experimental results of the design testing program and an intender tooling were verified for the accuracy of the defect mapping function in determining the pin location to defect.

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Repair and Health Monitoring for Historical Structures

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.133-134.205 ◽

2010 ◽

Vol 133-134 ◽

pp. 205-209

Author(s):

Mohamad Hossein Maleki Tabrizi

Keyword(s):

Dynamic Characteristics ◽

Health Monitoring ◽

Structural Integrity ◽

Laser Doppler Vibrometer ◽

High Accuracy ◽

Historical Buildings ◽

Height Ratio ◽

Historical Structures ◽

Destructive Analysis ◽

Non Destructive

Historical structures, like to masonry towers and another structures are among the structures subjected to the higher risk, due to their age, elevation and low base area on height ratio. In this paper introduce a technique of monitoring the structural integrity of historical buildings by a noncontact and non-destructive analysis is presented and discussed. The damage and destroy of a structure and building, in terms of cracks and overall structural degradation, is detected throughout the measurement of its dynamic characteristics by various ways, for example by a laser Doppler vibrometer(LDV). These techniques can show the frequency spectrum of the structure with high accuracy and reliability and reaction of structure against this technique. Also we will introduce that timber components have no influence on the system behaviour, which is mainly determined by the properties of connections and reactions.

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Application of Electro Optical Terahertz Pulse Reflectometry for Fault Localization and Defect Analysis

ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2017p0025 ◽

2017 ◽

Author(s):

Yi-Sheng Lin ◽

Yu-Hsiang Hsiao ◽

Shu-Hua Lee

Keyword(s):

Failure Analysis ◽

Semiconductor Industry ◽

Fault Isolation ◽

Defect Analysis ◽

Wafer Level ◽

Terahertz Pulse ◽

Electrical Failure ◽

Analysis Technique ◽

Destructive Analysis ◽

Non Destructive

Abstract Electro Optical Terahertz Pulse Reflectometry (EOTPR) is an E-FA (Electrical Failure Analysis) technique in the semiconductor industry for non-destructive electrical fault isolation for shorts, leakages and opens. This paper introduces the capability and presents several case studies identifying the physical location of defects where EOTPR is useful as a non-destructive analysis technique. In this paper, the methodology and application of EOTPR on open and short failure isolations in advanced 2.5D IC and wafer level packages (WLP) have been presented. The experimental results of P-FA (Physical Failure Analysis) verify the accuracy of the EOTPR system in determining the distance to defect.

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Time Domain Reflectometry—Case Studies in Electrical Failure Isolation

ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2015p0104 ◽

2015 ◽

Author(s):

Jason Wheeler ◽

Stephen Fasolino

Keyword(s):

Case Studies ◽

Time Domain ◽

Time Domain Reflectometry ◽

Electrical Failure ◽

Physical Location ◽

Analysis Technique ◽

Destructive Analysis ◽

Non Destructive

Abstract Time Domain Reflectometry (TDR) is an analysis technique for characterizing a transmission environment (PCB traces, cable assemblies, etc.) and identifying the physical location of defects or impedance discontinuities which can quickly narrow the focus of an investigation. This paper introduces the capability and presents several case studies spanning different applications where TDR was useful as a non-destructive analysis technique.

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Investigation of Obsidian by Radioisotope X-Ray Flurescence

Advances in X-ray Analysis ◽

10.1154/s0376030800017390 ◽

1983 ◽

Vol 27 ◽

pp. 459-466

Author(s):

Stephen B. Robie ◽

Ivor L. Preiss

Keyword(s):

Fluorescence Analysis ◽

Trace Element Composition ◽

Trade Routes ◽

X Ray ◽

Volcanic Material ◽

Ancient Trade ◽

Analysis Technique ◽

Destructive Analysis ◽

Non Destructive

The classification of obsidian artifacts has been receiving considerable attend of changes in obsidian trace element composition can now be identify ancient trade routes. The classification of this glassy volcanic material has been attempted using a variety of elemental analysis technique. The most successful and most widely employed method of non-destructive analysis has been that which employs X-ray fluorescence analysis (XRF); either wavelength dispersive (WDS), or energy dispersive (EDS).

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