Time Domain Reflectometry—Case Studies in Electrical Failure Isolation

2015 ◽  
Author(s):  
Jason Wheeler ◽  
Stephen Fasolino
Keyword(s):  
Case Studies ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Electrical Failure ◽  
Physical Location ◽  
Analysis Technique ◽  
Destructive Analysis ◽  
Non Destructive

Abstract Time Domain Reflectometry (TDR) is an analysis technique for characterizing a transmission environment (PCB traces, cable assemblies, etc.) and identifying the physical location of defects or impedance discontinuities which can quickly narrow the focus of an investigation. This paper introduces the capability and presents several case studies spanning different applications where TDR was useful as a non-destructive analysis technique.

scholarly journals Universal Application of Load Board (L/B) and Socket with Direct Current Tester (DCT) for Various Packages

2021 ◽  
Author(s):  
Yi-Sheng Lin ◽  
Yu-Hsiang Hsiao ◽  
Pei-Yu Tseng ◽  
Yu-Jen Chang ◽  
Cheng-Hsin Liu ◽  
...  
Keyword(s):  
Direct Current ◽  
Semiconductor Industry ◽  
Mapping Function ◽  
Electrical Failure ◽  
Defect Location ◽  
Analysis Technique ◽  
Destructive Analysis ◽  
Solder Balls ◽  
Non Destructive ◽  
Universal Application

Abstract We develop a new workflow with O/S tester (Direct Current Tester, DCT) to detect quickly the defect location of failure packages, which can be used in the semiconductor industry for E-FA (Electrical Failure Analysis) fault localization for short, leakage, and open defects. This paper introduces the capability and presents two case studies identifying the defect location of solder balls where DCT with defect mapping function is useful as a non-destructive analysis technique. In this paper, the new methodology and application of DCT on open and short defects in various packages with different sizes have been presented. The experimental results of the design testing program and an intender tooling were verified for the accuracy of the defect mapping function in determining the pin location to defect.

Application of Electro Optical Terahertz Pulse Reflectometry for Fault Localization and Defect Analysis

2017 ◽  
Author(s):  
Yi-Sheng Lin ◽  
Yu-Hsiang Hsiao ◽  
Shu-Hua Lee
Keyword(s):  
Failure Analysis ◽  
Semiconductor Industry ◽  
Fault Isolation ◽  
Defect Analysis ◽  
Wafer Level ◽  
Terahertz Pulse ◽  
Electrical Failure ◽  
Analysis Technique ◽  
Destructive Analysis ◽  
Non Destructive

Abstract Electro Optical Terahertz Pulse Reflectometry (EOTPR) is an E-FA (Electrical Failure Analysis) technique in the semiconductor industry for non-destructive electrical fault isolation for shorts, leakages and opens. This paper introduces the capability and presents several case studies identifying the physical location of defects where EOTPR is useful as a non-destructive analysis technique. In this paper, the methodology and application of EOTPR on open and short failure isolations in advanced 2.5D IC and wafer level packages (WLP) have been presented. The experimental results of P-FA (Physical Failure Analysis) verify the accuracy of the EOTPR system in determining the distance to defect.

Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim
Keyword(s):  
Time Domain ◽  
Quantum Interference ◽  
Flip Chip ◽  
Imaging System ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Isolation Techniques ◽  
Super Conducting ◽  
Non Destructive

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.

Time Domain Reflectometry Technique for Failure Analysis

2004 ◽  
Author(s):  
Teoh King Long ◽  
Ko Yin Fern
Keyword(s):  
Failure Analysis ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Reference Plane ◽  
First Case ◽  
Main Emphasis ◽  
Plastic Ball ◽  
Solder Balls ◽  
Non Destructive

Abstract In time domain reflectometry (TDR), the main emphasis lies on the reflected waveform. Poor probing contact is one of the common problems in getting an accurate waveform. TDR probe normalization is essential before measuring any TDR waveforms. The advantages of normalization include removal of test setup errors in the original test pulse and the establishment of a measurement reference plane. This article presents two case histories. The first case is about a Plastic Ball Grid Array package consisting of 352 solder balls where the open failure mode was encountered at various terminals after reliability assessment. In the second, a three-digit display LED suspected of an electrical short failure was analyzed using TDR as a fault isolation tool. TDR has been successfully used to perform non-destructive fault isolation in assisting the routine failure analysis of open and short failure. It is shown to be accurate and reduces the time needed to identify fault locations.

Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package

2012 ◽  
Author(s):  
Lihong Cao ◽  
Manasa Venkata ◽  
Meng Yeow Tay ◽  
Wen Qiu ◽  
J. Alton ◽  
...  
Keyword(s):  
Time Domain ◽  
Flip Chip ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Experimental Results ◽  
Terahertz Pulse ◽  
Isolation And Identification ◽  
Isolation Technique ◽  
Non Destructive

Abstract Electro-optical terahertz pulse reflectometry (EOTPR) was introduced last year to isolate faults in advanced IC packages. The EOTPR system provides 10μm accuracy that can be used to non-destructively localize a package-level failure. In this paper, an EOTPR system is used for non-destructive fault isolation and identification for both 2D and 2.5D with TSV structure of flip-chip packages. The experimental results demonstrate higher accuracy of the EOTPR system in determining the distance to defect compared to the traditional time-domain reflectometry (TDR) systems.

Development of Deep Learning Algorithms to Discriminate Giant Cell Tumor of Bone from Adjacent Normal Tissues by Confocal Raman Spectroscopy

The Analyst ◽  
2022 ◽  
Author(s):  
Carol PY Lau ◽  
Wenao Ma ◽  
Kwan Yau Law ◽  
Maribel Lacambra ◽  
Kwok Chuen Wong ◽  
...  
Keyword(s):  
Raman Spectroscopy ◽  
Giant Cell Tumor ◽  
Giant Cell ◽  
Chemical Structure ◽  
Cell Tumor ◽  
Confocal Raman Spectroscopy ◽  
Normal Tissues ◽  
Analysis Technique ◽  
Destructive Analysis ◽  
Non Destructive

Raman spectroscopy is a non-destructive analysis technique that provides detailed information about the chemical structure of the tumor. Raman spectra of 52 giant cell tumor of bone (GCTB), and 21...

Non-destructive diagnosis of wiring networks using time domain reflectometry and an improved black hole algorithm

2016 ◽  
Vol 32 (3) ◽  
pp. 286-300 ◽  
Author(s):  
M. K. Smail ◽  
H. R. E. H. Bouchekara ◽  
L. Pichon ◽  
H. Boudjefdjouf ◽  
A. Amloune ◽  
...  
Keyword(s):  
Black Hole ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Non Destructive ◽  
Black Hole Algorithm

Quantitative, zerstörungsfreie Feuchtemessung in Baustoffen vor Ort mit der Time Domain Reflectometry / Quantitative, non-destructive moisture measurement in building materials on site by time-domain re ectometry

1999 ◽  
Vol 5 (6) ◽  
pp. 609-618
Author(s):  
M. Stacheder ◽  
G. Grassegger ◽  
F. Grüner
Keyword(s):  
Time Domain ◽  
Building Materials ◽  
Salt Content ◽  
Time Domain Reflectometry ◽  
New Method ◽  
Measuring Methods ◽  
Surface Moisture ◽  
Non Destructive ◽  
Floor Cover

Abstract A new commercially available dielectric technique for the non-destructive determination of moisture in building materials based on the principle of 'time-domain reflectometry' (TDR) is presented. TDR measurements on samples of sandstone, brick, concrete and floor cover matched very well with results of conventional moisture measuring methods such as oven-drying or calciumcarbide-technique. The new method showed only a low influence of salt content or surface moisture of the material on the results.

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